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Reel/Frame:055023/0001   Pages: 3
Recorded: 01/25/2021
Attorney Dkt #:P202004999US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/03/2023
Application #:
17157545
Filing Dt:
01/25/2021
Publication #:
Pub Dt:
07/28/2022
Title:
DISTRIBUTING HEATSINK LOAD ACROSS A PROCESSOR MODULE WITH SEPARABLE INPUT/OUTPUT (I/O) CONNECTORS
Assignors
1
Exec Dt:
01/21/2021
2
Exec Dt:
01/20/2021
Assignee
1
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
IBM (AUS-KLS)
797 SAM BASS ROAD #2559
ROUND ROCK, TX 78681

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