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Reel/Frame:023848/0062   Pages: 8
Recorded: 01/26/2010
Conveyance: CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Total properties: 135
Page 2 of 2
Pages: 1 2
1
Patent #:
7324352
Issue Dt:
01/29/2008
Application #:
11068688
Filing Dt:
03/01/2005
Publication #:
US20060050488
Pub Dt:
03/09/2006
Title:
HIGH CAPACITY THIN MODULE SYSTEM AND METHOD
2
Patent #:
7202555
Issue Dt:
04/10/2007
Application #:
11074026
Filing Dt:
03/08/2005
Publication #:
US20050146011
Pub Dt:
07/07/2005
Title:
PITCH CHANGE AND CHIP SCALE STACKING SYSTEM AND METHOD
3
Patent #:
7606040
Issue Dt:
10/20/2009
Application #:
11077952
Filing Dt:
03/11/2005
Publication #:
US20080278901
Pub Dt:
11/13/2008
Title:
MEMORY MODULE SYSTEM AND METHOD
4
Patent #:
7606049
Issue Dt:
10/20/2009
Application #:
11125018
Filing Dt:
05/09/2005
Publication #:
US20060049502
Pub Dt:
03/09/2006
Title:
MODULE THERMAL MANAGEMENT SYSTEM AND METHOD
5
Patent #:
7033861
Issue Dt:
04/25/2006
Application #:
11131812
Filing Dt:
05/18/2005
Title:
STACKED MODULE SYSTEMS AND METHOD
6
Patent #:
7423885
Issue Dt:
09/09/2008
Application #:
11157565
Filing Dt:
06/21/2005
Publication #:
US20060050498
Pub Dt:
03/09/2006
Title:
DIE MODULE SYSTEM
7
Patent #:
7606050
Issue Dt:
10/20/2009
Application #:
11187269
Filing Dt:
07/22/2005
Publication #:
US20060050592
Pub Dt:
03/09/2006
Title:
COMPACT MODULE SYSTEM AND METHOD
8
Patent #:
7495334
Issue Dt:
02/24/2009
Application #:
11197267
Filing Dt:
08/04/2005
Publication #:
US20050280135
Pub Dt:
12/22/2005
Title:
STACKING SYSTEM AND METHOD
9
Patent #:
7443023
Issue Dt:
10/28/2008
Application #:
11231418
Filing Dt:
09/21/2005
Publication #:
US20060091529
Pub Dt:
05/04/2006
Title:
HIGH CAPACITY THIN MODULE SYSTEM
10
Patent #:
7259452
Issue Dt:
08/21/2007
Application #:
11248662
Filing Dt:
10/11/2005
Publication #:
US20070080470
Pub Dt:
04/12/2007
Title:
LEADED PACKAGE INTEGRATED CIRCUIT STACKING
11
Patent #:
7542297
Issue Dt:
06/02/2009
Application #:
11255061
Filing Dt:
10/19/2005
Publication #:
US20060050489
Pub Dt:
03/09/2006
Title:
OPTIMIZED MOUNTING AREA CIRCUIT MODULE SYSTEM AND METHOD
12
Patent #:
7310458
Issue Dt:
12/18/2007
Application #:
11258438
Filing Dt:
10/25/2005
Publication #:
US20060108572
Pub Dt:
05/25/2006
Title:
STACKED MODULE SYSTEMS AND METHODS
13
Patent #:
7576995
Issue Dt:
08/18/2009
Application #:
11267476
Filing Dt:
11/04/2005
Publication #:
US20070103877
Pub Dt:
05/10/2007
Title:
FLEX CIRCUIT APPARATUS AND METHOD FOR ADDING CAPACITANCE WHILE CONSERVING CIRCUIT BOARD SURFACE AREA
14
Patent #:
7446410
Issue Dt:
11/04/2008
Application #:
11283355
Filing Dt:
11/18/2005
Publication #:
US20060090102
Pub Dt:
04/27/2006
Title:
CIRCUIT MODULE WITH THERMAL CASING SYSTEMS
15
Patent #:
7508058
Issue Dt:
03/24/2009
Application #:
11330307
Filing Dt:
01/11/2006
Publication #:
US20070170561
Pub Dt:
07/26/2007
Title:
STACKED INTEGRATED CIRCUIT MODULE
16
Patent #:
7616452
Issue Dt:
11/10/2009
Application #:
11331969
Filing Dt:
01/13/2006
Publication #:
US20060125067
Pub Dt:
06/15/2006
Title:
FLEX CIRCUIT CONSTRUCTIONS FOR HIGH CAPACITY CIRCUIT MODULE SYSTEMS AND METHODS
17
Patent #:
7579687
Issue Dt:
08/25/2009
Application #:
11332740
Filing Dt:
01/13/2006
Publication #:
US20060129888
Pub Dt:
06/15/2006
Title:
CIRCUIT MODULE TURBULENCE ENHACEMENT SYSTEMS AND METHODS
18
Patent #:
7511969
Issue Dt:
03/31/2009
Application #:
11345910
Filing Dt:
02/02/2006
Publication #:
US20070176286
Pub Dt:
08/02/2007
Title:
COMPOSITE CORE CIRCUIT MODULE SYSTEM AND METHOD
19
Patent #:
7289327
Issue Dt:
10/30/2007
Application #:
11364489
Filing Dt:
02/27/2006
Publication #:
US20070201208
Pub Dt:
08/30/2007
Title:
ACTIVE COOLING METHODS AND APPARATUS FOR MODULES
20
Patent #:
7323364
Issue Dt:
01/29/2008
Application #:
11411185
Filing Dt:
04/25/2006
Publication #:
US20060263938
Pub Dt:
11/23/2006
Title:
STACKED MODULE SYSTEMS AND METHOD
21
Patent #:
7608920
Issue Dt:
10/27/2009
Application #:
11434964
Filing Dt:
05/16/2006
Publication #:
US20070158802
Pub Dt:
07/12/2007
Title:
MEMORY CARD AND METHOD FOR DEVISING
22
Patent #:
7508069
Issue Dt:
03/24/2009
Application #:
11436946
Filing Dt:
05/18/2006
Publication #:
US20070159545
Pub Dt:
07/12/2007
Title:
MANAGED MEMORY COMPONENT
23
Patent #:
7304382
Issue Dt:
12/04/2007
Application #:
11436957
Filing Dt:
05/18/2006
Publication #:
US20070158800
Pub Dt:
07/12/2007
Title:
MANAGED MEMORY COMPONENT
24
Patent #:
7446403
Issue Dt:
11/04/2008
Application #:
11452531
Filing Dt:
06/14/2006
Publication #:
US20070290312
Pub Dt:
12/20/2007
Title:
CARRIER STRUCTURE STACKING SYSTEM AND METHOD
25
Patent #:
7375418
Issue Dt:
05/20/2008
Application #:
11452532
Filing Dt:
06/14/2006
Publication #:
US20070290313
Pub Dt:
12/20/2007
Title:
INTERPOSER STACKING SYSTEM AND METHOD
26
Patent #:
7193310
Issue Dt:
03/20/2007
Application #:
11489956
Filing Dt:
07/20/2006
Publication #:
US20060261461
Pub Dt:
11/23/2006
Title:
STACKING SYSTEM AND METHOD
27
Patent #:
7573129
Issue Dt:
08/11/2009
Application #:
11533743
Filing Dt:
09/20/2006
Publication #:
US20070290314
Pub Dt:
12/20/2007
Title:
CONTRAST INTERPOSER STACKING SYSTEM AND METHOD
28
Patent #:
7417310
Issue Dt:
08/26/2008
Application #:
11556124
Filing Dt:
11/02/2006
Publication #:
US20080122054
Pub Dt:
05/29/2008
Title:
CIRCUIT MODULE HAVING FORCE RESISTANT CONSTRUCTION
29
Patent #:
7468553
Issue Dt:
12/23/2008
Application #:
11682643
Filing Dt:
03/06/2007
Publication #:
US20080093724
Pub Dt:
04/24/2008
Title:
STACKABLE MICROPACKAGES AND STACKED MODULES
30
Patent #:
7508723
Issue Dt:
03/24/2009
Application #:
11753460
Filing Dt:
05/24/2007
Publication #:
US20080291747
Pub Dt:
11/27/2008
Title:
BUFFERED MEMORY DEVICE
31
Patent #:
7522421
Issue Dt:
04/21/2009
Application #:
11777925
Filing Dt:
07/13/2007
Publication #:
US20070258217
Pub Dt:
11/08/2007
Title:
SPLIT CORE CIRCUIT MODULE
32
Patent #:
7572671
Issue Dt:
08/11/2009
Application #:
11867534
Filing Dt:
10/04/2007
Publication #:
US20080036068
Pub Dt:
02/14/2008
Title:
STACKED MODULE SYSTEMS AND METHODS
33
Patent #:
7606042
Issue Dt:
10/20/2009
Application #:
11869644
Filing Dt:
10/09/2007
Publication #:
US20080030966
Pub Dt:
02/07/2008
Title:
HIGH CAPACITY THIN MODULE SYSTEM AND METHOD
34
Patent #:
7522425
Issue Dt:
04/21/2009
Application #:
11869687
Filing Dt:
10/09/2007
Publication #:
US20080030972
Pub Dt:
02/07/2008
Title:
HIGH CAPACITY THIN MODULE SYSTEM AND METHOD
35
Patent #:
7459784
Issue Dt:
12/02/2008
Application #:
11961477
Filing Dt:
12/20/2007
Publication #:
US20080094803
Pub Dt:
04/24/2008
Title:
HIGH CAPACITY THIN MODULE SYSTEM
Assignor
1
STAKTEK GROUP, L.P.
Exec Dt:
02/29/2008
Assignee
1
ENTORIAN TECHNOLOGIES L.P.
4030 WEST BRAKER LANE
BUILDING 2-100
AUSTIN, TEXAS 78759
Correspondence name and address
STEVEN LAUFF
816 CONGRESS AVE., SUITE 1205
CIVINS DENKO COBURN & LAUFF LLP
AUSTIN, TX 78701

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