skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:014546/0001   Pages: 60
Recorded: 10/10/2003
Conveyance: SECURITY AGREEMENT
Total properties: 70
1
Patent #:
5448450
Issue Dt:
09/05/1995
Application #:
07783737
Filing Dt:
10/28/1991
Title:
LEAD-ON-CHIP INTEGRATED CIRCUIT APPARATUS
2
Patent #:
5236117
Issue Dt:
08/17/1993
Application #:
07903056
Filing Dt:
06/22/1992
Title:
IMPACT SOLDER METHOD AND APPARATUS
3
Patent #:
5484959
Issue Dt:
01/16/1996
Application #:
07990334
Filing Dt:
12/11/1992
Title:
HIGH DENSITY LEAD-ON-PACKAGE FABRICATION METHOD AND APPARATUS
4
Patent #:
5369056
Issue Dt:
11/29/1994
Application #:
08037830
Filing Dt:
03/29/1993
Title:
WARP-RESISTENT ULTRA-THIN INTEGRATED CIRCUIT PACKAGE FABRICATION METHOD
5
Patent #:
5367766
Issue Dt:
11/29/1994
Application #:
08043196
Filing Dt:
04/05/1993
Title:
ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGES METHOD
6
Patent #:
5446620
Issue Dt:
08/29/1995
Application #:
08133395
Filing Dt:
10/08/1993
Title:
ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGES METHOD AND APPARATUS
7
Patent #:
5420751
Issue Dt:
05/30/1995
Application #:
08133397
Filing Dt:
10/08/1993
Title:
ULTRA HIGH DENSITY MODULAR INTEGRATED CIRCUIT PACKAGE
8
Patent #:
5498906
Issue Dt:
03/12/1996
Application #:
08153511
Filing Dt:
11/17/1993
Title:
CAPACITIVE COUPLING CONFIGURATION FOR AN INTEGRATED CIRCUIT PACKAGE
9
Patent #:
5377077
Issue Dt:
12/27/1994
Application #:
08168354
Filing Dt:
12/17/1993
Title:
ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGES METHOD AND APPARATUS
10
Patent #:
5369058
Issue Dt:
11/29/1994
Application #:
08206301
Filing Dt:
03/04/1994
Title:
WARP-RESISTENT ULTRA-THIN INTEGRATED CIRCUIT PACKAGE FABRICATION METHOD
11
Patent #:
5475920
Issue Dt:
12/19/1995
Application #:
08206311
Filing Dt:
03/04/1994
Title:
METHOD OF ASSEMBLING ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGES
12
Patent #:
5455740
Issue Dt:
10/03/1995
Application #:
08206829
Filing Dt:
03/07/1994
Title:
BUS COMMUNICATION SYSTEM FOR STACKED HIGH DENSITY INTEGRATED CIRCUIT PACKAGES
13
Patent #:
5581121
Issue Dt:
12/03/1996
Application #:
08280968
Filing Dt:
07/27/1994
Title:
WARP-RESISTANT ULTRA-THIN INTEGRATED CIRCUIT PACKAGE
14
Patent #:
5561591
Issue Dt:
10/01/1996
Application #:
08289468
Filing Dt:
08/12/1994
Title:
MULTI-SIGNAL RAIL ASSEMBLY WITH IMPEDANCE CONTROL FOR A THREE-DIMENSIONAL HIGH DENSITY INTEGRATED CIRCUIT PACKAGE
15
Patent #:
5566051
Issue Dt:
10/15/1996
Application #:
08298544
Filing Dt:
08/30/1994
Title:
ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGES METHOD AND APPARATUS
16
Patent #:
5702985
Issue Dt:
12/30/1997
Application #:
08325719
Filing Dt:
10/19/1994
Title:
HERMETICALLY SEALED CERAMIC INTEGRATED CIRCUIT HEAT DISSIPATING PACKAGE FABRICATION METHOD
17
Patent #:
5572065
Issue Dt:
11/05/1996
Application #:
08328338
Filing Dt:
10/24/1994
Title:
HERMETICALLY SEALED CERAMIC INTEGRATED CIRCUIT HEAT DISSIPATING PACKAGE
18
Patent #:
5543664
Issue Dt:
08/06/1996
Application #:
08375747
Filing Dt:
01/20/1995
Title:
ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGE
19
Patent #:
5528075
Issue Dt:
06/18/1996
Application #:
08375874
Filing Dt:
01/20/1995
Title:
LEAD-ON-CHIP INTEGRATED CIRCUIT APPARATUS
20
Patent #:
5592364
Issue Dt:
01/07/1997
Application #:
08377578
Filing Dt:
01/24/1995
Title:
HIGH DENSITY INTEGRATED CIRCUIT MODULE WITH COMPLEX ELECTRICAL INTERCONNECT RAILS
21
Patent #:
5804870
Issue Dt:
09/08/1998
Application #:
08380541
Filing Dt:
01/30/1995
Title:
HERMETICALLY SEALED INTEGRATED CIRCUIT LEAD-ON PACKAGE CONFIGURATION
22
Patent #:
5499160
Issue Dt:
03/12/1996
Application #:
08380543
Filing Dt:
01/30/1995
Title:
HIGH DENSITY INTEGRATED CIRCUIT MODULE WITH SNAP-ON RAIL ASSEMBLIES
23
Patent #:
5550711
Issue Dt:
08/27/1996
Application #:
08436902
Filing Dt:
05/08/1995
Title:
ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGES
24
Patent #:
5479318
Issue Dt:
12/26/1995
Application #:
08440500
Filing Dt:
05/12/1995
Title:
BUS COMMUNICATION SYSTEM FOR STACKED HIGH DENSITY INTEGRATED CIRCUIT PACKAGES WITH TRIFURCATED DISTAL LEAD ENDS
25
Patent #:
5493476
Issue Dt:
02/20/1996
Application #:
08445848
Filing Dt:
05/22/1995
Title:
BUS COMMUNICATION SYSTEM FOR STACKED HIGH DENSITY INTEGRATED CIRCUIT PACKAGES WITH BIFURCATED DISTAL LEAD ENDS
26
Patent #:
5605592
Issue Dt:
02/25/1997
Application #:
08445895
Filing Dt:
05/22/1995
Title:
METHOD OF MANUFACTURING A BUS COMMUNICATION SYSTEM FOR STACKED HIGH DENSITY INTEGRATED CIRCUIT PACKAGES
27
Patent #:
5644161
Issue Dt:
07/01/1997
Application #:
08473593
Filing Dt:
06/07/1995
Title:
ULTRA-HIGH DENSITY WARP-RESISTANT MEMORY MODULE
28
Patent #:
5631193
Issue Dt:
05/20/1997
Application #:
08497565
Filing Dt:
06/30/1995
Title:
HIGH DENSITY LEAD-ON-PACKAGE FABRICATION METHOD AND APPARATUS
29
Patent #:
5552963
Issue Dt:
09/03/1996
Application #:
08506309
Filing Dt:
07/24/1995
Title:
BUS COMMUNICATION SYSTEM FOR STACKED HIGH DENSITY INTEGRATED CIRCUIT PACKAGES
30
Patent #:
RE36229
Issue Dt:
06/15/1999
Application #:
08510729
Filing Dt:
11/20/1995
Title:
SIMULCAST STANDARD MULTICHIP MEMORY ADDRESSING SYSTEM
31
Patent #:
5801437
Issue Dt:
09/01/1998
Application #:
08514294
Filing Dt:
08/11/1995
Title:
THREE-DIMENSIONAL WARP-RESISTANT INTEGRATED CIRCUIT MODULE METHOD AND APPARATUS
32
Patent #:
5654877
Issue Dt:
08/05/1997
Application #:
08516848
Filing Dt:
08/18/1995
Title:
LEAD-ON-CHIP INTEGRATED CIRCUIT APPARATUS
33
Patent #:
5615475
Issue Dt:
04/01/1997
Application #:
08517485
Filing Dt:
08/21/1995
Title:
METHOD OF MANUFACTURING AN INTEGRATED PACKAGE HAVING A PAIR OF DIE ON A COMMON LEAD FRAME
34
Patent #:
5588205
Issue Dt:
12/31/1996
Application #:
08523201
Filing Dt:
09/05/1995
Title:
METHOD OF MANUFACTURING A HIGH DENSITY INTEGRATED CIRCUIT MODULE HAVING COMPLEX ELECTRICAL INTERCONNECT RAILS
35
Patent #:
5541812
Issue Dt:
07/30/1996
Application #:
08526470
Filing Dt:
09/11/1995
Title:
BUS COMMUNICATION SYSTEM FOR STACKED HIGH DENSITY INTEGRATED CIRCUIT PACKAGES HAVING AN INTERMEDIATE LEAD FRAME
36
Patent #:
5585668
Issue Dt:
12/17/1996
Application #:
08601880
Filing Dt:
02/15/1996
Title:
INTEGRATED CIRCUIT PACKAGE WITH OVERLAPPED DIE ON A COMMON LEAD FRAME
37
Patent #:
5586009
Issue Dt:
12/17/1996
Application #:
08630083
Filing Dt:
04/09/1996
Title:
BUS COMMUNICATION SYSTEM FOR STACKED HIGH DENSITY INTEGRATED CIRCUIT PACKAGES
38
Patent #:
5864175
Issue Dt:
01/26/1999
Application #:
08644491
Filing Dt:
05/10/1996
Title:
WARP-RESISTENT ULTRA-THIN INTEGRATED CIRCUIT PACKAGE FABRICATION METHOD
39
Patent #:
5978227
Issue Dt:
11/02/1999
Application #:
08645319
Filing Dt:
05/13/1996
Title:
INTEGRATED CIRCUIT PACKAGES HAVING AN EXTERNALLY MOUNTED LEAD FRAME HAVING BIFURCATED DISTAL LEAD ENDS
40
Patent #:
5778522
Issue Dt:
07/14/1998
Application #:
08650721
Filing Dt:
05/20/1996
Title:
METHOD OF MANUFACTURING A HIGH DENSITY INTEGRATED CIRCUIT MODULE WITH COMPLEX ELECTRICAL INTERCONNECT RAILS HAVING ELECTRICAL INTERCONNECT STRAIN RELIEF
41
Patent #:
5843807
Issue Dt:
12/01/1998
Application #:
08686985
Filing Dt:
07/25/1996
Title:
METHOD OF MANUFACTURING AN UKTRA-HIGH DENSITY WARP-RESISTANT MEMORY MODULE
42
Patent #:
5828125
Issue Dt:
10/27/1998
Application #:
08758839
Filing Dt:
12/02/1996
Title:
ULTRA-HIGH DENSITY WARP-RESISTANT MEMORY MODULE
43
Patent #:
5783464
Issue Dt:
07/21/1998
Application #:
08798556
Filing Dt:
02/11/1997
Title:
METHOD OF FORMING A HERMETICALLY SEALED CIRCUIT LEAD-ON PACKAGE
44
Patent #:
5945732
Issue Dt:
08/31/1999
Application #:
08815537
Filing Dt:
03/12/1997
Title:
APPARATUS AND METHOD OF MANUFACTURING A WARP RESISTANT THERMALLY CONDUCTIVE INTEGRATED CIRCUIT PACKAGE
45
Patent #:
5895232
Issue Dt:
04/20/1999
Application #:
08888850
Filing Dt:
07/07/1997
Title:
THREE-DIMENSIONAL WARP-RESISTANT INTEGRATED CIRCUIT MODULE METHOD AND APPARATUS
46
Patent #:
6049123
Issue Dt:
04/11/2000
Application #:
08935380
Filing Dt:
09/22/1997
Title:
ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGES
47
Patent #:
6025642
Issue Dt:
02/15/2000
Application #:
08937200
Filing Dt:
09/22/1997
Title:
ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGES
48
Patent #:
5960539
Issue Dt:
10/05/1999
Application #:
09021744
Filing Dt:
02/11/1998
Title:
METHOD OF MAKING HIGH DENSITY CIRCUIT MODULE
49
Patent #:
6190939
Issue Dt:
02/20/2001
Application #:
09115293
Filing Dt:
07/14/1998
Title:
METHOD OF MANUFACTURING A WARP RESISTANT THERMALLY CONDUCTIVE CIRCUIT PACKAGE
50
Patent #:
6282210
Issue Dt:
08/28/2001
Application #:
09133297
Filing Dt:
08/12/1998
Title:
CLOCK DRIVER WITH INSTANTANEOUSLY SELECTABLE PHASE AND METHOD FOR USE IN DATA COMMUNICATION SYSTEM
51
Patent #:
6194247
Issue Dt:
02/27/2001
Application #:
09159120
Filing Dt:
09/23/1998
Title:
WARP-RESISTENT ULTRA-THIN INTEGRATED CIRCUIT PACKAGE FABRICATION METHOD
52
Patent #:
6310392
Issue Dt:
10/30/2001
Application #:
09221350
Filing Dt:
12/28/1998
Title:
STACKED MICRO BALL GRID ARRAY PACKAGES
53
Patent #:
6205654
Issue Dt:
03/27/2001
Application #:
09222263
Filing Dt:
12/28/1998
Title:
METHOD OF MANUFACTURING A SURFACE MOUNT PACKAGE
54
Patent #:
6288907
Issue Dt:
09/11/2001
Application #:
09343432
Filing Dt:
06/30/1999
Title:
HIGH DENSITY INTEGRATED CIRCUIT MODULE WITH COMPLEX ELECTRICAL INTERCONNECT RAILS HAVING ELECTRICAL INTERCONNECT STRAIN RELIEF
55
Patent #:
6168970
Issue Dt:
01/02/2001
Application #:
09434534
Filing Dt:
11/05/1999
Title:
ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGES
56
Patent #:
6404662
Issue Dt:
06/11/2002
Application #:
09646724
Filing Dt:
03/07/2001
Title:
RAMBUS STAKPAK
57
Patent #:
6608763
Issue Dt:
08/19/2003
Application #:
09663753
Filing Dt:
09/15/2000
Title:
STACKING SYSTEM AND METHOD
58
Patent #:
6919626
Issue Dt:
07/19/2005
Application #:
09761210
Filing Dt:
01/16/2001
Publication #:
US20010005042
Pub Dt:
06/28/2001
Title:
HIGH DENSITY INTEGRATED CIRCUIT MODULE
59
Patent #:
6462408
Issue Dt:
10/08/2002
Application #:
09819171
Filing Dt:
03/27/2001
Publication #:
US20020140074
Pub Dt:
10/03/2002
Title:
CONTACT MEMBER STACKING SYSTEM AND METHOD
60
Patent #:
6618257
Issue Dt:
09/09/2003
Application #:
09916625
Filing Dt:
07/27/2001
Title:
WIDE DATA PATH STACKING SYSTEM AND METHOD
61
Patent #:
6576992
Issue Dt:
06/10/2003
Application #:
10005581
Filing Dt:
10/26/2001
Title:
CHIP SCALE STACKING SYSTEM AND METHOD
62
Patent #:
6806120
Issue Dt:
10/19/2004
Application #:
10092104
Filing Dt:
03/06/2002
Publication #:
US20020142515
Pub Dt:
10/03/2002
Title:
CONTACT MEMBER STACKING SYSTEM AND METHOD
63
Patent #:
6572387
Issue Dt:
06/03/2003
Application #:
10101039
Filing Dt:
03/19/2002
Publication #:
US20020102870
Pub Dt:
08/01/2002
Title:
FLEXIBLE CIRCUIT CONNECTOR FOR STACKED CHIP MODULE
64
Patent #:
6940729
Issue Dt:
09/06/2005
Application #:
10136890
Filing Dt:
05/02/2002
Publication #:
US20030081392
Pub Dt:
05/01/2003
Title:
INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD
65
Patent #:
NONE
Issue Dt:
Application #:
10400309
Filing Dt:
03/27/2003
Publication #:
US20030137048
Pub Dt:
07/24/2003
Title:
Stacking system and method
66
Patent #:
7485951
Issue Dt:
02/03/2009
Application #:
10435192
Filing Dt:
05/09/2003
Publication #:
US20040000707
Pub Dt:
01/01/2004
Title:
MODULARIZED DIE STACKING SYSTEM AND METHOD
67
Patent #:
7066741
Issue Dt:
06/27/2006
Application #:
10449242
Filing Dt:
05/30/2003
Publication #:
US20030203663
Pub Dt:
10/30/2003
Title:
FLEXIBLE CIRCUIT CONNECTOR FOR STACKED CHIP MODULE
68
Patent #:
6914324
Issue Dt:
07/05/2005
Application #:
10453398
Filing Dt:
06/03/2003
Publication #:
US20040000708
Pub Dt:
01/01/2004
Title:
MEMORY EXPANSION AND CHIP SCALE STACKING SYSTEM AND METHOD
69
Patent #:
NONE
Issue Dt:
Application #:
10457608
Filing Dt:
06/09/2003
Publication #:
US20030234443
Pub Dt:
12/25/2003
Title:
Low profile stacking system and method
70
Patent #:
7026708
Issue Dt:
04/11/2006
Application #:
10631886
Filing Dt:
07/11/2003
Publication #:
US20040052060
Pub Dt:
03/18/2004
Title:
LOW PROFILE CHIP SCALE STACKING SYSTEM AND METHOD
Assignor
1
STAKTEK GROUP L.P.
Exec Dt:
08/19/2003
Assignee
1
COMERICA BANK, AS AGENT
500 WOODWARD AVENUE
ONE DETROIT CENTER, 9TH FLOOR
DETROIT, MICHIGAN 48226
Correspondence name and address
BODMAN, LONGLEY & DAHLING LLP
ANGELA ALVAREZ SUJEK
110 MILLER, SUITE 300
ANN ARBOR, MI 48104

Search Results as of: 05/28/2024 08:12 PM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT