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Reel/Frame:005361/0053   Pages: 6
Recorded: 06/19/1990
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST.
Total properties: 1
1
Patent #:
5130779
Issue Dt:
07/14/1992
Application #:
07540256
Filing Dt:
06/19/1990
Title:
SOLDER MASS HAVING CONDUCTIVE ENCAPSULATING ARRANGEMENT
Assignors
1
AGARWALA, BIRENDRA N.
Exec Dt:
06/06/1990
2
AHSAN, AZIZ M.
Exec Dt:
06/04/1990
3
BROSS, ARTHUR
Exec Dt:
06/06/1990
4
CHADURJIAN, MARK F.
Exec Dt:
05/11/1990
5
KOOPMAN, NICHOLAS G.
Exec Dt:
05/01/1990
6
LEE, LI-CHUNG
Exec Dt:
05/30/1990
7
PUTTLITZ, KARL J.
Exec Dt:
06/13/1990
8
RAY, SUDIPTA K.
Exec Dt:
06/05/1990
9
RYAN, JAMES G.
Exec Dt:
05/11/1990
10
SCHAEFER, JOSEPH G.
Exec Dt:
05/21/1990
11
SRIVASTAVA, KAMALESH K.
Exec Dt:
06/04/1990
12
TOTTA, PAUL A.
Exec Dt:
06/12/1990
13
WALTON, ERICK G.
Exec Dt:
05/11/1990
14
WIRSING, ADOLF E.
Exec Dt:
05/11/1990
Assignee
1
INTERNATIONAL BUSINESS MACHINES CORPORATION, A CORP. OF NY.
ARMONK, NEW YORK 10504
Correspondence name and address
IRA D. BLECKER
IBM CORP.,
INTELLECTUAL PROP. LAW., D/901
ROUTE 52, B/300-482
HOPEWELL JUNCTION, NY 12533-9988

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