Patent Assignment Details
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| Reel/Frame: | 007060/0118 | |
| Pages: | 3 |
| | Recorded: | 06/30/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/27/1994
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Application #:
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08268489
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Filing Dt:
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06/30/1994
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Title:
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METHOD OF FORMING A LOW RESISTIVE CURRENT PATH BETWEEN A BURIED CONTACT AND A DIFFUSION REGION
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Assignee
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| MS507 |
| 2805 EAST COLUMBIA ROAD |
| BOISE, IDAHO 83706 |
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Correspondence name and address
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MICRON SEMICONDUCTOR, INC.
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DAVID J. PAUL, PATENT AGENT - MS507
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2805 EAST COLUMBIA ROAD
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BOISE, IDAHO 83706
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