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Patent Assignment Details
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Reel/Frame:008374/0109   Pages: 3
Recorded: 12/20/1996
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/02/1999
Application #:
08772155
Filing Dt:
12/20/1996
Title:
APPARATUS FOR PRESERVING SOLDER PASTE IN THE MANUFACTURING OF PRINTED CIRCUIT BOARD ASSEMBLIES
Assignor
1
Exec Dt:
12/18/1996
Assignee
1
900 EAST KARCHER ROAD
NAMPA, IDAHO 83687
Correspondence name and address
SEED AND BERRY LLP
PAUL T. PARKER
6300 COLUMBIA CENTER
701 FIFTH AVENUE
SEATTLE, WASHINGTON 98104-7092

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