Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 027035/0026 | |
| Pages: | 7 |
| | Recorded: | 10/07/2011 | | |
| Attorney Dkt #: | 2011-10-07 PAT SEC AGMT |
| Conveyance: | SECURITY AGREEMENT |
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Total properties:
3
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Patent #:
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Issue Dt:
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01/05/2016
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Application #:
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13230633
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Filing Dt:
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09/12/2011
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Publication #:
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Pub Dt:
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03/14/2013
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Title:
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Spot Plated Leadframe and IC Bond Pad Via Array Design for Copper Wire
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Patent #:
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Issue Dt:
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02/19/2013
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Application #:
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13236532
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Filing Dt:
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09/19/2011
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Publication #:
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Pub Dt:
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01/12/2012
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Title:
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MICRO ELECTRO-MECHANICAL SENSOR (MEMS) FABRICATED WITH RIBBON WIRE BONDS
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13242078
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Filing Dt:
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09/23/2011
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Publication #:
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Pub Dt:
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03/28/2013
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Title:
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SUB-MICRON CMOS VCO THAT USES DELAY-BASED CALIBRATION AND METHOD OF OPERATION
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Assignee
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| 2 NORTH LASALLE STREET, SUITE 1020 |
| CHICAGO, ILLINOIS 60602 |
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Correspondence name and address
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CONEXANT SYSTEMS, INC.
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LEGAL DEPARTMENT - ATTN.: LUCY COONEY
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4000 MACARTHUR BLVD., MAIL STOP K08-839
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NEWPORT BEACH, CA 92660
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