Patent Assignment Details
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| Reel/Frame: | 064277/0070 | |
| Pages: | 14 |
| | Recorded: | 07/16/2023 | | |
| Attorney Dkt #: | 86304916US06 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/12/2023
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Application #:
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17525964
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Filing Dt:
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11/15/2021
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Publication #:
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Pub Dt:
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03/10/2022
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Title:
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HYBRID BONDING STRUCTURE AND HYBRID BONDING METHOD
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Assignee
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| HUAWEI ADMINISTRATION BUILDING,BANTIAN, LONGGANG DISTRICT, |
| SHENZHEN, CHINA 518129 |
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Correspondence name and address
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SHUANG LIU
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BUILDING A10-1 HUAWEI INDUSTRIAL BASE
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BANTIAN, LONGGANG DISTRICT
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SHENZHEN, 518129 CHINA
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