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Reel/Frame:	015320/0005			Pages:	10
		Recorded:	11/02/2004
Conveyance:	SECURITY AGREEMENT

Total properties: 45

Patent #:	6683377	Issue Dt:	01/27/2004	Application #:	09583183	Filing Dt:	05/30/2000
Title:	MULTI-STACKED MEMORY PACKAGE

Patent #:	6695120	Issue Dt:	02/24/2004	Application #:	09602195	Filing Dt:	06/22/2000
Title:	ASSEMBLY FOR TRANSPORTING MATERIAL

Patent #:	6798049	Issue Dt:	09/28/2004	Application #:	09648284	Filing Dt:	08/24/2000
Title:	SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Patent #:	6677662	Issue Dt:	01/13/2004	Application #:	09687487	Filing Dt:	10/13/2000
Title:	CLAMP AND HEAT BLOCK ASSEMBLY FOR WIRE BONDING A SEMICONDUCTOR PACKAGE ASSEMBLY

Patent #:	6753597	Issue Dt:	06/22/2004	Application #:	09687495	Filing Dt:	10/13/2000
Title:	ENCAPSULATED SEMICONDUCTOR PACKAGE INCLUDING CHIP PADDLE AND LEADS

Patent #:	6730544	Issue Dt:	05/04/2004	Application #:	09687530	Filing Dt:	10/13/2000
Title:	STACKABLE SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

Patent #:	6677663	Issue Dt:	01/13/2004	Application #:	09687536	Filing Dt:	10/13/2000
Title:	END GRID ARRAY SEMICONDUCTOR PACKAGE

Patent #:	6696747	Issue Dt:	02/24/2004	Application #:	09687585	Filing Dt:	10/13/2000
Title:	SEMICONDUCTOR PACKAGE HAVING REDUCED THICKNESS

Patent #:	6672773	Issue Dt:	01/06/2004	Application #:	09751536	Filing Dt:	12/29/2000
Title:	OPTICAL FIBER HAVING TAPERED END AND OPTICAL CONNECTOR WITH RECIPROCAL OPENING

Patent #:	6686588	Issue Dt:	02/03/2004	Application #:	09764165	Filing Dt:	01/16/2001
Title:	OPTICAL MODULE WITH LENS INTEGRAL HOLDER

Patent #:	6762078	Issue Dt:	07/13/2004	Application #:	09774952	Filing Dt:	01/30/2001
Publication #:	US20010005601	Pub Dt:	06/28/2001
Title:	SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR CHIP WITHIN CENTRAL APERTURE OF SUBSTRATE

Patent #:	6759737	Issue Dt:	07/06/2004	Application #:	09816599	Filing Dt:	03/23/2001
Publication #:	US20030001252	Pub Dt:	01/02/2003
Title:	SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS WITH ALIGNED INPUT/OUTPUT PADS

Patent #:	6756658	Issue Dt:	06/29/2004	Application #:	09827791	Filing Dt:	04/06/2001
Title:	MAKING TWO LEAD SURFACE MOUNTING HIGH POWER MICROLEADFRAME SEMICONDUCTOR PACKAGES

Patent #:	6791166	Issue Dt:	09/14/2004	Application #:	09829341	Filing Dt:	04/09/2001
Title:	STACKABLE LEAD FRAME PACKAGE USING EXPOSED INTERNAL LEAD TRACES

Patent #:	6707168	Issue Dt:	03/16/2004	Application #:	09848932	Filing Dt:	05/04/2001
Title:	SHIELDED SEMICONDUCTOR PACKAGE WITH SINGLE-SIDED SUBSTRATE AND METHOD FOR MAKING THE SAME

Patent #:	6686649	Issue Dt:	02/03/2004	Application #:	09855244	Filing Dt:	05/14/2001
Title:	MULTI-CHIP SEMICONDUCTOR PACKAGE WITH INTEGRAL SHIELD AND ANTENNA

Patent #:	6734419	Issue Dt:	05/11/2004	Application #:	09896014	Filing Dt:	06/28/2001
Title:	METHOD FOR FORMING AN IMAGE SENSOR PACKAGE WITH VISION DIE IN LENS HOUSING

Patent #:	6730536	Issue Dt:	05/04/2004	Application #:	09896074	Filing Dt:	06/28/2001
Title:	PRE-DRILLED IMAGE SENSOR PACKAGE FABRICATION METHOD

Patent #:	6717126	Issue Dt:	04/06/2004	Application #:	09906868	Filing Dt:	07/16/2001
Title:	METHOD OF FABRICATING AND USING AN IMAGE SENSOR PACKAGE WITH REFLECTOR

Patent #:	6686580	Issue Dt:	02/03/2004	Application #:	09906992	Filing Dt:	07/16/2001
Title:	IMAGE SENSOR PACKAGE WITH REFLECTOR

Patent #:	6784376	Issue Dt:	08/31/2004	Application #:	09931144	Filing Dt:	08/16/2001
Title:	SOLDERABLE INJECTION-MOLDED INTEGRATED CIRCUIT SUBSTRATE AND METHOD THEREFOR

Patent #:	6759266	Issue Dt:	07/06/2004	Application #:	09946861	Filing Dt:	09/04/2001
Title:	QUICK SEALING GLASS-LIDDED PACKAGE FABRICATION METHOD

Patent #:	6686651	Issue Dt:	02/03/2004	Application #:	09996226	Filing Dt:	11/27/2001
Title:	MULTI-LAYER LEAD FRAME STRUCTURE

Patent #:	6684496	Issue Dt:	02/03/2004	Application #:	10007337	Filing Dt:	10/22/2001
Publication #:	US20020038714	Pub Dt:	04/04/2002
Title:	METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE

Patent #:	6713322	Issue Dt:	03/30/2004	Application #:	10013160	Filing Dt:	12/10/2001
Publication #:	US20020140061	Pub Dt:	10/03/2002
Title:	LEAD FRAME FOR SEMICONDUCTOR PACKAGE

Patent #:	6737750	Issue Dt:	05/18/2004	Application #:	10013396	Filing Dt:	12/07/2001
Title:	STRUCTURES FOR IMPROVING HEAT DISSIPATION IN STACKED SEMICONDUCTOR PACKAGES

Patent #:	6740950	Issue Dt:	05/25/2004	Application #:	10046995	Filing Dt:	01/14/2002
Publication #:	US20020093078	Pub Dt:	07/18/2002
Title:	OPTICAL DEVICE PACKAGES HAVING IMPROVED CONDUCTOR EFFICIENCY, OPTICAL COUPLING AND THERMAL TRANSFER

Patent #:	6798046	Issue Dt:	09/28/2004	Application #:	10054124	Filing Dt:	01/22/2002
Title:	SEMICONDUCTOR PACKAGE INCLUDING RINGS STRUCTURE CONNECTED TO LEADS WITH VERTICALLY DOWNSET INNER ENDS

Patent #:	6784534	Issue Dt:	08/31/2004	Application #:	10067068	Filing Dt:	02/06/2002
Title:	THIN INTEGRATED CIRCUIT PACKAGE HAVING AN OPTICALLY TRANSPARENT WINDOW

Patent #:	6710438	Issue Dt:	03/23/2004	Application #:	10078718	Filing Dt:	02/19/2002
Publication #:	US20030155641	Pub Dt:	08/21/2003
Title:	ENHANCED CHIP SCALE PACKAGE FOR WIRE BOND DIES

Patent #:	6700187	Issue Dt:	03/02/2004	Application #:	10103048	Filing Dt:	03/21/2002
Publication #:	US20020140065	Pub Dt:	10/03/2002
Title:	SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Patent #:	6770961	Issue Dt:	08/03/2004	Application #:	10115218	Filing Dt:	04/02/2002
Publication #:	US20020149092	Pub Dt:	10/17/2002
Title:	CARRIER FRAME AND SEMICONDUCTOR PACKAGE INCLUDING CARRIER FRAME

Patent #:	6683795	Issue Dt:	01/27/2004	Application #:	10121215	Filing Dt:	04/10/2002
Title:	SHIELD CAP AND SEMICONDUCTOR PACKAGE INCLUDING SHIELD CAP

Patent #:	6710945	Issue Dt:	03/23/2004	Application #:	10161963	Filing Dt:	06/03/2002
Title:	INJECTION MOLDED LENS-BARREL ASSEMBLY AND METHOD FOR FABRICATING LENS-BARREL AND MOUNT ASSEMBLIES

Patent #:	6756801	Issue Dt:	06/29/2004	Application #:	10171211	Filing Dt:	06/11/2002
Publication #:	US20020149383	Pub Dt:	10/17/2002
Title:	APPARATUS FOR ELECTRICAL TESTING OF A SUBSTRATE HAVING A PLURALITY OF TERMINALS

Patent #:	6747352	Issue Dt:	06/08/2004	Application #:	10223749	Filing Dt:	08/19/2002
Title:	INTEGRATED CIRCUIT HAVING MULTIPLE POWER/GROUND CONNECTIONS TO A SINGLE EXTERNAL TERMINAL AND METHOD THEREFOR

Patent #:	6717822	Issue Dt:	04/06/2004	Application #:	10251410	Filing Dt:	09/20/2002
Title:	LEAD-FRAME METHOD AND CIRCUIT MODULE ASSEMBLY INCLUDING EDGE STIFFENER

Patent #:	6707138	Issue Dt:	03/16/2004	Application #:	10256905	Filing Dt:	09/26/2002
Publication #:	US20030075785	Pub Dt:	04/24/2003
Title:	SEMICONDUCTOR DEVICE INCLUDING METAL STRAP ELECTRICALLY COUPLED BETWEEN SEMICONDUCTOR DIE AND METAL LEADFRAME

Patent #:	6791076	Issue Dt:	09/14/2004	Application #:	10286589	Filing Dt:	10/31/2002
Publication #:	US20030057359	Pub Dt:	03/27/2003
Title:	IMAGE SENSOR PACKAGE

Patent #:	6717248	Issue Dt:	04/06/2004	Application #:	10306627	Filing Dt:	11/26/2002
Publication #:	US20030100142	Pub Dt:	05/29/2003
Title:	SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Patent #:	6798047	Issue Dt:	09/28/2004	Application #:	10329620	Filing Dt:	12/26/2002
Title:	PRE-MOLDED LEADFRAME

Patent #:	6777789	Issue Dt:	08/17/2004	Application #:	10340256	Filing Dt:	01/10/2003
Title:	MOUNTING FOR A PACKAGE CONTAINING A CHIP

Patent #:	6723582	Issue Dt:	04/20/2004	Application #:	10356046	Filing Dt:	01/31/2003
Publication #:	US20030113954	Pub Dt:	06/19/2003
Title:	METHOD OF MAKING A SEMICONDUCTOR PACKAGE HAVING EXPOSED METAL STRAP

Patent #:	6750545	Issue Dt:	06/15/2004	Application #:	10376988	Filing Dt:	02/28/2003
Title:	SEMICONDUCTOR PACKAGE CAPABLE OF DIE STACKING

Patent #:	6794740	Issue Dt:	09/21/2004	Application #:	10387801	Filing Dt:	03/13/2003
Title:	LEADFRAME PACKAGE FOR SEMICONDUCTOR DEVICES

Assignors

AMKOR TECHNOLOGY, INC.

Exec Dt:

10/27/2004

GUARDIAN ASSETS, INC.

Exec Dt:

10/27/2004

Assignee

CITICORP NORTH AMERICA, INC. AS AGENT

GOSHEN CORPORATE PARK, 1345 ENTERPRISE DRIVE

WEST CHESTER, PENNSYLVANIA 19380

Correspondence name and address
	WEIL, GOTSHAL & MANGES,C/OTERESA HARINGS
	767 5TH AVENUE
	NEW YORK, NY 10153

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