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Reel/Frame:065163/0039   Pages: 7
Recorded: 10/09/2023
Attorney Dkt #:KLAXP5999US2
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18378052
Filing Dt:
10/09/2023
Publication #:
Pub Dt:
02/15/2024
Title:
SYSTEM AND METHOD FOR MITIGATING OVERLAY DISTORTION PATTERNS CAUSED BY A WAFER BONDING TOOL
Assignors
1
Exec Dt:
02/27/2022
2
Exec Dt:
03/28/2022
3
Exec Dt:
03/01/2022
Assignee
1
ONE TECHNOLOGY DRIVE
MILPITAS, CALIFORNIA 95035
Correspondence name and address
SUITER SWANTZ/KLA JOINT CUSTOMER NUMBER
14301 FNB PARKWAY
SUITE 220
OMAHA, NE 68154-5299

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