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Reel/Frame:029195/0048   Pages: 8
Recorded: 10/25/2012
Attorney Dkt #:21260-001001
Conveyance: MERGER (SEE DOCUMENT FOR DETAILS).
Total properties: 138
Page 2 of 2
Pages: 1 2
1
Patent #:
7443023
Issue Dt:
10/28/2008
Application #:
11231418
Filing Dt:
09/21/2005
Publication #:
US20060091529
Pub Dt:
05/04/2006
Title:
HIGH CAPACITY THIN MODULE SYSTEM
2
Patent #:
7259452
Issue Dt:
08/21/2007
Application #:
11248662
Filing Dt:
10/11/2005
Publication #:
US20070080470
Pub Dt:
04/12/2007
Title:
LEADED PACKAGE INTEGRATED CIRCUIT STACKING
3
Patent #:
7542297
Issue Dt:
06/02/2009
Application #:
11255061
Filing Dt:
10/19/2005
Publication #:
US20060050489
Pub Dt:
03/09/2006
Title:
OPTIMIZED MOUNTING AREA CIRCUIT MODULE SYSTEM AND METHOD
4
Patent #:
7310458
Issue Dt:
12/18/2007
Application #:
11258438
Filing Dt:
10/25/2005
Publication #:
US20060108572
Pub Dt:
05/25/2006
Title:
STACKED MODULE SYSTEMS AND METHODS
5
Patent #:
7656678
Issue Dt:
02/02/2010
Application #:
11263627
Filing Dt:
10/31/2005
Publication #:
US20060092614
Pub Dt:
05/04/2006
Title:
STACKED MODULE SYSTEMS
6
Patent #:
7576995
Issue Dt:
08/18/2009
Application #:
11267476
Filing Dt:
11/04/2005
Publication #:
US20070103877
Pub Dt:
05/10/2007
Title:
FLEX CIRCUIT APPARATUS AND METHOD FOR ADDING CAPACITANCE WHILE CONSERVING CIRCUIT BOARD SURFACE AREA
7
Patent #:
7446410
Issue Dt:
11/04/2008
Application #:
11283355
Filing Dt:
11/18/2005
Publication #:
US20060090102
Pub Dt:
04/27/2006
Title:
CIRCUIT MODULE WITH THERMAL CASING SYSTEMS
8
Patent #:
7508058
Issue Dt:
03/24/2009
Application #:
11330307
Filing Dt:
01/11/2006
Publication #:
US20070170561
Pub Dt:
07/26/2007
Title:
STACKED INTEGRATED CIRCUIT MODULE
9
Patent #:
7616452
Issue Dt:
11/10/2009
Application #:
11331969
Filing Dt:
01/13/2006
Publication #:
US20060125067
Pub Dt:
06/15/2006
Title:
FLEX CIRCUIT CONSTRUCTIONS FOR HIGH CAPACITY CIRCUIT MODULE SYSTEMS AND METHODS
10
Patent #:
7579687
Issue Dt:
08/25/2009
Application #:
11332740
Filing Dt:
01/13/2006
Publication #:
US20060129888
Pub Dt:
06/15/2006
Title:
CIRCUIT MODULE TURBULENCE ENHACEMENT SYSTEMS AND METHODS
11
Patent #:
7511969
Issue Dt:
03/31/2009
Application #:
11345910
Filing Dt:
02/02/2006
Publication #:
US20070176286
Pub Dt:
08/02/2007
Title:
COMPOSITE CORE CIRCUIT MODULE SYSTEM AND METHOD
12
Patent #:
7760513
Issue Dt:
07/20/2010
Application #:
11397597
Filing Dt:
04/03/2006
Publication #:
US20060198238
Pub Dt:
09/07/2006
Title:
MODIFIED CORE FOR CIRCUIT MODULE SYSTEM AND METHOD
13
Patent #:
7323364
Issue Dt:
01/29/2008
Application #:
11411185
Filing Dt:
04/25/2006
Publication #:
US20060263938
Pub Dt:
11/23/2006
Title:
STACKED MODULE SYSTEMS AND METHOD
14
Patent #:
7608920
Issue Dt:
10/27/2009
Application #:
11434964
Filing Dt:
05/16/2006
Publication #:
US20070158802
Pub Dt:
07/12/2007
Title:
MEMORY CARD AND METHOD FOR DEVISING
15
Patent #:
7508069
Issue Dt:
03/24/2009
Application #:
11436946
Filing Dt:
05/18/2006
Publication #:
US20070159545
Pub Dt:
07/12/2007
Title:
MANAGED MEMORY COMPONENT
16
Patent #:
7304382
Issue Dt:
12/04/2007
Application #:
11436957
Filing Dt:
05/18/2006
Publication #:
US20070158800
Pub Dt:
07/12/2007
Title:
MANAGED MEMORY COMPONENT
17
Patent #:
7446403
Issue Dt:
11/04/2008
Application #:
11452531
Filing Dt:
06/14/2006
Publication #:
US20070290312
Pub Dt:
12/20/2007
Title:
CARRIER STRUCTURE STACKING SYSTEM AND METHOD
18
Patent #:
7375418
Issue Dt:
05/20/2008
Application #:
11452532
Filing Dt:
06/14/2006
Publication #:
US20070290313
Pub Dt:
12/20/2007
Title:
INTERPOSER STACKING SYSTEM AND METHOD
19
Patent #:
7193310
Issue Dt:
03/20/2007
Application #:
11489956
Filing Dt:
07/20/2006
Publication #:
US20060261461
Pub Dt:
11/23/2006
Title:
STACKING SYSTEM AND METHOD
20
Patent #:
7573129
Issue Dt:
08/11/2009
Application #:
11533743
Filing Dt:
09/20/2006
Publication #:
US20070290314
Pub Dt:
12/20/2007
Title:
CONTRAST INTERPOSER STACKING SYSTEM AND METHOD
21
Patent #:
7417310
Issue Dt:
08/26/2008
Application #:
11556124
Filing Dt:
11/02/2006
Publication #:
US20080122054
Pub Dt:
05/29/2008
Title:
CIRCUIT MODULE HAVING FORCE RESISTANT CONSTRUCTION
22
Patent #:
7602613
Issue Dt:
10/13/2009
Application #:
11624608
Filing Dt:
01/18/2007
Publication #:
US20070115017
Pub Dt:
05/24/2007
Title:
THIN MODULE SYSTEM AND METHOD
23
Patent #:
7605454
Issue Dt:
10/20/2009
Application #:
11670396
Filing Dt:
02/01/2007
Publication #:
US20070158795
Pub Dt:
07/12/2007
Title:
MEMORY CARD AND METHOD FOR DEVISING
24
Patent #:
7468553
Issue Dt:
12/23/2008
Application #:
11682643
Filing Dt:
03/06/2007
Publication #:
US20080093724
Pub Dt:
04/24/2008
Title:
STACKABLE MICROPACKAGES AND STACKED MODULES
25
Patent #:
7759791
Issue Dt:
07/20/2010
Application #:
11738330
Filing Dt:
04/20/2007
Publication #:
US20080093734
Pub Dt:
04/24/2008
Title:
HIGH DENSITY IC MODULE
26
Patent #:
7508723
Issue Dt:
03/24/2009
Application #:
11753460
Filing Dt:
05/24/2007
Publication #:
US20080291747
Pub Dt:
11/27/2008
Title:
BUFFERED MEMORY DEVICE
27
Patent #:
7522421
Issue Dt:
04/21/2009
Application #:
11777925
Filing Dt:
07/13/2007
Publication #:
US20070258217
Pub Dt:
11/08/2007
Title:
SPLIT CORE CIRCUIT MODULE
28
Patent #:
7572671
Issue Dt:
08/11/2009
Application #:
11867534
Filing Dt:
10/04/2007
Publication #:
US20080036068
Pub Dt:
02/14/2008
Title:
STACKED MODULE SYSTEMS AND METHODS
29
Patent #:
7606042
Issue Dt:
10/20/2009
Application #:
11869644
Filing Dt:
10/09/2007
Publication #:
US20080030966
Pub Dt:
02/07/2008
Title:
HIGH CAPACITY THIN MODULE SYSTEM AND METHOD
30
Patent #:
7522425
Issue Dt:
04/21/2009
Application #:
11869687
Filing Dt:
10/09/2007
Publication #:
US20080030972
Pub Dt:
02/07/2008
Title:
HIGH CAPACITY THIN MODULE SYSTEM AND METHOD
31
Patent #:
7719098
Issue Dt:
05/18/2010
Application #:
11873351
Filing Dt:
10/16/2007
Publication #:
US20080088003
Pub Dt:
04/17/2008
Title:
STACKED MODULES AND METHOD
32
Patent #:
7459784
Issue Dt:
12/02/2008
Application #:
11961477
Filing Dt:
12/20/2007
Publication #:
US20080094803
Pub Dt:
04/24/2008
Title:
HIGH CAPACITY THIN MODULE SYSTEM
33
Patent #:
7768796
Issue Dt:
08/03/2010
Application #:
12147218
Filing Dt:
06/26/2008
Publication #:
US20080278924
Pub Dt:
11/13/2008
Title:
DIE MODULE SYSTEM
34
Patent #:
7804985
Issue Dt:
09/28/2010
Application #:
12197674
Filing Dt:
08/25/2008
Publication #:
US20080308924
Pub Dt:
12/18/2008
Title:
CIRCUIT MODULE HAVING FORCE RESISTANT CONSTRUCTION
35
Patent #:
7626259
Issue Dt:
12/01/2009
Application #:
12258189
Filing Dt:
10/24/2008
Publication #:
US20090046431
Pub Dt:
02/19/2009
Title:
HEAT SINK FOR A HIGH CAPACITY THIN MODULE SYSTEM
36
Patent #:
7675155
Issue Dt:
03/09/2010
Application #:
12262927
Filing Dt:
10/31/2008
Publication #:
US20090072376
Pub Dt:
03/19/2009
Title:
CARRIER STRUCTURE STACKING SYSTEM AND METHOD
37
Patent #:
7737549
Issue Dt:
06/15/2010
Application #:
12263060
Filing Dt:
10/31/2008
Publication #:
US20090052124
Pub Dt:
02/26/2009
Title:
CIRCUIT MODULE WITH THERMAL CASING SYSTEMS
38
Patent #:
7626273
Issue Dt:
12/01/2009
Application #:
12356432
Filing Dt:
01/20/2009
Publication #:
US20090124045
Pub Dt:
05/14/2009
Title:
LOW PROFILE STACKING SYSTEM AND METHOD
Assignor
1
ENTORIAN TECHNOLOGIES L.P.
Exec Dt:
07/14/2010
Assignee
1
ENTORIAN GP LLC
4030 W. BRAKER LANE
AUSTIN, TEXAS 78759
Correspondence name and address
J SCOTT DENKO
1501 SOUTH MOPAC EXPY, SUITE A315
AUSTIN, TX 78746

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