Patent Assignment Details
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Reel/Frame: | 056792/0117 | |
| Pages: | 4 |
| | Recorded: | 07/08/2021 | | |
Attorney Dkt #: | 252056-1520 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17370312
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Filing Dt:
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07/08/2021
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Publication #:
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Pub Dt:
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01/12/2023
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Title:
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CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
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Assignee
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NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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MCCLURE, QUALEY & RODACK, LLP
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280 INTERSTATE NORTH CIRCLE SE
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SUITE 550
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ATLANTA, GA 30339
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05/29/2024 06:19 PM
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