Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 044223/0021 | |
| Pages: | 8 |
| | Recorded: | 10/18/2017 | | |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR NAME ON THE ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED AT REEL: 019035 FRAME: 0713. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT . |
|
Total properties:
5
|
|
Patent #:
|
|
Issue Dt:
|
09/24/2002
|
Application #:
|
09271179
|
Filing Dt:
|
03/17/1999
|
Title:
|
ARRANGEMENT AND METHOD FOR IMPROVED DOWNWARD SCALING OF HIGHER CONDUCTIVITY METAL-BASED INTERCONNECTS
|
|
|
Patent #:
|
|
Issue Dt:
|
02/18/2003
|
Application #:
|
09619587
|
Filing Dt:
|
07/19/2000
|
Title:
|
METHOD FOR MAKING INTEGRATED CIRCUIT INCLUDING INTERCONNECTS WITH ENHANCED ELECTROMIGRATION RESISTANCE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/22/2003
|
Application #:
|
09642140
|
Filing Dt:
|
08/18/2000
|
Title:
|
METHOD FOR MAKING INTEGRATED CIRCUIT INCLUDING INTERCONNECTS WITH ENHANCED ELECTROMIGRATION RESISTANCE USING DOPED SEED LAYER AND INTEGRATED CIRCUITS PRODUCED THEREBY
|
|
|
Patent #:
|
|
Issue Dt:
|
08/27/2002
|
Application #:
|
09672473
|
Filing Dt:
|
09/28/2000
|
Title:
|
DIFFUSION BARRIERS FOR COPPER INTERCONNECT SYSTEMS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/11/2006
|
Application #:
|
10803475
|
Filing Dt:
|
03/18/2004
|
Publication #:
|
|
Pub Dt:
|
12/02/2004
| | | | |
Title:
|
COPPER INTERCONNECT SYSTEMS WHICH USE CONDUCTIVE, METAL-BASED CAP LAYERS
|
|
Assignee
|
|
|
2215-B RENAISSANCE DRIVE, SUITE 5 |
LAS VEGAS, NEVADA 89119 |
|
Correspondence name and address
|
|
INTELLECTUAL VENTURES MANAGEMENT- IP LEGAL
|
|
3150 139TH AVENUE SE
|
|
BUILDING 4, FLOOR 3
|
|
BELLEVUE, WA 98005
|
Search Results as of:
05/24/2024 02:43 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|