Total properties:
1156
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10
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12
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Patent #:
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Issue Dt:
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03/17/2015
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Application #:
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14017797
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Filing Dt:
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09/04/2013
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Title:
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CONDUCTIVE PAD ON PROTRUDING THROUGH ELECTRODE SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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12/15/2015
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Application #:
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14017802
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Filing Dt:
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09/04/2013
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Title:
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FAN-OUT SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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04/29/2014
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Application #:
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14019136
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Filing Dt:
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09/05/2013
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Title:
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WAFER LEVEL PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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09/01/2015
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Application #:
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14021604
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Filing Dt:
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09/09/2013
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Title:
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SHIELDED PACKAGE HAVING SHIELD LID
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Patent #:
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Issue Dt:
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11/03/2015
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Application #:
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14028290
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Filing Dt:
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09/16/2013
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Title:
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SEMICONDUCTOR DEVICE HAVING OVERLAPPED VIA APERTURES
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Patent #:
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Issue Dt:
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06/02/2015
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Application #:
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14063394
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Filing Dt:
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10/25/2013
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Publication #:
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Pub Dt:
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01/15/2015
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Title:
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SEMICONDUCTOR DEVICE UTILZING REDISTRIBUTION LAYERS TO COUPLE STACKED DIE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14063829
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Filing Dt:
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10/25/2013
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Publication #:
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Pub Dt:
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01/22/2015
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Title:
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SEMICONDUCTOR DEVICE WITH PLATED CONDUCTIVE PILLAR COUPLING
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Patent #:
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Issue Dt:
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11/22/2016
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Application #:
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14063853
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Filing Dt:
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10/25/2013
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Publication #:
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Pub Dt:
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01/22/2015
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Title:
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SEMICONDUCTOR DEVICE WITH PLATED PILLARS AND LEADS
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Patent #:
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Issue Dt:
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11/29/2016
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Application #:
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14066767
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Filing Dt:
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10/30/2013
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Publication #:
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Pub Dt:
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04/30/2015
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Title:
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APPARATUS AND METHOD FOR TESTING SOUND TRANSDUCERS
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Patent #:
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Issue Dt:
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07/24/2018
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Application #:
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14069814
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Filing Dt:
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11/01/2013
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Title:
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EMBEDDED VIBRATION MANAGEMENT SYSTEM
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Patent #:
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Issue Dt:
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03/22/2016
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Application #:
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14072845
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Filing Dt:
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11/06/2013
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Publication #:
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Pub Dt:
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05/15/2014
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Title:
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LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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02/21/2017
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Application #:
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14082333
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Filing Dt:
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11/18/2013
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Title:
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EMBEDDED DIE IN PANEL METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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03/28/2017
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Application #:
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14082422
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Filing Dt:
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11/18/2013
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Title:
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STRESS RELIEVING THROUGH-SILICON VIAS
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Patent #:
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Issue Dt:
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09/08/2015
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Application #:
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14082482
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Filing Dt:
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11/18/2013
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Publication #:
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Pub Dt:
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05/22/2014
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Title:
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PACKAGE OF FINGER PRINT SENSOR AND FABRICATING METHOD THEREOF
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Patent #:
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Issue Dt:
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10/24/2017
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Application #:
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14083779
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Filing Dt:
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11/19/2013
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Publication #:
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Pub Dt:
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05/21/2015
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Title:
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SEMICONDUTOR DEVICE WITH THROUGH-SILICON VIA-LESS DEEP WELLS
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Patent #:
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Issue Dt:
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04/18/2017
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Application #:
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14083917
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Filing Dt:
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11/19/2013
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Publication #:
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Pub Dt:
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05/29/2014
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Title:
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SEMICONDUCTOR DEVICE USING EMC WAFER SUPPORT SYSTEM AND FABRICATING METHOD THEREOF
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Patent #:
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Issue Dt:
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11/24/2015
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Application #:
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14087147
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Filing Dt:
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11/22/2013
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Publication #:
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Pub Dt:
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01/22/2015
| | | | |
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Title:
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SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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10/27/2015
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Application #:
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14088882
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Filing Dt:
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11/25/2013
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Title:
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SEMICONDUCTOR DEVICE HAVING CONDUCTIVE PADS WITH NECK-DOWN PORTIONS TO PREVENT SOLDER REFLOW
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Patent #:
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Issue Dt:
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10/25/2016
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Application #:
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14097214
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Filing Dt:
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12/04/2013
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Publication #:
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Pub Dt:
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02/19/2015
| | | | |
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Title:
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ELECTRONIC DEVICE PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
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Patent #:
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Issue Dt:
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03/01/2016
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Application #:
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14106139
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Filing Dt:
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12/13/2013
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Title:
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SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH A COMBINATION OF LEADS AND LANDS AND METHOD
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Patent #:
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Issue Dt:
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02/24/2015
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Application #:
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14142457
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Filing Dt:
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12/27/2013
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Title:
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INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING THE SAME
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Patent #:
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Issue Dt:
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11/18/2014
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Application #:
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14152035
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Filing Dt:
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01/10/2014
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Title:
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COLUMN AND STACKING BALLS PACKAGE FABRICATION METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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09/06/2016
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Application #:
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14159237
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Filing Dt:
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01/20/2014
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Title:
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SEMICONDUCTOR DEVICE PACKAGE FORMED IN A CHIP-ON-WAFER LAST PROCESS USING THIN FILM ADHESIVES
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14172611
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Filing Dt:
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02/04/2014
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Publication #:
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Pub Dt:
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08/06/2015
| | | | |
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Title:
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THIN SANDWICH EMBEDDED PACKAGE
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Patent #:
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Issue Dt:
|
07/18/2017
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Application #:
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14172889
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Filing Dt:
|
02/04/2014
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|
Title:
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THIN BONDED INTERPOSER PACKAGE
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|
|
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Patent #:
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|
Issue Dt:
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01/27/2015
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Application #:
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14182083
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Filing Dt:
|
02/17/2014
|
|
Title:
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ELECTRONIC COMPONENT PACKAGE FABRICATION METHOD AND STRUCTURE
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|
|
|
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Patent #:
|
|
Issue Dt:
|
09/20/2016
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Application #:
|
14218265
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Filing Dt:
|
03/18/2014
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|
Publication #:
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Pub Dt:
|
09/25/2014
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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|
|
|
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Patent #:
|
|
Issue Dt:
|
07/11/2017
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Application #:
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14218292
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Filing Dt:
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03/18/2014
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Publication #:
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Pub Dt:
|
10/02/2014
| | | | |
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Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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|
|
|
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Patent #:
|
|
Issue Dt:
|
04/21/2015
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Application #:
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14246286
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Filing Dt:
|
04/07/2014
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Title:
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STACKABLE VIA PACKAGE AND METHOD
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Patent #:
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NONE
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Issue Dt:
|
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Application #:
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14255726
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Filing Dt:
|
04/17/2014
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Publication #:
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Pub Dt:
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10/22/2015
| | | | |
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Title:
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SINGULATED UNIT SUBSTRATE FOR A SEMICONDCUTOR DEVICE
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Patent #:
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|
Issue Dt:
|
07/24/2018
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Application #:
|
14264027
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Filing Dt:
|
04/28/2014
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Title:
|
FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLICATIONS
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Patent #:
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|
Issue Dt:
|
02/10/2015
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Application #:
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14264970
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Filing Dt:
|
04/29/2014
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Title:
|
WAFER LEVEL PACKAGE AND FABRICATION METHOD
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|
|
|
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Patent #:
|
|
Issue Dt:
|
11/10/2015
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Application #:
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14268877
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Filing Dt:
|
05/02/2014
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Publication #:
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Pub Dt:
|
11/06/2014
| | | | |
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Title:
|
MICRO LEAD FRAME STRUCTURE HAVING REINFORCING PORTIONS AND METHOD
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Patent #:
|
|
Issue Dt:
|
01/23/2018
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Application #:
|
14286263
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Filing Dt:
|
05/23/2014
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Publication #:
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|
Pub Dt:
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11/26/2015
| | | | |
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Title:
|
COPPER PILLAR SIDEWALL PROTECTION
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|
|
|
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Patent #:
|
|
Issue Dt:
|
10/17/2017
|
Application #:
|
14313363
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Filing Dt:
|
06/24/2014
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|
Publication #:
|
|
Pub Dt:
|
07/23/2015
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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|
|
|
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Patent #:
|
|
Issue Dt:
|
11/01/2016
|
Application #:
|
14313724
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Filing Dt:
|
06/24/2014
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|
Publication #:
|
|
Pub Dt:
|
08/06/2015
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/15/2016
|
Application #:
|
14337146
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Filing Dt:
|
07/21/2014
|
|
Publication #:
|
|
Pub Dt:
|
01/22/2015
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSULATION AND NON-PHOTOSENSITIVE PASSIVATION LAYERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/13/2018
|
Application #:
|
14339633
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Filing Dt:
|
07/24/2014
|
|
Title:
|
SEMICONDUCTOR PACKAGE LID THERMAL INTERFACE MATERIAL STANDOFFS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/28/2017
|
Application #:
|
14444450
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Filing Dt:
|
07/28/2014
|
|
Publication #:
|
|
Pub Dt:
|
09/10/2015
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE WITH THIN REDISTRIBUTION LAYERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/13/2018
|
Application #:
|
14447415
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Filing Dt:
|
07/30/2014
|
|
Publication #:
|
|
Pub Dt:
|
02/05/2015
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE STRUCTURE FOR IMPROVING DIE WARPAGE AND MANUFACTURING METHOD THEREOF
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|
|
|
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Patent #:
|
|
Issue Dt:
|
07/07/2020
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Application #:
|
14449654
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Filing Dt:
|
08/01/2014
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Publication #:
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Pub Dt:
|
08/06/2015
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DUMMY SUBSTRATES
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|
|
|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
14452933
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Filing Dt:
|
08/06/2014
|
|
Publication #:
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|
Pub Dt:
|
02/12/2015
| | | | |
|
Title:
|
Semiconductor Package with Reduced Thickness
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|
|
|
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Patent #:
|
|
Issue Dt:
|
12/06/2016
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Application #:
|
14455975
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Filing Dt:
|
08/11/2014
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|
Publication #:
|
|
Pub Dt:
|
02/12/2015
| | | | |
|
Title:
|
MICROFLUIDIC SENSOR PACKAGE STRUCTURE AND METHOD
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|
|
|
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Patent #:
|
|
Issue Dt:
|
08/09/2016
|
Application #:
|
14456226
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Filing Dt:
|
08/11/2014
|
|
Publication #:
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|
Pub Dt:
|
02/12/2015
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
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|
|
|
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Patent #:
|
|
Issue Dt:
|
05/17/2016
|
Application #:
|
14477363
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Filing Dt:
|
09/04/2014
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|
Publication #:
|
|
Pub Dt:
|
10/01/2015
| | | | |
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Title:
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MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBY
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|
|
|
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Patent #:
|
|
Issue Dt:
|
10/02/2018
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Application #:
|
14496764
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Filing Dt:
|
09/25/2014
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|
Publication #:
|
|
Pub Dt:
|
03/26/2015
| | | | |
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Title:
|
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN EXTENDED SUBSTRATE AND A BOTTOM SUBSTRATE
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|
|
|
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Patent #:
|
|
Issue Dt:
|
10/04/2016
|
Application #:
|
14517403
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Filing Dt:
|
10/17/2014
|
|
Title:
|
EXTENDED LANDING PAD SUBSTRATE PACKAGE STRUCTURE AND METHOD
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/10/2015
|
Application #:
|
14521417
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Filing Dt:
|
10/22/2014
|
|
Publication #:
|
|
Pub Dt:
|
04/30/2015
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/22/2016
|
Application #:
|
14522572
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Filing Dt:
|
10/23/2014
|
|
Publication #:
|
|
Pub Dt:
|
04/23/2015
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE WITH EMBEDDED SEMICONDUCTOR DIE AND SUBSTRATE-TO-SUBSTRATE INTERCONNECTS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/16/2016
|
Application #:
|
14524443
|
Filing Dt:
|
10/27/2014
|
|
Publication #:
|
|
Pub Dt:
|
08/06/2015
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE WITH REDUCED THICKNESS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/11/2017
|
Application #:
|
14532532
|
Filing Dt:
|
11/04/2014
|
|
Publication #:
|
|
Pub Dt:
|
05/07/2015
| | | | |
|
Title:
|
INTERPOSER, MANUFACTURING METHOD THEREOF, SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD FOR FABRICATING THE SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
14538018
|
Filing Dt:
|
11/11/2014
|
|
Publication #:
|
|
Pub Dt:
|
05/14/2015
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/16/2016
|
Application #:
|
14565725
|
Filing Dt:
|
12/10/2014
|
|
Publication #:
|
|
Pub Dt:
|
07/02/2015
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/29/2019
|
Application #:
|
14581305
|
Filing Dt:
|
12/23/2014
|
|
Title:
|
ENCAPSULATED SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/07/2017
|
Application #:
|
14581556
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Filing Dt:
|
12/23/2014
|
|
Title:
|
ENCAPSULATED SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/09/2015
|
Application #:
|
14586263
|
Filing Dt:
|
12/30/2014
|
|
Title:
|
WAFER LEVEL PACKAGE AND FABRICATION METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/18/2017
|
Application #:
|
14592571
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Filing Dt:
|
01/08/2015
|
|
Publication #:
|
|
Pub Dt:
|
02/18/2016
| | | | |
|
Title:
|
LASER ASSISTED BONDING FOR SEMICONDUCTOR DIE INTERCONNECTIONS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
12/29/2015
|
Application #:
|
14592648
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Filing Dt:
|
01/08/2015
|
|
Title:
|
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/30/2016
|
Application #:
|
14593310
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Filing Dt:
|
01/09/2015
|
|
Publication #:
|
|
Pub Dt:
|
01/28/2016
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE HAVING SINGLE LAYER SUBSTRATE AND METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/07/2017
|
Application #:
|
14602233
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Filing Dt:
|
01/21/2015
|
|
Publication #:
|
|
Pub Dt:
|
07/23/2015
| | | | |
|
Title:
|
EMBEDDED TRACE SUBSTRATE AND METHOD OF FORMING THE SAME
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|
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|
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Patent #:
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|
Issue Dt:
|
08/30/2016
|
Application #:
|
14615127
|
Filing Dt:
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02/05/2015
|
|
Title:
|
CONDUCTIVE PAD ON PROTRUDING THROUGH ELECTRODE
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Patent #:
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Issue Dt:
|
08/08/2017
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Application #:
|
14657032
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Filing Dt:
|
03/13/2015
|
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Title:
|
STACKABLE VIA PACKAGE AND METHOD
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Patent #:
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Issue Dt:
|
06/07/2016
|
Application #:
|
14659693
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Filing Dt:
|
03/17/2015
|
|
Publication #:
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Pub Dt:
|
07/09/2015
| | | | |
|
Title:
|
REVERSIBLE TOP/BOTTOM MEMS PACKAGE
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Patent #:
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Issue Dt:
|
01/03/2017
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Application #:
|
14671095
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Filing Dt:
|
03/27/2015
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Publication #:
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Pub Dt:
|
07/16/2015
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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|
|
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Patent #:
|
|
Issue Dt:
|
09/11/2018
|
Application #:
|
14686725
|
Filing Dt:
|
04/14/2015
|
|
Publication #:
|
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Pub Dt:
|
10/20/2016
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
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Patent #:
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Issue Dt:
|
11/08/2016
|
Application #:
|
14692152
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Filing Dt:
|
04/21/2015
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|
Publication #:
|
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Pub Dt:
|
02/25/2016
| | | | |
|
Title:
|
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE THEREOF
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Patent #:
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|
Issue Dt:
|
01/02/2018
|
Application #:
|
14694269
|
Filing Dt:
|
04/23/2015
|
|
Publication #:
|
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Pub Dt:
|
08/04/2016
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
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|
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|
Patent #:
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|
Issue Dt:
|
05/24/2016
|
Application #:
|
14698188
|
Filing Dt:
|
04/28/2015
|
|
Title:
|
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
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|
|
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|
Patent #:
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|
Issue Dt:
|
05/08/2018
|
Application #:
|
14698634
|
Filing Dt:
|
04/28/2015
|
|
Title:
|
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
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|
|
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|
Patent #:
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|
Issue Dt:
|
05/24/2016
|
Application #:
|
14710361
|
Filing Dt:
|
05/12/2015
|
|
Title:
|
MOLDED CAVITY SUBSTRATE MEMS PACKAGE FABRICATION METHOD AND STRUCTURE
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Patent #:
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|
Issue Dt:
|
07/12/2016
|
Application #:
|
14719539
|
Filing Dt:
|
05/22/2015
|
|
Publication #:
|
|
Pub Dt:
|
09/10/2015
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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|
Patent #:
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|
Issue Dt:
|
04/25/2017
|
Application #:
|
14722110
|
Filing Dt:
|
05/26/2015
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Publication #:
|
|
Pub Dt:
|
10/01/2015
| | | | |
|
Title:
|
LEAD FRAME PACKAGE HAVING DISCHARGE HOLE AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
|
07/18/2017
|
Application #:
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14725156
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Filing Dt:
|
05/29/2015
|
|
Publication #:
|
|
Pub Dt:
|
05/19/2016
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DIE DIRECTLY ATTACHED TO LEAD FRAME AND METHOD
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Patent #:
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Issue Dt:
|
11/17/2015
|
Application #:
|
14725531
|
Filing Dt:
|
05/29/2015
|
|
Publication #:
|
|
Pub Dt:
|
09/17/2015
| | | | |
|
Title:
|
Semiconductor Device Utilizing Redistribution Layers To Couple Stacked Die
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|
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|
Patent #:
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|
Issue Dt:
|
08/02/2016
|
Application #:
|
14734192
|
Filing Dt:
|
06/09/2015
|
|
Title:
|
WAFER LEVEL PACKAGE AND FABRICATION METHOD
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|
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|
Patent #:
|
NONE
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Issue Dt:
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|
Application #:
|
14739345
|
Filing Dt:
|
06/15/2015
|
|
Publication #:
|
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Pub Dt:
|
10/01/2015
| | | | |
|
Title:
|
Semiconductor Package And Manufacturing Method Thereof
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Patent #:
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Issue Dt:
|
07/25/2017
|
Application #:
|
14810664
|
Filing Dt:
|
07/28/2015
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Publication #:
|
|
Pub Dt:
|
01/28/2016
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE REDISTRIBUTION LAYER WITH NARROW TRACE WIDTH RELATIVE TO PASSIVATION LAYER OPENING
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Patent #:
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Issue Dt:
|
10/11/2016
|
Application #:
|
14815435
|
Filing Dt:
|
07/31/2015
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|
Publication #:
|
|
Pub Dt:
|
06/09/2016
| | | | |
|
Title:
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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Patent #:
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|
Issue Dt:
|
08/30/2016
|
Application #:
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14817477
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Filing Dt:
|
08/04/2015
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|
Publication #:
|
|
Pub Dt:
|
11/26/2015
| | | | |
|
Title:
|
PACKAGE OF FINGER PRINT SENSOR AND FABRICATING METHOD THEREOF
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Patent #:
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|
Issue Dt:
|
12/15/2020
|
Application #:
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14822487
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Filing Dt:
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08/10/2015
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Publication #:
|
|
Pub Dt:
|
03/17/2016
| | | | |
|
Title:
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METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
|
01/10/2017
|
Application #:
|
14823689
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Filing Dt:
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08/11/2015
|
|
Title:
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SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
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|
Patent #:
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|
Issue Dt:
|
08/22/2017
|
Application #:
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14828984
|
Filing Dt:
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08/18/2015
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Publication #:
|
|
Pub Dt:
|
02/25/2016
| | | | |
|
Title:
|
METHOD OF MANUFACTURING A PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PACKAGE
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Patent #:
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|
Issue Dt:
|
08/20/2019
|
Application #:
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14835923
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Filing Dt:
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08/26/2015
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Publication #:
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|
Pub Dt:
|
05/12/2016
| | | | |
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Title:
|
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND INTERCONNECTION STRUCTURES THEREOF
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Patent #:
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Issue Dt:
|
06/06/2017
|
Application #:
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14839956
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Filing Dt:
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08/29/2015
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Publication #:
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Pub Dt:
|
12/24/2015
| | | | |
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Title:
|
MICRO LEAD FRAME STRUCTURE HAVING REINFORCING PORTIONS AND METHOD
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Patent #:
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Issue Dt:
|
07/03/2018
|
Application #:
|
14846543
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Filing Dt:
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09/04/2015
|
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Title:
|
EMBEDDED COMPONENT PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
|
01/10/2017
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Application #:
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14875672
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Filing Dt:
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10/05/2015
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Publication #:
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Pub Dt:
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04/28/2016
| | | | |
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
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Patent #:
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|
Issue Dt:
|
04/25/2017
|
Application #:
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14877373
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Filing Dt:
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10/07/2015
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Publication #:
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Pub Dt:
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04/14/2016
| | | | |
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Title:
|
Stacked Semiconductor Package and Manufacturing Method Thereof
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Patent #:
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Issue Dt:
|
12/05/2017
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Application #:
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14924994
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Filing Dt:
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10/28/2015
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Title:
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SEMICONDUCTOR DEVICE HAVING OVERLAPPED VIA APERTURES
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Patent #:
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Issue Dt:
|
09/22/2020
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Application #:
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14931112
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Filing Dt:
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11/03/2015
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Publication #:
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Pub Dt:
|
05/12/2016
| | | | |
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Title:
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WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
|
05/08/2018
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Application #:
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14931750
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Filing Dt:
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11/03/2015
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Publication #:
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Pub Dt:
|
05/04/2017
| | | | |
|
Title:
|
PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING STRUCTURE
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
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14935912
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Filing Dt:
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11/09/2015
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Publication #:
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Pub Dt:
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05/11/2017
| | | | |
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Title:
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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08/22/2017
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Application #:
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14942863
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Filing Dt:
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11/16/2015
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Publication #:
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Pub Dt:
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05/18/2017
| | | | |
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Title:
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Encapsulated Semiconductor Package and Method of Manufacturing Thereof
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Patent #:
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Issue Dt:
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01/09/2018
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Application #:
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14963037
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Filing Dt:
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12/08/2015
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Publication #:
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Pub Dt:
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06/08/2017
| | | | |
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Title:
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TRANSIENT INTERFACE GRADIENT BONDING FOR METAL BONDS
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Patent #:
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Issue Dt:
|
03/05/2019
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Application #:
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14965617
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Filing Dt:
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12/10/2015
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Title:
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WAFER LEVEL FAN OUT PACKAGE AND METHOD OF FABRICATING WAFER LEVEL FAN OUT PACKAGE
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Patent #:
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Issue Dt:
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01/24/2017
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Application #:
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14967293
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Filing Dt:
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12/12/2015
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Publication #:
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Pub Dt:
|
08/04/2016
| | | | |
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Title:
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PACKAGED ELECTRONIC DEVICE HAVING REDUCED PARASITIC EFFECTS AND METHOD
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Patent #:
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Issue Dt:
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08/02/2016
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Application #:
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14976491
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Filing Dt:
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12/21/2015
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Publication #:
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Pub Dt:
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04/21/2016
| | | | |
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Title:
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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09/18/2018
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Application #:
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14977977
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Filing Dt:
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12/22/2015
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Publication #:
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Pub Dt:
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06/30/2016
| | | | |
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Title:
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
|
11/29/2016
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Application #:
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14983937
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Filing Dt:
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12/30/2015
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Title:
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SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH A COMBINATION OF LEADS AND LANDS AND METHOD
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Patent #:
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Issue Dt:
|
03/20/2018
|
Application #:
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14984064
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Filing Dt:
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12/30/2015
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Publication #:
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Pub Dt:
|
09/22/2016
| | | | |
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Title:
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ELECTRONIC PACKAGE STRUCTURE HAVING INSULATED SUBSTRATE WITH LANDS AND CONDUCTIVE PATTERNS
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Patent #:
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Issue Dt:
|
03/27/2018
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Application #:
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14984554
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Filing Dt:
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12/30/2015
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Publication #:
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Pub Dt:
|
09/08/2016
| | | | |
|
Title:
|
CHIP-SCALE ELECTRONIC PACKAGE STRUCTURE WITH CONDUCTIVE CONNECTIVE ELEMENT HAVING INCREASED SURFACE AREA AND LATERALLY SPACED CONNECTION POINTS FOR IMPROVED CONNECTIVITY
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