skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:052920/0001   Pages: 262
Recorded: 06/11/2020
Attorney Dkt #:107980/17
Conveyance: RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Total properties: 2080
Page 15 of 21
Pages: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
1
Patent #:
Issue Dt:
10/30/2012
Application #:
13079486
Filing Dt:
04/04/2011
Publication #:
Pub Dt:
07/21/2011
Title:
TWO TERMINAL PROGRAMMABLE HOT CHANNEL ELECTRON NON-VOLATILE MEMORY
2
Patent #:
Issue Dt:
08/27/2013
Application #:
13079681
Filing Dt:
04/04/2011
Publication #:
Pub Dt:
05/17/2012
Title:
MEMS ACTUATOR ALIGNMENT
3
Patent #:
Issue Dt:
07/22/2014
Application #:
13080876
Filing Dt:
04/06/2011
Publication #:
Pub Dt:
06/21/2012
Title:
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS
4
Patent #:
Issue Dt:
10/14/2014
Application #:
13085126
Filing Dt:
04/12/2011
Publication #:
Pub Dt:
10/20/2011
Title:
STRUCTURE AND METHOD OF MAKING INTERCONNECT ELEMENT, AND MULTILAYER WIRING BOARD INCLUDING THE INTERCONNECT ELEMENT
5
Patent #:
Issue Dt:
04/23/2013
Application #:
13086645
Filing Dt:
04/14/2011
Publication #:
Pub Dt:
08/04/2011
Title:
EDGE CONNECT WAFER LEVEL STACKING
6
Patent #:
Issue Dt:
04/29/2014
Application #:
13091800
Filing Dt:
04/21/2011
Publication #:
Pub Dt:
10/25/2012
Title:
INTERPOSER HAVING MOLDED LOW CTE DIELECTRIC
7
Patent #:
Issue Dt:
09/23/2014
Application #:
13092376
Filing Dt:
04/22/2011
Publication #:
Pub Dt:
10/25/2012
Title:
MULTI-CHIP MODULE WITH STACKED FACE-DOWN CONNECTED DIES
8
Patent #:
Issue Dt:
03/10/2015
Application #:
13092495
Filing Dt:
04/22/2011
Publication #:
Pub Dt:
10/25/2012
Title:
VIAS IN POROUS SUBSTRATES
9
Patent #:
Issue Dt:
09/23/2014
Application #:
13097943
Filing Dt:
04/29/2011
Publication #:
Pub Dt:
11/01/2012
Title:
THREE-DIMENSIONAL SYSTEM-IN-A-PACKAGE
10
Patent #:
Issue Dt:
08/07/2012
Application #:
13102522
Filing Dt:
05/06/2011
Publication #:
Pub Dt:
08/25/2011
Title:
CIRCUIT AND TECHNIQUE FOR REDUCING PARITY BIT-WIDTHS FOR CHECK BIT AND SYNDROME GENERATION FOR DATA BLOCKS THROUGH THE USE OF ADDITIONAL CHECK BITS TO INCREASE THE NUMBER OF MINIMUM WEIGHTED CODES IN THE HAMMING CODE H-MATRIX
11
Patent #:
Issue Dt:
03/05/2013
Application #:
13102749
Filing Dt:
05/06/2011
Publication #:
Pub Dt:
09/01/2011
Title:
SEMICONDUCTOR DEVICE PROVIDING A FIRST ELECTRICAL CONDUCTOR AND A SECOND ELECTRICAL CONDUCTOR IN ONE THROUGH HOLE AND METHOD FOR MANUFACTURING THE SAME
12
Patent #:
Issue Dt:
05/12/2015
Application #:
13103809
Filing Dt:
05/09/2011
Publication #:
Pub Dt:
11/15/2012
Title:
ROOM CHARACTERIZATION AND CORRECTION FOR MULTI-CHANNEL AUDIO
13
Patent #:
Issue Dt:
10/06/2015
Application #:
13109996
Filing Dt:
05/17/2011
Publication #:
Pub Dt:
05/17/2012
Title:
ELECTRICAL CONNECTOR BETWEEN DIE PAD AND Z-INTERCONNECT FOR STACKED DIE ASSEMBLIES
14
Patent #:
Issue Dt:
01/08/2013
Application #:
13115318
Filing Dt:
05/25/2011
Publication #:
Pub Dt:
09/22/2011
Title:
METHOD OF FABRICATING STACKED PACKAGES WITH BRIDGING TRACES
15
Patent #:
Issue Dt:
03/12/2013
Application #:
13126286
Filing Dt:
04/27/2011
Publication #:
Pub Dt:
09/01/2011
Title:
THROUGH-SUBSTRATE VIA AND REDISTRIBUTION LAYER WITH METAL PASTE
16
Patent #:
Issue Dt:
09/03/2013
Application #:
13154778
Filing Dt:
06/07/2011
Publication #:
Pub Dt:
12/13/2012
Title:
CHIP WITH SINTERED CONNECTIONS TO PACKAGE
17
Patent #:
Issue Dt:
02/17/2015
Application #:
13155552
Filing Dt:
06/08/2011
Publication #:
Pub Dt:
12/13/2012
Title:
MICROELECTRONIC ASSEMBLY COMPRISING DIELECTRIC STRUCTURES WITH DIFFERENT YOUNG MODULUS AND HAVING REDUCED MECHANICAL STRESSES BETWEEN THE DEVICE TERMINALS AND EXTERNAL CONTACTS
18
Patent #:
Issue Dt:
11/18/2014
Application #:
13155719
Filing Dt:
06/08/2011
Publication #:
Pub Dt:
12/13/2012
Title:
FAN-OUT MICROELECTRONIC UNIT WLP HAVING INTERCONNECTS COMPRISING A MATRIX OF A HIGH MELTING POINT, A LOW MELTING POINT AND A POLYMER MATERIAL
19
Patent #:
Issue Dt:
12/10/2013
Application #:
13155825
Filing Dt:
06/08/2011
Publication #:
Pub Dt:
10/27/2011
Title:
METHOD OF MAKING A CONNECTION COMPONENT WITH POSTS AND PADS
20
Patent #:
Issue Dt:
11/11/2014
Application #:
13155845
Filing Dt:
06/08/2011
Publication #:
Pub Dt:
12/13/2012
Title:
SUBSTRATE AND ASSEMBLY THEREOF WITH DIELECTRIC REMOVAL FOR INCREASED POST HEIGHT
21
Patent #:
Issue Dt:
05/13/2014
Application #:
13156609
Filing Dt:
06/09/2011
Publication #:
Pub Dt:
12/13/2012
Title:
LOW-STRESS TSV DESIGN USING CONDUCTIVE PARTICLES
22
Patent #:
Issue Dt:
09/15/2015
Application #:
13157722
Filing Dt:
06/10/2011
Publication #:
Pub Dt:
06/21/2012
Title:
SEMICONDUCTOR CHIP ASSEMBLY AND METHOD FOR MAKING SAME
23
Patent #:
Issue Dt:
08/25/2015
Application #:
13158797
Filing Dt:
06/13/2011
Publication #:
Pub Dt:
12/13/2012
Title:
FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS
24
Patent #:
Issue Dt:
05/29/2012
Application #:
13159283
Filing Dt:
06/13/2011
Publication #:
Pub Dt:
11/10/2011
Title:
IMPULSE ACTUATED MEMS DEVICES
25
Patent #:
Issue Dt:
12/17/2013
Application #:
13164448
Filing Dt:
06/20/2011
Publication #:
Pub Dt:
12/20/2012
Title:
RELIABLE PACKAGING AND INTERCONNECT STRUCTURES
26
Patent #:
Issue Dt:
08/26/2014
Application #:
13165325
Filing Dt:
06/21/2011
Publication #:
Pub Dt:
12/27/2012
Title:
METHOD AND APPARATUS FOR IMPLEMENTING SIGNAL QUALITY METRICS AND ANTENNA DIVERSITY SWITCHING CONTROL
27
Patent #:
Issue Dt:
10/08/2013
Application #:
13167434
Filing Dt:
06/23/2011
Publication #:
Pub Dt:
12/29/2011
Title:
CAMERA MODULE WITH MEMS ACTUATOR AND METHOD FOR DRIVING THE SAME
28
Patent #:
Issue Dt:
04/08/2014
Application #:
13168675
Filing Dt:
06/24/2011
Publication #:
Pub Dt:
12/27/2012
Title:
RELIABLE WIRE STRUCTURE AND METHOD
29
Patent #:
Issue Dt:
05/20/2014
Application #:
13168839
Filing Dt:
06/24/2011
Publication #:
Pub Dt:
12/27/2012
Title:
SYSTEMS AND METHODS FOR PRODUCING FLAT SURFACES IN INTERCONNECT STRUCTURES
30
Patent #:
Issue Dt:
09/22/2015
Application #:
13170095
Filing Dt:
06/27/2011
Publication #:
Pub Dt:
12/27/2012
Title:
SINGLE EXPOSURE IN MULTI-DAMASCENE PROCESS
31
Patent #:
Issue Dt:
07/16/2013
Application #:
13171291
Filing Dt:
06/28/2011
Publication #:
Pub Dt:
10/20/2011
Title:
PLANAR FLEXURE SYSTEM WITH HIGH PITCH STIFFNESS
32
Patent #:
Issue Dt:
09/03/2013
Application #:
13173883
Filing Dt:
06/30/2011
Publication #:
Pub Dt:
01/03/2013
Title:
FLIP-CHIP QFN STRUCTURE USING ETCHED LEAD FRAME
33
Patent #:
Issue Dt:
04/30/2013
Application #:
13181006
Filing Dt:
07/12/2011
Publication #:
Pub Dt:
01/17/2013
Title:
STRUCTURES WITH THROUGH VIAS PASSING THROUGH A SUBSTRATE COMPRISING A PLANAR INSULATING LAYER BETWEEN SEMICONDUCTOR LAYERS
34
Patent #:
Issue Dt:
06/03/2014
Application #:
13182890
Filing Dt:
07/14/2011
Publication #:
Pub Dt:
07/19/2012
Title:
HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS
35
Patent #:
Issue Dt:
12/11/2012
Application #:
13183122
Filing Dt:
07/14/2011
Publication #:
Pub Dt:
11/03/2011
Title:
MICROELECTRONIC PACKAGES AND METHODS THEREFOR
36
Patent #:
Issue Dt:
09/01/2015
Application #:
13183870
Filing Dt:
07/15/2011
Publication #:
Pub Dt:
01/17/2013
Title:
Electrical Barrier Layers
37
Patent #:
Issue Dt:
04/25/2017
Application #:
13183920
Filing Dt:
07/15/2011
Publication #:
Pub Dt:
01/17/2013
Title:
CONNECTOR STRUCTURES AND METHODS
38
Patent #:
Issue Dt:
11/05/2013
Application #:
13187597
Filing Dt:
07/21/2011
Publication #:
Pub Dt:
11/10/2011
Title:
METHOD AND APPARATUS FOR STORE AND REPLAY FUNCTIONS IN A DIGITAL RADIO BROADCASTING RECEIVER
39
Patent #:
Issue Dt:
11/10/2015
Application #:
13189659
Filing Dt:
07/25/2011
Publication #:
Pub Dt:
01/31/2013
Title:
FM ANALOG DEMODULATOR COMPATIBLE WITH IBOC SIGNALS
40
Patent #:
Issue Dt:
08/26/2014
Application #:
13193814
Filing Dt:
07/29/2011
Publication #:
Pub Dt:
01/31/2013
Title:
LOW STRESS VIAS
41
Patent #:
Issue Dt:
05/27/2014
Application #:
13194669
Filing Dt:
07/29/2011
Publication #:
Pub Dt:
01/31/2013
Title:
SYSTEM AND METHOD FOR TESTING FUSE BLOW RELIABILITY FOR INTEGRATED CIRCUITS
42
Patent #:
Issue Dt:
03/03/2015
Application #:
13194754
Filing Dt:
07/29/2011
Publication #:
Pub Dt:
01/31/2013
Title:
EMBEDDED PASSIVE INTEGRATION
43
Patent #:
Issue Dt:
07/16/2013
Application #:
13195187
Filing Dt:
08/01/2011
Publication #:
Pub Dt:
02/07/2013
Title:
MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC ELEMENTS AND METHOD FOR MANUFACTURE THEREOF
44
Patent #:
Issue Dt:
12/31/2013
Application #:
13195786
Filing Dt:
08/01/2011
Publication #:
Pub Dt:
02/07/2013
Title:
PACKAGED MICROELECTRONIC ELEMENTS HAVING BLIND VIAS FOR HEAT DISSIPATION
45
Patent #:
Issue Dt:
04/02/2013
Application #:
13196192
Filing Dt:
08/02/2011
Publication #:
Pub Dt:
11/24/2011
Title:
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED INDUCTANCE
46
Patent #:
Issue Dt:
06/10/2014
Application #:
13197362
Filing Dt:
08/03/2011
Publication #:
Pub Dt:
11/24/2011
Title:
SYSTEM AND METHOD FOR ENHANCED STREAMING AUDIO
47
Patent #:
Issue Dt:
10/23/2012
Application #:
13204980
Filing Dt:
08/08/2011
Publication #:
Pub Dt:
12/01/2011
Title:
PACKAGE STACKING THROUGH ROTATION
48
Patent #:
Issue Dt:
09/24/2013
Application #:
13205162
Filing Dt:
08/08/2011
Publication #:
Pub Dt:
12/01/2011
Title:
MICROELECTRONIC PACKAGES HAVING CAVITIES FOR RECEIVING MICROELECTRONIC ELEMENTS
49
Patent #:
Issue Dt:
09/03/2013
Application #:
13208822
Filing Dt:
08/12/2011
Publication #:
Pub Dt:
02/14/2013
Title:
AREA ARRAY QUAD FLAT NO-LEAD (QFN) PACKAGE
50
Patent #:
Issue Dt:
10/29/2013
Application #:
13209596
Filing Dt:
08/15/2011
Publication #:
Pub Dt:
02/21/2013
Title:
MULTIPLE DIE IN A FACE DOWN PACKAGE
51
Patent #:
Issue Dt:
03/24/2015
Application #:
13215725
Filing Dt:
08/23/2011
Publication #:
Pub Dt:
02/28/2013
Title:
INTERCONNECTION ELEMENTS WITH ENCASED INTERCONNECTS
52
Patent #:
Issue Dt:
09/29/2015
Application #:
13216225
Filing Dt:
08/23/2011
Publication #:
Pub Dt:
12/11/2014
Title:
INTEGRATED LENS BARREL
53
Patent #:
Issue Dt:
10/28/2014
Application #:
13216465
Filing Dt:
08/24/2011
Publication #:
Pub Dt:
02/28/2013
Title:
THROUGH INTERPOSER WIRE BOND USING LOW CTE INTERPOSER WITH COARSE SLOT APERTURES
54
Patent #:
Issue Dt:
02/24/2015
Application #:
13216918
Filing Dt:
08/24/2011
Publication #:
Pub Dt:
02/28/2013
Title:
LOW COST HYBRID HIGH DENSITY PACKAGE
55
Patent #:
Issue Dt:
01/01/2013
Application #:
13225257
Filing Dt:
09/02/2011
Publication #:
Pub Dt:
12/29/2011
Title:
AUTOFOCUS CAMERA SYSTEMS AND METHODS
56
Patent #:
Issue Dt:
07/12/2016
Application #:
13228272
Filing Dt:
09/08/2011
Publication #:
Pub Dt:
03/15/2012
Title:
DYNAMIC COMPENSATION OF AUDIO SIGNALS FOR IMPROVED PERCEIVED SPECTRAL IMBALANCES
57
Patent #:
Issue Dt:
05/26/2015
Application #:
13228336
Filing Dt:
09/08/2011
Publication #:
Pub Dt:
04/05/2012
Title:
SPATIAL AUDIO ENCODING AND REPRODUCTION OF DIFFUSE SOUND
58
Patent #:
Issue Dt:
07/15/2014
Application #:
13232436
Filing Dt:
09/14/2011
Publication #:
Pub Dt:
03/14/2013
Title:
LOW CTE INTERPOSER
59
Patent #:
Issue Dt:
09/09/2014
Application #:
13243877
Filing Dt:
09/23/2011
Publication #:
Pub Dt:
10/04/2012
Title:
SEMICONDUCTOR DIE HAVING FINE PITCH ELECTRICAL INTERCONNECTS
60
Patent #:
Issue Dt:
01/05/2016
Application #:
13244043
Filing Dt:
09/23/2011
Publication #:
Pub Dt:
01/19/2012
Title:
SYSTEMS AND METHODS FOR AUDIO PROCESSING
61
Patent #:
Issue Dt:
11/18/2014
Application #:
13246242
Filing Dt:
09/27/2011
Publication #:
Pub Dt:
01/19/2012
Title:
STACKED MICROELECTRONIC PACKAGES HAVING AT LEAST TWO STACKED MICROELECTRONIC ELEMENTS ADJACENT ONE ANOTHER
62
Patent #:
Issue Dt:
05/24/2016
Application #:
13247847
Filing Dt:
09/28/2011
Publication #:
Pub Dt:
03/28/2013
Title:
CASCADED ELECTROSTATIC ACTUATOR
63
Patent #:
Issue Dt:
12/31/2013
Application #:
13247869
Filing Dt:
09/28/2011
Publication #:
Pub Dt:
03/28/2013
Title:
ROTATIONALLY DEPLOYED ACTUATOR DEVICES
64
Patent #:
Issue Dt:
01/27/2015
Application #:
13247888
Filing Dt:
09/28/2011
Publication #:
Pub Dt:
04/05/2012
Title:
MEMS ACTUATOR DEVICE DEPLOYMENT
65
Patent #:
Issue Dt:
04/28/2015
Application #:
13247895
Filing Dt:
09/28/2011
Publication #:
Pub Dt:
03/28/2013
Title:
OPTICAL IMAGE STABILIZATION USING TANGENTIALLY ACTUATED MEMS DEVICES
66
Patent #:
Issue Dt:
07/01/2014
Application #:
13247898
Filing Dt:
09/28/2011
Publication #:
Pub Dt:
03/28/2013
Title:
MULTIPLE DEGREE OF FREEDOM ACTUATOR
67
Patent #:
Issue Dt:
03/08/2016
Application #:
13247902
Filing Dt:
09/28/2011
Publication #:
Pub Dt:
03/28/2013
Title:
ROW AND COLUMN ACTUATOR CONTROL
68
Patent #:
Issue Dt:
10/07/2014
Application #:
13247906
Filing Dt:
09/28/2011
Publication #:
Pub Dt:
03/28/2013
Title:
MEMS-BASED OPTICAL IMAGE STABILIZATION
69
Patent #:
Issue Dt:
10/07/2014
Application #:
13247919
Filing Dt:
09/28/2011
Publication #:
Pub Dt:
03/28/2013
Title:
ELECTROSTATIC ACTUATOR CONTROL
70
Patent #:
Issue Dt:
10/28/2014
Application #:
13247925
Filing Dt:
09/28/2011
Publication #:
Pub Dt:
03/28/2013
Title:
MEMS ACTUATOR/SENSOR
71
Patent #:
Issue Dt:
10/29/2013
Application #:
13247938
Filing Dt:
09/28/2011
Publication #:
Pub Dt:
03/28/2013
Title:
SURFACE MOUNT ACTUATOR
72
Patent #:
Issue Dt:
08/20/2013
Application #:
13274815
Filing Dt:
10/17/2011
Publication #:
Pub Dt:
02/09/2012
Title:
STACKED ASSEMBLY INCLUDING PLURALITY OF STACKED MICROELECTRONIC ELEMENTS
73
Patent #:
Issue Dt:
05/13/2014
Application #:
13277330
Filing Dt:
10/20/2011
Publication #:
Pub Dt:
04/25/2013
Title:
MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC UNITS AND METHOD FOR MANUFACTURE THEREOF
74
Patent #:
Issue Dt:
02/25/2014
Application #:
13277978
Filing Dt:
10/20/2011
Publication #:
Pub Dt:
04/26/2012
Title:
STEREO IMAGE WIDENING SYSTEM
75
Patent #:
Issue Dt:
06/18/2013
Application #:
13278506
Filing Dt:
10/21/2011
Publication #:
Pub Dt:
06/21/2012
Title:
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED GROUND OR POWER DISTRIBUTION
76
Patent #:
Issue Dt:
11/11/2014
Application #:
13278514
Filing Dt:
10/21/2011
Publication #:
Pub Dt:
06/21/2012
Title:
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED GROUND OR POWER DISTRIBUTION
77
Patent #:
Issue Dt:
01/05/2016
Application #:
13284783
Filing Dt:
10/28/2011
Publication #:
Pub Dt:
05/02/2013
Title:
NON-VOLATILE MEMORY DEVICES HAVING VERTICAL DRAIN TO GATE CAPACITIVE COUPLING
78
Patent #:
Issue Dt:
10/28/2014
Application #:
13284795
Filing Dt:
10/28/2011
Publication #:
Pub Dt:
05/02/2013
Title:
COMMON DOPED REGION WITH SEPARATE GATE CONTROL FOR A LOGIC COMPATIBLE NON-VOLATILE MEMORY CELL
79
Patent #:
Issue Dt:
08/13/2013
Application #:
13286082
Filing Dt:
10/31/2011
Title:
MULTI-CHANNEL AUDIO ENHANCEMENT SYSTEM
80
Patent #:
Issue Dt:
04/08/2014
Application #:
13287237
Filing Dt:
11/02/2011
Publication #:
Pub Dt:
02/21/2013
Title:
POWER BOOSTING CIRCUIT FOR SEMICONDUCTOR PACKAGING
81
Patent #:
Issue Dt:
04/15/2014
Application #:
13291297
Filing Dt:
11/08/2011
Publication #:
Pub Dt:
02/28/2013
Title:
DRAM SECURITY ERASE
82
Patent #:
Issue Dt:
07/22/2014
Application #:
13293698
Filing Dt:
11/10/2011
Publication #:
Pub Dt:
05/16/2013
Title:
HIGH STRENGTH THROUGH-SUBSTRATE VIAS
83
Patent #:
Issue Dt:
01/07/2014
Application #:
13294226
Filing Dt:
11/11/2011
Publication #:
Pub Dt:
05/16/2013
Title:
CHIPS WITH HIGH FRACTURE TOUGHNESS THROUGH A METAL RING
84
Patent #:
Issue Dt:
01/28/2014
Application #:
13295608
Filing Dt:
11/14/2011
Publication #:
Pub Dt:
05/17/2012
Title:
MICROELECTRONIC PACKAGE WITH TERMINALS ON DIELECTRIC MASS
85
Patent #:
Issue Dt:
12/23/2014
Application #:
13296785
Filing Dt:
11/15/2011
Publication #:
Pub Dt:
05/16/2013
Title:
CAVITIES CONTAINING MULTI-WIRING STRUCTURES AND DEVICES
86
Patent #:
Issue Dt:
12/16/2014
Application #:
13299672
Filing Dt:
11/18/2011
Publication #:
Pub Dt:
05/23/2013
Title:
FRONT FACING PIGGYBACK WAFER ASSEMBLY
87
Patent #:
Issue Dt:
03/22/2016
Application #:
13299714
Filing Dt:
11/18/2011
Publication #:
Pub Dt:
05/23/2013
Title:
INVERTED OPTICAL DEVICE
88
Patent #:
Issue Dt:
05/22/2012
Application #:
13302310
Filing Dt:
11/22/2011
Publication #:
Pub Dt:
03/15/2012
Title:
LENS BARREL ASSEMBLY FOR A CAMERA
89
Patent #:
Issue Dt:
08/06/2013
Application #:
13306068
Filing Dt:
11/29/2011
Publication #:
Pub Dt:
01/17/2013
Title:
DE-SKEWED MULTI-DIE PACKAGES
90
Patent #:
Issue Dt:
01/06/2015
Application #:
13306099
Filing Dt:
11/29/2011
Publication #:
Pub Dt:
10/25/2012
Title:
FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
91
Patent #:
Issue Dt:
11/06/2012
Application #:
13306182
Filing Dt:
11/29/2011
Publication #:
Pub Dt:
10/25/2012
Title:
FLIP-CHIP, FACE-UP AND FACE-DOWN WIREBOND COMBINATION PACKAGE
92
Patent #:
Issue Dt:
01/21/2014
Application #:
13306203
Filing Dt:
11/29/2011
Publication #:
Pub Dt:
10/25/2012
Title:
STACKED CHIP-ON-BOARD MODULE WITH EDGE CONNECTOR
93
Patent #:
Issue Dt:
12/25/2012
Application #:
13306300
Filing Dt:
11/29/2011
Publication #:
Pub Dt:
10/25/2012
Title:
MULTIPLE DIE FACE-DOWN STACKING FOR TWO OR MORE DIE
94
Patent #:
Issue Dt:
01/28/2014
Application #:
13307395
Filing Dt:
11/30/2011
Publication #:
Pub Dt:
05/30/2013
Title:
FLIP CHIP PACKAGE FOR DRAM WITH TWO UNDERFILL MATERIALS
95
Patent #:
Issue Dt:
12/09/2014
Application #:
13308038
Filing Dt:
11/30/2011
Publication #:
Pub Dt:
03/29/2012
Title:
SEMICONDUCTOR DEVICE
96
Patent #:
Issue Dt:
01/21/2014
Application #:
13313792
Filing Dt:
12/07/2011
Title:
DATA INVERSION REGISTER TECHNIQUE FOR INTEGRATED CIRCUIT MEMORY TESTING
97
Patent #:
Issue Dt:
07/02/2013
Application #:
13316890
Filing Dt:
12/12/2011
Publication #:
Pub Dt:
04/05/2012
Title:
OFF-CHIP VIAS IN STACKED CHIPS
98
Patent #:
Issue Dt:
06/24/2014
Application #:
13335022
Filing Dt:
12/22/2011
Publication #:
Pub Dt:
04/19/2012
Title:
MICROELECTRONIC ASSEMBLIES HAVING COMPLIANCY AND METHODS THEREFOR
99
Patent #:
Issue Dt:
05/07/2013
Application #:
13337565
Filing Dt:
12/27/2011
Publication #:
Pub Dt:
04/04/2013
Title:
STUB MINIMIZATION FOR MULTI-DIE WIREBOND ASSEMBLIES WITH PARALLEL WINDOWS
100
Patent #:
Issue Dt:
01/01/2013
Application #:
13337575
Filing Dt:
12/27/2011
Title:
STUB MINIMIZATION FOR MULTI-DIE WIREBOND ASSEMBLIES WITH PARALLEL WINDOWS
Assignor
1
Exec Dt:
06/01/2020
Assignees
1
3025 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
2
3025 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
3
3025 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
4
3025 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
5
3025 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
6
5220 LAS VIRGENES ROAD
CALABASAS, CALIFORNIA 91302
7
5220 LAS VIRGENES ROAD
CALABASAS, CALIFORNIA 91302
8
16255 VENTURA BLVD.
SUITE 310
ENCINO, CALIFORNIA 91436
9
6711 COLUMBIA GATEWAY
SUITE 500
COLUMBIA, MARYLAND 21046
Correspondence name and address
SKADDEN, ARPS, SLATE, MEAGHER & FLOM LLP
ONE MANHATTAN WEST
MONIQUE L. RIBANDO
NEW YORK, NY 10001-8602

Search Results as of: 05/29/2024 03:21 AM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT