Total properties:
1156
Page
11
of
12
Pages:
1 2 3 4 5 6 7 8 9 10 11 12
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/13/2018
|
Application #:
|
14988563
|
Filing Dt:
|
01/05/2016
|
|
Title:
|
TRACE STACKING STRUCTURE AND METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/31/2017
|
Application #:
|
14989455
|
Filing Dt:
|
01/06/2016
|
|
Title:
|
SEMICONDUCTOR PRODUCT WITH INTERLOCKING METAL-TO-METAL BONDS AND METHOD FOR MANUFACTURING THEREOF
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
14995806
|
Filing Dt:
|
01/14/2016
|
|
Publication #:
|
|
Pub Dt:
|
07/21/2016
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15009012
|
Filing Dt:
|
01/28/2016
|
|
Publication #:
|
|
Pub Dt:
|
08/04/2016
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/16/2018
|
Application #:
|
15018635
|
Filing Dt:
|
02/08/2016
|
|
Publication #:
|
|
Pub Dt:
|
08/11/2016
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE USING A CONTACT IN A PLEATED SIDEWALL ENCAPSULANT OPENING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/03/2017
|
Application #:
|
15018668
|
Filing Dt:
|
02/08/2016
|
|
Publication #:
|
|
Pub Dt:
|
08/11/2016
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE USING A CORELESS SIGNAL DISTRIBUTION STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/26/2018
|
Application #:
|
15041649
|
Filing Dt:
|
02/11/2016
|
|
Publication #:
|
|
Pub Dt:
|
09/22/2016
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/06/2018
|
Application #:
|
15043572
|
Filing Dt:
|
02/14/2016
|
|
Title:
|
LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/25/2017
|
Application #:
|
15049872
|
Filing Dt:
|
02/22/2016
|
|
Publication #:
|
|
Pub Dt:
|
08/25/2016
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15051216
|
Filing Dt:
|
02/23/2016
|
|
Publication #:
|
|
Pub Dt:
|
06/16/2016
| | | | |
|
Title:
|
Molded Electronic Package Geometry To Control Warpage And Die Stress
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/03/2017
|
Application #:
|
15052219
|
Filing Dt:
|
02/24/2016
|
|
Publication #:
|
|
Pub Dt:
|
09/01/2016
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/14/2017
|
Application #:
|
15066724
|
Filing Dt:
|
03/10/2016
|
|
Publication #:
|
|
Pub Dt:
|
09/14/2017
| | | | |
|
Title:
|
ELECTRONIC DEVICE WITH A PLURALITY OF REDISTRIBUTION STRUCTURES HAVING DIFFERENT RESPECTIVE SIZES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/02/2019
|
Application #:
|
15069416
|
Filing Dt:
|
03/14/2016
|
|
Publication #:
|
|
Pub Dt:
|
09/14/2017
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/14/2017
|
Application #:
|
15069895
|
Filing Dt:
|
03/14/2016
|
|
Publication #:
|
|
Pub Dt:
|
07/07/2016
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSULATION AND NON-PHOTOSENSITIVE PASSIVATION LAYERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/14/2017
|
Application #:
|
15070368
|
Filing Dt:
|
03/15/2016
|
|
Publication #:
|
|
Pub Dt:
|
09/22/2016
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/16/2017
|
Application #:
|
15073219
|
Filing Dt:
|
03/17/2016
|
|
Publication #:
|
|
Pub Dt:
|
09/22/2016
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/29/2021
|
Application #:
|
15078474
|
Filing Dt:
|
03/23/2016
|
|
Publication #:
|
|
Pub Dt:
|
09/29/2016
| | | | |
|
Title:
|
ELECTRONIC DEVICE WITH INTERCONNECTION STRUCTURE OBLATE ELLIPSOID-SHAPED APERTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/22/2019
|
Application #:
|
15092183
|
Filing Dt:
|
04/06/2016
|
|
Publication #:
|
|
Pub Dt:
|
10/13/2016
| | | | |
|
Title:
|
FINGER PRINT SENSOR AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/13/2018
|
Application #:
|
15130637
|
Filing Dt:
|
04/15/2016
|
|
Publication #:
|
|
Pub Dt:
|
10/19/2017
| | | | |
|
Title:
|
SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF SEMICONDUCTOR DIE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2019
|
Application #:
|
15131967
|
Filing Dt:
|
04/18/2016
|
|
Publication #:
|
|
Pub Dt:
|
11/17/2016
| | | | |
|
Title:
|
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/08/2019
|
Application #:
|
15133081
|
Filing Dt:
|
04/19/2016
|
|
Publication #:
|
|
Pub Dt:
|
11/24/2016
| | | | |
|
Title:
|
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE HAVING A MULTI-LAYER MOLDED CONDUCTIVE SUBSTRATE AND STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/13/2018
|
Application #:
|
15134330
|
Filing Dt:
|
04/20/2016
|
|
Publication #:
|
|
Pub Dt:
|
10/26/2017
| | | | |
|
Title:
|
METHOD OF FORMING A SEMICONDUCTOR PACKAGE WITH CONDUCTIVE INTERCONNECT FRAME AND STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/15/2017
|
Application #:
|
15143682
|
Filing Dt:
|
05/02/2016
|
|
Publication #:
|
|
Pub Dt:
|
12/29/2016
| | | | |
|
Title:
|
MOLDED SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/08/2017
|
Application #:
|
15144565
|
Filing Dt:
|
05/02/2016
|
|
Publication #:
|
|
Pub Dt:
|
12/08/2016
| | | | |
|
Title:
|
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2019
|
Application #:
|
15148747
|
Filing Dt:
|
05/06/2016
|
|
Publication #:
|
|
Pub Dt:
|
11/09/2017
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE UTILIZING AN ADHESIVE TO ATTACH AN UPPER PACKAGE TO A LOWER DIE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/10/2018
|
Application #:
|
15148824
|
Filing Dt:
|
05/06/2016
|
|
Publication #:
|
|
Pub Dt:
|
04/27/2017
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/04/2017
|
Application #:
|
15148895
|
Filing Dt:
|
05/06/2016
|
|
Title:
|
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15149038
|
Filing Dt:
|
05/06/2016
|
|
Publication #:
|
|
Pub Dt:
|
07/13/2017
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15149054
|
Filing Dt:
|
05/06/2016
|
|
Publication #:
|
|
Pub Dt:
|
07/13/2017
| | | | |
|
Title:
|
CAPACITOR OF SEMICONDUCTOR INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2018
|
Application #:
|
15149141
|
Filing Dt:
|
05/08/2016
|
|
Publication #:
|
|
Pub Dt:
|
01/19/2017
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/03/2018
|
Application #:
|
15149144
|
Filing Dt:
|
05/08/2016
|
|
Publication #:
|
|
Pub Dt:
|
05/18/2017
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/13/2018
|
Application #:
|
15149147
|
Filing Dt:
|
05/08/2016
|
|
Publication #:
|
|
Pub Dt:
|
06/15/2017
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15149158
|
Filing Dt:
|
05/08/2016
|
|
Publication #:
|
|
Pub Dt:
|
12/29/2016
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15149378
|
Filing Dt:
|
05/09/2016
|
|
Publication #:
|
|
Pub Dt:
|
05/18/2017
| | | | |
|
Title:
|
METHOD OF FORMING A SEMICONDUCTOR DEVICE INCLUDING FORMING AN ELECTROMAGNETIC INTERFERENCE (EMI) SHIELD LAYER OVER AN ENCAPSULATED DIE ON AN ADHESIVE TAPE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15149436
|
Filing Dt:
|
05/09/2016
|
|
Publication #:
|
|
Pub Dt:
|
07/06/2017
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING AN ETCHED GROOVE FOR AN EMBEDDED DEVICE FORMED ON BOTTOM SURFACE OF A SUPPORT SUBSTRATE AND A METHOD FOR FABRICATING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/07/2017
|
Application #:
|
15149669
|
Filing Dt:
|
05/09/2016
|
|
Publication #:
|
|
Pub Dt:
|
11/09/2017
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/24/2017
|
Application #:
|
15162424
|
Filing Dt:
|
05/23/2016
|
|
Title:
|
Semiconductor Device Package and Manufacturing Method Thereof
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/10/2019
|
Application #:
|
15173116
|
Filing Dt:
|
06/03/2016
|
|
Publication #:
|
|
Pub Dt:
|
12/07/2017
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/05/2019
|
Application #:
|
15173281
|
Filing Dt:
|
06/03/2016
|
|
Publication #:
|
|
Pub Dt:
|
01/05/2017
| | | | |
|
Title:
|
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE HAVING A MULTI-LAYER ENCAPSULATED CONDUCTIVE SUBSTRATE AND STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/14/2018
|
Application #:
|
15173379
|
Filing Dt:
|
06/03/2016
|
|
Publication #:
|
|
Pub Dt:
|
03/09/2017
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBSTRATE AND METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/03/2017
|
Application #:
|
15174911
|
Filing Dt:
|
06/06/2016
|
|
Publication #:
|
|
Pub Dt:
|
12/08/2016
| | | | |
|
Title:
|
Reversible Top/Bottom MEMS Package
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15202245
|
Filing Dt:
|
07/05/2016
|
|
Publication #:
|
|
Pub Dt:
|
11/24/2016
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE INCLUDING PREMOLD AND METHOD OF MANUFACTURING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/16/2017
|
Application #:
|
15207186
|
Filing Dt:
|
07/11/2016
|
|
Title:
|
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/08/2017
|
Application #:
|
15207287
|
Filing Dt:
|
07/11/2016
|
|
Publication #:
|
|
Pub Dt:
|
11/03/2016
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/16/2018
|
Application #:
|
15207462
|
Filing Dt:
|
07/11/2016
|
|
Publication #:
|
|
Pub Dt:
|
01/11/2018
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE WITH CLIP ALIGNMENT NOTCH
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/30/2018
|
Application #:
|
15211534
|
Filing Dt:
|
07/15/2016
|
|
Publication #:
|
|
Pub Dt:
|
11/03/2016
| | | | |
|
Title:
|
Semiconductor Package and Manufacturing Method Thereof
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/18/2019
|
Application #:
|
15214567
|
Filing Dt:
|
07/20/2016
|
|
Title:
|
TOP PORT MEMS PACKAGE AND METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/28/2018
|
Application #:
|
15219511
|
Filing Dt:
|
07/26/2016
|
|
Publication #:
|
|
Pub Dt:
|
02/01/2018
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/02/2018
|
Application #:
|
15225228
|
Filing Dt:
|
08/01/2016
|
|
Publication #:
|
|
Pub Dt:
|
07/27/2017
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/16/2018
|
Application #:
|
15225284
|
Filing Dt:
|
08/01/2016
|
|
Title:
|
WAFER LEVEL PACKAGE AND FABRICATION METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/05/2017
|
Application #:
|
15225565
|
Filing Dt:
|
08/01/2016
|
|
Publication #:
|
|
Pub Dt:
|
11/24/2016
| | | | |
|
Title:
|
PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15233271
|
Filing Dt:
|
08/10/2016
|
|
Publication #:
|
|
Pub Dt:
|
02/15/2018
| | | | |
|
Title:
|
Method and System for Packing Optimization of Semiconductor Devices
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/24/2019
|
Application #:
|
15236664
|
Filing Dt:
|
08/15/2016
|
|
Publication #:
|
|
Pub Dt:
|
12/01/2016
| | | | |
|
Title:
|
SHIELDED ELECTRONIC COMPONENT PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/18/2017
|
Application #:
|
15240534
|
Filing Dt:
|
08/18/2016
|
|
Publication #:
|
|
Pub Dt:
|
01/05/2017
| | | | |
|
Title:
|
Method of manufacturing a semiconductor package
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/28/2017
|
Application #:
|
15248687
|
Filing Dt:
|
08/26/2016
|
|
Publication #:
|
|
Pub Dt:
|
12/15/2016
| | | | |
|
Title:
|
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/27/2018
|
Application #:
|
15249201
|
Filing Dt:
|
08/26/2016
|
|
Publication #:
|
|
Pub Dt:
|
03/01/2018
| | | | |
|
Title:
|
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURED THEREBY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/17/2018
|
Application #:
|
15250397
|
Filing Dt:
|
08/29/2016
|
|
Title:
|
SEMICONDUCTOR DEVICE COMPRISING A CONDUCTIVE PAD ON A PROTRUDING-THROUGH ELECTRODE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/01/2018
|
Application #:
|
15256970
|
Filing Dt:
|
09/06/2016
|
|
Publication #:
|
|
Pub Dt:
|
03/08/2018
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/22/2018
|
Application #:
|
15258001
|
Filing Dt:
|
09/07/2016
|
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/19/2017
|
Application #:
|
15261965
|
Filing Dt:
|
09/11/2016
|
|
Publication #:
|
|
Pub Dt:
|
12/29/2016
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE IN PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/05/2019
|
Application #:
|
15284242
|
Filing Dt:
|
10/03/2016
|
|
Title:
|
FINE PITCH COPPER PILLAR PACKAGE AND METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/19/2019
|
Application #:
|
15285110
|
Filing Dt:
|
10/04/2016
|
|
Title:
|
ROBUST PILLAR STRUCTURE FOR SEMICONDUCTOR DEVICE CONTACTS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/27/2018
|
Application #:
|
15289738
|
Filing Dt:
|
10/10/2016
|
|
Publication #:
|
|
Pub Dt:
|
03/02/2017
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/25/2017
|
Application #:
|
15293524
|
Filing Dt:
|
10/14/2016
|
|
Title:
|
SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH A COMBINATION OF LEADS AND LANDS AND METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/10/2018
|
Application #:
|
15297365
|
Filing Dt:
|
10/19/2016
|
|
Publication #:
|
|
Pub Dt:
|
10/12/2017
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2018
|
Application #:
|
15340785
|
Filing Dt:
|
11/01/2016
|
|
Publication #:
|
|
Pub Dt:
|
03/02/2017
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/05/2017
|
Application #:
|
15346507
|
Filing Dt:
|
11/08/2016
|
|
Publication #:
|
|
Pub Dt:
|
04/27/2017
| | | | |
|
Title:
|
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/31/2018
|
Application #:
|
15350647
|
Filing Dt:
|
11/14/2016
|
|
Publication #:
|
|
Pub Dt:
|
05/17/2018
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15351026
|
Filing Dt:
|
11/14/2016
|
|
Publication #:
|
|
Pub Dt:
|
05/17/2018
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2019
|
Application #:
|
15357551
|
Filing Dt:
|
11/21/2016
|
|
Publication #:
|
|
Pub Dt:
|
06/08/2017
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE WITH EMBEDDED SEMICONDUCTOR DIE AND SUBSTRATE-TO-SUBSTRATE INTERCONNECTS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/27/2018
|
Application #:
|
15368583
|
Filing Dt:
|
12/03/2016
|
|
Publication #:
|
|
Pub Dt:
|
09/14/2017
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHMENT ANGLE AND METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/27/2018
|
Application #:
|
15373713
|
Filing Dt:
|
12/09/2016
|
|
Publication #:
|
|
Pub Dt:
|
06/14/2018
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/19/2019
|
Application #:
|
15383923
|
Filing Dt:
|
12/19/2016
|
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/08/2019
|
Application #:
|
15387016
|
Filing Dt:
|
12/21/2016
|
|
Publication #:
|
|
Pub Dt:
|
07/06/2017
| | | | |
|
Title:
|
SEMICONDUCTOR PRODUCT WITH INTERLOCKING METAL-TO-METAL BONDS AND METHOD FOR MANUFACTURING THEREOF
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15390568
|
Filing Dt:
|
12/26/2016
|
|
Publication #:
|
|
Pub Dt:
|
04/27/2017
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/08/2018
|
Application #:
|
15397052
|
Filing Dt:
|
01/03/2017
|
|
Publication #:
|
|
Pub Dt:
|
05/04/2017
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15398845
|
Filing Dt:
|
01/05/2017
|
|
Publication #:
|
|
Pub Dt:
|
09/28/2017
| | | | |
|
Title:
|
EMBEDDED DIE IN PANEL METHOD AND STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/26/2017
|
Application #:
|
15400041
|
Filing Dt:
|
01/06/2017
|
|
Publication #:
|
|
Pub Dt:
|
05/11/2017
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/04/2020
|
Application #:
|
15404242
|
Filing Dt:
|
01/12/2017
|
|
Publication #:
|
|
Pub Dt:
|
07/12/2018
| | | | |
|
Title:
|
Semiconductor Package With EMI Shield and Fabricating Method Thereof
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/02/2018
|
Application #:
|
15413767
|
Filing Dt:
|
01/24/2017
|
|
Publication #:
|
|
Pub Dt:
|
06/29/2017
| | | | |
|
Title:
|
Semiconductor Device Package and Manufacturing Method Thereof
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/09/2020
|
Application #:
|
15429591
|
Filing Dt:
|
02/10/2017
|
|
Publication #:
|
|
Pub Dt:
|
06/01/2017
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE HAVING AN ENCAPSULATED FRONT SIDE AND INTERPOSER AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/12/2019
|
Application #:
|
15445568
|
Filing Dt:
|
02/28/2017
|
|
Publication #:
|
|
Pub Dt:
|
08/30/2018
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE HAVING STACKED DIES AND STACKED PILLARS AND METHOD OF MANUFACTURING THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/08/2020
|
Application #:
|
15447931
|
Filing Dt:
|
03/02/2017
|
|
Publication #:
|
|
Pub Dt:
|
06/22/2017
| | | | |
|
Title:
|
APPARATUS, METHOD AND SYSTEM FOR CALIBRATING A LIQUID DISPENSING SYSTEM
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/03/2018
|
Application #:
|
15448177
|
Filing Dt:
|
03/02/2017
|
|
Title:
|
SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPARTMENTS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/22/2018
|
Application #:
|
15457937
|
Filing Dt:
|
03/13/2017
|
|
Title:
|
SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH A COMBINATION OF LEADS AND LANDS AND METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/06/2018
|
Application #:
|
15460032
|
Filing Dt:
|
03/15/2017
|
|
Publication #:
|
|
Pub Dt:
|
09/20/2018
| | | | |
|
Title:
|
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE USING GANGED CONDUCTIVE CONNECTIVE ASSEMBLY AND STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/31/2023
|
Application #:
|
15465307
|
Filing Dt:
|
03/21/2017
|
|
Publication #:
|
|
Pub Dt:
|
09/27/2018
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/09/2019
|
Application #:
|
15467794
|
Filing Dt:
|
03/23/2017
|
|
Publication #:
|
|
Pub Dt:
|
09/27/2018
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE WITH TIERED PILLAR AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/20/2018
|
Application #:
|
15468433
|
Filing Dt:
|
03/24/2017
|
|
Title:
|
STRESS RELIEVING THROUGH-SILICON VIAS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/08/2019
|
Application #:
|
15469008
|
Filing Dt:
|
03/24/2017
|
|
Publication #:
|
|
Pub Dt:
|
09/27/2018
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/14/2017
|
Application #:
|
15471615
|
Filing Dt:
|
03/28/2017
|
|
Publication #:
|
|
Pub Dt:
|
08/03/2017
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE WITH THIN REDISTRIBUTION LAYERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/30/2018
|
Application #:
|
15477853
|
Filing Dt:
|
04/03/2017
|
|
Publication #:
|
|
Pub Dt:
|
07/20/2017
| | | | |
|
Title:
|
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/02/2018
|
Application #:
|
15479223
|
Filing Dt:
|
04/04/2017
|
|
Title:
|
SEMICONDUCTOR DEVICE WITH LEADFRAME CONFIGURED TO FACILITATE REDUCED BURR FORMATION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/03/2019
|
Application #:
|
15487024
|
Filing Dt:
|
04/13/2017
|
|
Publication #:
|
|
Pub Dt:
|
10/18/2018
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/20/2019
|
Application #:
|
15490091
|
Filing Dt:
|
04/18/2017
|
|
Publication #:
|
|
Pub Dt:
|
09/21/2017
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE USING EMC WAFER SUPPORT SYSTEM AND FABRICATING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/15/2019
|
Application #:
|
15591416
|
Filing Dt:
|
05/10/2017
|
|
Publication #:
|
|
Pub Dt:
|
08/24/2017
| | | | |
|
Title:
|
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/02/2021
|
Application #:
|
15597313
|
Filing Dt:
|
05/17/2017
|
|
Publication #:
|
|
Pub Dt:
|
11/16/2017
| | | | |
|
Title:
|
COMPOSITIONS AND METHODS FOR NUCLEIC ACID AMPLIFICATION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/19/2019
|
Application #:
|
15615769
|
Filing Dt:
|
06/06/2017
|
|
Publication #:
|
|
Pub Dt:
|
12/06/2018
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING INSPECTION STRUCTURE AND RELATED METHODS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15632335
|
Filing Dt:
|
06/24/2017
|
|
Publication #:
|
|
Pub Dt:
|
12/27/2018
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE HAVING EMI SHIELDING STRUCTURE AND RELATED METHODS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/17/2021
|
Application #:
|
15634041
|
Filing Dt:
|
06/27/2017
|
|
Title:
|
ENCAPSULATED SEMICONDUCTOR PACKAGE
|
|
