Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 005687/0124 | |
| Pages: | 1 |
| | Recorded: | 04/25/1991 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/11/1992
|
Application #:
|
07691628
|
Filing Dt:
|
04/25/1991
|
Title:
|
LIQUID FILM INTERFACE COOLING SYSTEM FOR SEMICONDUCTOR WAFER PROCESSING
|
|
Assignee
|
|
|
A CORP. OF NY |
ARMONK, NEW YORK 10504 |
|
Correspondence name and address
|
|
RICHARD ROMANCHIK
|
|
INTELLECTUAL PROPERTY LAW
|
|
IBM CORPORATION DEPARTMENT 18G
|
|
BUILDING 300-482, ROUTE 52
|
|
HOPEWELL JUNCTION, NY 12533
|
Search Results as of:
05/23/2024 10:12 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|