|
|
Patent #:
|
|
Issue Dt:
|
11/27/2001
|
Application #:
|
09267228
|
Filing Dt:
|
03/12/1999
|
Title:
|
HIGH-SPEED READ-WRITE CIRCUITRY FOR SEMI-CONDUCTOR MEMORY
|
|
|
Patent #:
|
|
Issue Dt:
|
01/23/2001
|
Application #:
|
09268259
|
Filing Dt:
|
03/15/1999
|
Title:
|
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES WITH "CHIP SIZE PACKAGE"
|
|
|
Patent #:
|
|
Issue Dt:
|
04/03/2001
|
Application #:
|
09270685
|
Filing Dt:
|
03/16/1999
|
Title:
|
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND PROCESS FORMANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
07/03/2001
|
Application #:
|
09270988
|
Filing Dt:
|
03/17/1999
|
Title:
|
SOLDER BALL PLACEMENT FIXTURES AND METHODS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/06/2002
|
Application #:
|
09271688
|
Filing Dt:
|
03/18/1999
|
Title:
|
MULTI-LAYER SUBSTRATES AND FABRICATION PROCESSES
|
|
|
Patent #:
|
|
Issue Dt:
|
10/22/2002
|
Application #:
|
09275037
|
Filing Dt:
|
03/24/1999
|
Title:
|
SEMICONDUCTOR DEVICE HAVING A PROTECTIVE CIRCUIT
|
|
|
Patent #:
|
|
Issue Dt:
|
11/27/2001
|
Application #:
|
09275370
|
Filing Dt:
|
03/24/1999
|
Title:
|
DATA CARRIER HAVING AN IMPLANTED MODULE BASED ON A METAL LEAD FRAME
|
|
|
Patent #:
|
|
Issue Dt:
|
12/11/2001
|
Application #:
|
09277677
|
Filing Dt:
|
03/26/1999
|
Title:
|
COMPONENTS WITH CONDUCTIVE SOLDER MASK LAYERS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/27/2001
|
Application #:
|
09284614
|
Filing Dt:
|
06/24/1999
|
Title:
|
MEMORY MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2002
|
Application #:
|
09287370
|
Filing Dt:
|
04/07/1999
|
Title:
|
HYBRID MOLDS FOR MOLTEN SOLDER SCREENING PROCESS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/18/2002
|
Application #:
|
09289846
|
Filing Dt:
|
04/12/1999
|
Title:
|
RADIO DEVICE INCLUDING A RECEIVER AND METHOD OF ADJUSTING ONE OF THE HIGH-FREQUENCY AMPLIFIER STAGES OF A RECEIVER
|
|
|
Patent #:
|
|
Issue Dt:
|
03/06/2001
|
Application #:
|
09292640
|
Filing Dt:
|
04/15/1999
|
Title:
|
LAMINATION MACHINE & METHOD TO LAMINATE A COVERLAY TO A MICROELECTRONIC PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/09/2001
|
Application #:
|
09293005
|
Filing Dt:
|
04/16/1999
|
Title:
|
METHODS OF MAKING COMPLIANT INTERFACES AND MICROELECTRONIC PACKAGES USING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
06/24/2003
|
Application #:
|
09300783
|
Filing Dt:
|
04/27/1999
|
Publication #:
|
|
Pub Dt:
|
04/25/2002
| | | | |
Title:
|
METHOD OF REFORMING REFORMABLE MEMBERS OF AN ELECTRONIC PACKAGE AND THE RESULTANT ELECTRONIC PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/29/2002
|
Application #:
|
09301890
|
Filing Dt:
|
04/29/1999
|
Title:
|
METHOD FOR DIRECT CHIP ATTACH BY SOLDER BUMPS AND AN UNDERFILL LAYER
|
|
|
Patent #:
|
|
Issue Dt:
|
10/30/2001
|
Application #:
|
09303830
|
Filing Dt:
|
05/03/1999
|
Title:
|
METHOD OF MAKING SHALLOW JUNCTION SEMICONDUCTOR DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
05/07/2002
|
Application #:
|
09304605
|
Filing Dt:
|
05/04/1999
|
Title:
|
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
06/05/2001
|
Application #:
|
09311149
|
Filing Dt:
|
05/13/1999
|
Title:
|
SELF- ALIGNED SYMMETRIC INTRINSIC DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/30/2001
|
Application #:
|
09313402
|
Filing Dt:
|
05/18/1999
|
Title:
|
MICROELECTRONIC COMPONENTS WITH FRANGIBLE LEAD SECTIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/17/2000
|
Application #:
|
09314003
|
Filing Dt:
|
05/19/1999
|
Title:
|
ROBUST INTERCONNECT STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/11/2001
|
Application #:
|
09315122
|
Filing Dt:
|
05/19/1999
|
Title:
|
PLASMA PROCESSING METHODS AND APPARATUS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/25/2002
|
Application #:
|
09315596
|
Filing Dt:
|
05/20/1999
|
Title:
|
SEMICONDUCTOR BLOCKING LAYER FOR PREVENTING UV RADIATION DAMAGE TO MOS GATE OXIDES
|
|
|
Patent #:
|
|
Issue Dt:
|
03/26/2002
|
Application #:
|
09317675
|
Filing Dt:
|
05/24/1999
|
Title:
|
MICROELECTRONIC UNIT FORMING METHODS AND MATERIALS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/01/2002
|
Application #:
|
09319044
|
Filing Dt:
|
07/30/1999
|
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/09/2001
|
Application #:
|
09322217
|
Filing Dt:
|
05/28/1999
|
Title:
|
METHOD FOR CREATING A DIE SHRINK INSENSITIVE SEMICONDUCTOR PACKAGE AND COMPONENT THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
04/17/2001
|
Application #:
|
09325262
|
Filing Dt:
|
06/03/1999
|
Title:
|
MICROELECTRONIC COMPONENTS WITH FRANGIBLE LEAD SECTIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/01/2003
|
Application #:
|
09330198
|
Filing Dt:
|
06/11/1999
|
Publication #:
|
|
Pub Dt:
|
05/23/2002
| | | | |
Title:
|
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
11/14/2000
|
Application #:
|
09332757
|
Filing Dt:
|
06/14/1999
|
Title:
|
ON-CHIP WORD LINE VOLTAGE GENERATION FOR DRAM EMBEDDED IN LOGIC PROCESS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/10/2000
|
Application #:
|
09332970
|
Filing Dt:
|
06/15/1999
|
Title:
|
PLASTIC ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
05/01/2001
|
Application #:
|
09337405
|
Filing Dt:
|
06/21/1999
|
Title:
|
SOUND QUALITY OF ESTABLISHED LOW BIT-RATE AUDIO CODING SYSTEMS WITHOUT LOSS OF DECODER COMPATIBILITY
|
|
|
Patent #:
|
|
Issue Dt:
|
03/11/2003
|
Application #:
|
09339362
|
Filing Dt:
|
06/24/1999
|
Title:
|
METHOD FOR ESTIMATING SIGNAL-TO-NOISE RATIO OF DIGITAL CARRIERS IN AN AM COMPATIBLE DIGITAL AUDIO BROADCASTING SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
04/29/2003
|
Application #:
|
09339363
|
Filing Dt:
|
06/24/1999
|
Title:
|
METHOD AND APPARATUS FOR DETERMINING TRANSMISSION MODE AND SYNCHRONIZATION FOR A DIGITAL AUDIO BROADCASTING SIGNAL
|
|
|
Patent #:
|
|
Issue Dt:
|
05/09/2000
|
Application #:
|
09339683
|
Filing Dt:
|
06/24/1999
|
Title:
|
SOLID STATE IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
06/04/2002
|
Application #:
|
09339745
|
Filing Dt:
|
06/24/1999
|
Title:
|
METHOD AND APPARATUS FOR TRAINING SEQUENCE IDENTIFICATION IN AN AM COMPATIBLE DIGITAL AUDIO BROADCASTING SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
12/17/2002
|
Application #:
|
09342239
|
Filing Dt:
|
06/29/1999
|
Title:
|
A SEMICONDUCTOR DEVICE AND METHOD FOR PATTERNING THE SEMICONDUCTOR DEVICE IN WHICH LINE PATTERNS TERMINATE AT DIFFERENT LENGTHS TO PREVENT THE OCCURRENCE OF A SHORT OR BREAK
|
|
|
Patent #:
|
|
Issue Dt:
|
10/03/2000
|
Application #:
|
09344178
|
Filing Dt:
|
06/24/1999
|
Title:
|
SINGLE REFERENCE PlANE PLASTIC BALL GRID ARRAY PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/03/2002
|
Application #:
|
09347580
|
Filing Dt:
|
07/01/1999
|
Title:
|
WIRE BONDING METHOD AND APPARATUS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/16/2004
|
Application #:
|
09351053
|
Filing Dt:
|
07/12/1999
|
Publication #:
|
|
Pub Dt:
|
12/13/2001
| | | | |
Title:
|
BUFFERING SYSTEM BUS FOR EXTERNAL-MEMORY ACCESS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/08/2000
|
Application #:
|
09356364
|
Filing Dt:
|
07/19/1999
|
Title:
|
SEMICONDUCTOR MEMORY DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/03/2000
|
Application #:
|
09363496
|
Filing Dt:
|
07/29/1999
|
Title:
|
LIDLESS SOCKET AND METHOD OF MAKING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
10/10/2000
|
Application #:
|
09365683
|
Filing Dt:
|
08/02/1999
|
Title:
|
NICKEL ALLOY FILMS FOR REDUCED INTERMETALLIC FORMATION IN SOLDER
|
|
|
Patent #:
|
|
Issue Dt:
|
06/19/2001
|
Application #:
|
09374394
|
Filing Dt:
|
08/13/1999
|
Title:
|
METAL-JACKETED LEAD MANUFACTURING PROCESS USING RESIST LAYERS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/16/2002
|
Application #:
|
09375572
|
Filing Dt:
|
08/16/1999
|
Title:
|
BONDABLE COMPLIANT PADS FOR PACKAGING OF A SEMICONDUCTOR CHIP AND METHOD THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
03/12/2002
|
Application #:
|
09379309
|
Filing Dt:
|
08/23/1999
|
Title:
|
PLACEMENT SYSTEM APPARATUS AND METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
10/03/2000
|
Application #:
|
09379780
|
Filing Dt:
|
08/24/1999
|
Title:
|
METHOD AND APPRATUS FOR REDUCING PEAK TO AVERAGE POWER RATIO IN DIGITAL BROADCASTING SYSTEMS
|
|
|
Patent #:
|
|
Issue Dt:
|
05/31/2005
|
Application #:
|
09380312
|
Filing Dt:
|
08/31/1999
|
Title:
|
RESIN MOLDED TYPE SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
04/13/2004
|
Application #:
|
09382716
|
Filing Dt:
|
08/24/1999
|
Title:
|
METHOD AND APPARATUS FOR TRANSMISSION AND RECEPTION OF COMPRESSED AUDIO FRAMES WITH PRIORITIZED MESSAGES FOR DIGITAL AUDIO BROADCASTING
|
|
|
Patent #:
|
|
Issue Dt:
|
03/27/2001
|
Application #:
|
09385320
|
Filing Dt:
|
08/30/1999
|
Title:
|
MICROELECTRONIC MOUNTING WITH MULTIPLE LEAD DEFORMATION USING RESTRAINING STRAPS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/09/2002
|
Application #:
|
09387500
|
Filing Dt:
|
09/01/1999
|
Publication #:
|
|
Pub Dt:
|
02/07/2002
| | | | |
Title:
|
METHOD FOR MANUFACTURING A FIELD EFFECT TRANSISTOR
|
|
|
Patent #:
|
|
Issue Dt:
|
08/22/2000
|
Application #:
|
09387880
|
Filing Dt:
|
09/01/1999
|
Title:
|
COMPLIANT WIREBOND PACKAGES HAVING WIRE LOOP
|
|
|
Patent #:
|
|
Issue Dt:
|
07/23/2002
|
Application #:
|
09388485
|
Filing Dt:
|
09/02/1999
|
Title:
|
SUBSTRATE-CLEANING METHOD AND SUBSTRATE-CLEANING SOLUTION
|
|
|
Patent #:
|
|
Issue Dt:
|
08/28/2001
|
Application #:
|
09388753
|
Filing Dt:
|
09/02/1999
|
Title:
|
SUBSTRATE STRUCTURE FOR IMPROVING ATTACHMENT RELIABILITY OF SEMICONDUCTOR CHIPS AND MODULES
|
|
|
Patent #:
|
|
Issue Dt:
|
06/26/2001
|
Application #:
|
09388755
|
Filing Dt:
|
09/02/1999
|
Title:
|
METHOD FOR IMPROVING ATTACHMENT RELIABILITY OF SEMICONDUCTOR CHIPS AND MODULES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/13/2002
|
Application #:
|
09393686
|
Filing Dt:
|
09/10/1999
|
Title:
|
CLEANING METHOD FOR SEMICONDUCTOR SUBSTRATE AND CLEANING SOLUTION
|
|
|
Patent #:
|
|
Issue Dt:
|
10/23/2001
|
Application #:
|
09395105
|
Filing Dt:
|
09/14/1999
|
Title:
|
MICROELECTRONIC ASSEMBLY FABRICATION WITH TERMINAL FORMATION FROM A CONDUCTIVE LAYER
|
|
|
Patent #:
|
|
Issue Dt:
|
10/23/2001
|
Application #:
|
09396048
|
Filing Dt:
|
09/15/1999
|
Title:
|
CONNECTION COMPONENT AND METHOD OF MAKING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
04/09/2002
|
Application #:
|
09399209
|
Filing Dt:
|
09/17/1999
|
Title:
|
COMPLIANT MICROELECTRONIC MOUNTING DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/08/2002
|
Application #:
|
09402078
|
Filing Dt:
|
02/07/2000
|
Title:
|
NON-VOLATILE SEMICONDUCTOR MEMORY AND METHOD FOR MAKING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
07/23/2002
|
Application #:
|
09407412
|
Filing Dt:
|
09/29/1999
|
Title:
|
PROGRAMMABLE MOVING INVERSION SEQUENCER FOR MEMORY BIST ADDRESS GENERATION
|
|
|
Patent #:
|
|
Issue Dt:
|
01/10/2006
|
Application #:
|
09410054
|
Filing Dt:
|
10/01/1999
|
Title:
|
THREE DIMENSIONAL DEVICE INTERGRATION METHOD AND INTEGRATED DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/24/2002
|
Application #:
|
09410549
|
Filing Dt:
|
10/01/1999
|
Title:
|
METHOD AND SYSTEM FOR SELECTING AND USING SOURCE OPERANDS IN COMPUTER SYSTEM INSTRUCTIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/18/2006
|
Application #:
|
09411143
|
Filing Dt:
|
10/04/1999
|
Title:
|
ACOUSTIC CORRECTION APPARATUS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/27/2001
|
Application #:
|
09413410
|
Filing Dt:
|
10/06/1999
|
Title:
|
MICROELECTRONIC COMPONENT WITH RIGID INTERPOSER
|
|
|
Patent #:
|
|
Issue Dt:
|
10/30/2001
|
Application #:
|
09419881
|
Filing Dt:
|
10/18/1999
|
Title:
|
SEQUENTIAL ELECTRODEPOSITION OF METALS USING MODULATED ELECTRIC FIELDS FOR MANUFACTURE OF CIRCUIT BOARDS HAVING FEATURES OF DIFFERENT SIZES
|
|
|
Patent #:
|
|
Issue Dt:
|
05/01/2001
|
Application #:
|
09426919
|
Filing Dt:
|
10/26/1999
|
Title:
|
DIFFERENTIAL SENSE AMPLIFIER WITH VOLTAGE MARGIN ENHANCEMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
11/13/2001
|
Application #:
|
09427583
|
Filing Dt:
|
10/27/1999
|
Title:
|
PACKAGE CONSTRUCTION OF SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/24/2001
|
Application #:
|
09428158
|
Filing Dt:
|
10/27/1999
|
Title:
|
FABRICATION OF DEFORMABLE LEADS OF MICROELECTRONIC ELEMENTS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/27/2001
|
Application #:
|
09432216
|
Filing Dt:
|
11/03/1999
|
Title:
|
LEADFRAME FOR USE IN MANUFACTURING A RESIN-MOLDED SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/16/2005
|
Application #:
|
09432917
|
Filing Dt:
|
11/02/1999
|
Title:
|
SYSTEM AND METHOD FOR PROVIDING INTERACTIVE AUDIO IN A MULTI-CHANNEL AUDIO ENVIRONMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
08/10/2004
|
Application #:
|
09438037
|
Filing Dt:
|
11/10/1999
|
Title:
|
PARTIALLY CAPTURED ORIENTED INTERCONNECTIONS FOR BGA PACKAGES AND A METHOD OF FORMING THE INTERCONNECTIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/15/2003
|
Application #:
|
09438148
|
Filing Dt:
|
11/10/1999
|
Title:
|
METHOD AND APPARATUS FOR TRANSMISSION AND RECEPTION OF FM IN-BAND ON-CHANNEL DIGITAL AUDIO BROADCASTING
|
|
|
Patent #:
|
|
Issue Dt:
|
02/18/2003
|
Application #:
|
09438822
|
Filing Dt:
|
11/11/1999
|
Title:
|
METHOD AND APPARATUS FOR FORWARD ERROR CORRECTION CODING FOR AN AM IN-BAND ON-CHANNEL DIGITAL AUDIO BROADCASTING SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
08/13/2002
|
Application #:
|
09448979
|
Filing Dt:
|
11/24/1999
|
Title:
|
METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/09/2001
|
Application #:
|
09449996
|
Filing Dt:
|
11/26/1999
|
Title:
|
DC GAIN ENHANCEMENT FOR OPERATIONAL AMPLIFIERS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/27/2001
|
Application #:
|
09456225
|
Filing Dt:
|
12/06/1999
|
Title:
|
PACKAGING OF INTEGRATED CIRCUITS AND VERTICAL INTEGRATION
|
|
|
Patent #:
|
|
Issue Dt:
|
10/28/2003
|
Application #:
|
09466535
|
Filing Dt:
|
12/17/1999
|
Publication #:
|
|
Pub Dt:
|
05/30/2002
| | | | |
Title:
|
INTEGRATED CIRCUITS AND METHODS FOR THEIR FABRICATION
|
|
|
Patent #:
|
|
Issue Dt:
|
08/31/2004
|
Application #:
|
09466895
|
Filing Dt:
|
12/20/1999
|
Title:
|
METHOD FOR FABRICATING A WIRING SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/08/2003
|
Application #:
|
09471760
|
Filing Dt:
|
12/23/1999
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
07/17/2001
|
Application #:
|
09471973
|
Filing Dt:
|
12/23/1999
|
Title:
|
COMPONENTS WITH RELEASABLE LEADS AND METHODS OF MAKING RELEASABLE LEADS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/17/2001
|
Application #:
|
09472384
|
Filing Dt:
|
12/23/1999
|
Title:
|
PAD METALLIZATION OVER ACTIVE CIRCUITRY
|
|
|
Patent #:
|
|
Issue Dt:
|
08/07/2001
|
Application #:
|
09476780
|
Filing Dt:
|
12/30/1999
|
Publication #:
|
|
Pub Dt:
|
06/07/2001
| | | | |
Title:
|
SEMICONDUCTOR DEVICE WITH HIGH GETTERING CAPABILITY TO IMPURITY PRESENT IN SEMICONDUCTOR LAYER OF SOI SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/20/2002
|
Application #:
|
09476781
|
Filing Dt:
|
12/30/1999
|
Title:
|
CAPACITIVE ELEMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
12/11/2001
|
Application #:
|
09476958
|
Filing Dt:
|
01/03/2000
|
Title:
|
MULTIPLE ROW WIRE BONDING WITH BALL BONDS OF OUTER BOND PADS BONDED ON THE LEADS
|
|
|
Patent #:
|
|
Issue Dt:
|
12/11/2001
|
Application #:
|
09479592
|
Filing Dt:
|
01/07/2000
|
Title:
|
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND PROCESS FOR MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
09/25/2001
|
Application #:
|
09481885
|
Filing Dt:
|
01/12/2000
|
Title:
|
Semiconductor device and fabrication process thereof
|
|
|
Patent #:
|
|
Issue Dt:
|
04/16/2002
|
Application #:
|
09489332
|
Filing Dt:
|
01/21/2000
|
Title:
|
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
09/02/2003
|
Application #:
|
09493280
|
Filing Dt:
|
01/28/2000
|
Title:
|
SEMICONDUCTOR INTEGRATED CIRCUIT AND NONVOLATILE MEMORY ELEMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
10/09/2001
|
Application #:
|
09494785
|
Filing Dt:
|
01/31/2000
|
Title:
|
SEMICONDUCTOR DEVICE WITH ELECTRICAL ISOLATION MEANS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/12/2002
|
Application #:
|
09500238
|
Filing Dt:
|
02/08/2000
|
Title:
|
POLISHING METHOD AND APPARATUS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/31/2001
|
Application #:
|
09500242
|
Filing Dt:
|
02/08/2000
|
Title:
|
1Semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer and method of fabrication thereof
|
|
|
Patent #:
|
|
Issue Dt:
|
11/14/2000
|
Application #:
|
09500364
|
Filing Dt:
|
02/08/2000
|
Title:
|
Compliant multichip package
|
|
|
Patent #:
|
|
Issue Dt:
|
04/24/2001
|
Application #:
|
09504991
|
Filing Dt:
|
02/15/2000
|
Title:
|
Method for eliminating stress induced dislocations in cmos devices
|
|
|
Patent #:
|
|
Issue Dt:
|
06/07/2005
|
Application #:
|
09505283
|
Filing Dt:
|
02/16/2000
|
Title:
|
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/20/2001
|
Application #:
|
09505609
|
Filing Dt:
|
02/17/2000
|
Title:
|
Method of assembling a semiconductor chip package
|
|
|
Patent #:
|
|
Issue Dt:
|
03/01/2005
|
Application #:
|
09505985
|
Filing Dt:
|
02/16/2000
|
Title:
|
SYSTEM AND METHOD FOR ELIMINATING WRITE BACK TO REGISTER USING DEAD FIELD INDICATOR
|
|
|
Patent #:
|
|
Issue Dt:
|
02/01/2005
|
Application #:
|
09505986
|
Filing Dt:
|
02/16/2000
|
Title:
|
SYSTEM AND METHOD FOR ELIMINATING WRITE BACKS WITH BUFFER FOR EXCEPTION PROCESSING
|
|
|
Patent #:
|
|
Issue Dt:
|
03/25/2003
|
Application #:
|
09506951
|
Filing Dt:
|
02/18/2000
|
Title:
|
HIGH DENSITY DESIGN FOR ORGANIC CHIP CARRIERS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/22/2002
|
Application #:
|
09507603
|
Filing Dt:
|
02/18/2000
|
Title:
|
SOLID STATE IMAGE SENSOR USING AN INTERMEDIATE REFRACTIVE INDEX ANTIREFLECTION FILM AND METHOD FOR FABRICATING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
01/01/2002
|
Application #:
|
09510996
|
Filing Dt:
|
02/22/2000
|
Title:
|
Method for preparing a conductive pad for electrical connection and conductive pad formed
|
|
|
Patent #:
|
|
Issue Dt:
|
11/14/2000
|
Application #:
|
09517609
|
Filing Dt:
|
03/02/2000
|
Title:
|
Clock phase generator for controlling operation of a dram array
|
|