Patent Assignment Details
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| Reel/Frame: | 010590/0078 | |
| Pages: | 3 |
| | Recorded: | 01/21/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09461065
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Filing Dt:
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12/14/1999
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Publication #:
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Pub Dt:
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04/10/2003
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Title:
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HIGH DENSITY, HIGH FREQUENCY MEMORY CHIP MODULES HAVING THERMAL MANAGEMENT STRUCTURES
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Assignee
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| 107 N. AURORA ST. |
| ITHACA, NEW YORK 14850 |
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Correspondence name and address
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SALZMAN & LEVY
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MARK LEVY
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19 CHENANGO ST.
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BINGHAMTON, NY 13901
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