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Reel/Frame:046683/0139   Pages: 67
Recorded: 08/01/2018
Attorney Dkt #:2068279-5062
Conveyance: SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1156
Page 12 of 12
Pages: 1 2 3 4 5 6 7 8 9 10 11 12
1
Patent #:
10546833
Issue Dt:
01/28/2020
Application #:
15634861
Filing Dt:
06/27/2017
Publication #:
US20170294405
Pub Dt:
10/12/2017
Title:
METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES
2
Patent #:
RE47890
Issue Dt:
03/03/2020
Application #:
15646973
Filing Dt:
07/11/2017
Title:
PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE
3
Patent #:
10242966
Issue Dt:
03/26/2019
Application #:
15650205
Filing Dt:
07/14/2017
Title:
THIN BONDED INTERPOSER PACKAGE
4
Patent #:
10903181
Issue Dt:
01/26/2021
Application #:
15656654
Filing Dt:
07/21/2017
Publication #:
US20170323862
Pub Dt:
11/09/2017
Title:
WAFER LEVEL FAN OUT SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
5
Patent #:
10347562
Issue Dt:
07/09/2019
Application #:
15663024
Filing Dt:
07/28/2017
Title:
METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV PACKAGES
6
Patent #:
9984947
Issue Dt:
05/29/2018
Application #:
15670589
Filing Dt:
08/07/2017
Publication #:
US20170338163
Pub Dt:
11/23/2017
Title:
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
7
Patent #:
10034372
Issue Dt:
07/24/2018
Application #:
15670908
Filing Dt:
08/07/2017
Title:
STACKABLE VIA PACKAGE AND METHOD
8
Patent #:
10600755
Issue Dt:
03/24/2020
Application #:
15673565
Filing Dt:
08/10/2017
Publication #:
US20190051629
Pub Dt:
02/14/2019
Title:
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURED THEREBY
9
Patent #:
10290621
Issue Dt:
05/14/2019
Application #:
15683065
Filing Dt:
08/22/2017
Publication #:
US20170373051
Pub Dt:
12/28/2017
Title:
Method of Manufacturing a Package-on-Package Type Semiconductor Package
10
Patent #:
10062611
Issue Dt:
08/28/2018
Application #:
15683328
Filing Dt:
08/22/2017
Publication #:
US20180082896
Pub Dt:
03/22/2018
Title:
Encapsulated Semiconductor Package and Method of Manufacturing Thereof
11
Patent #:
10903190
Issue Dt:
01/26/2021
Application #:
15689714
Filing Dt:
08/29/2017
Publication #:
US20170358560
Pub Dt:
12/14/2017
Title:
Semiconductor Package Using A Coreless Signal Distribution Structure
12
Patent #:
10636717
Issue Dt:
04/28/2020
Application #:
15695478
Filing Dt:
09/05/2017
Publication #:
US20180090409
Pub Dt:
03/29/2018
Title:
PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE
13
Patent #:
10199312
Issue Dt:
02/05/2019
Application #:
15700101
Filing Dt:
09/09/2017
Title:
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED WETTABLE FLANK AND STRUCTURE
14
Patent #:
10366943
Issue Dt:
07/30/2019
Application #:
15706688
Filing Dt:
09/16/2017
Publication #:
US20190088574
Pub Dt:
03/21/2019
Title:
PACKAGED ELECTRONIC DEVICE HAVING STEPPED CONDUCTIVE STRUCTURE AND RELATED METHODS
15
Patent #:
10312220
Issue Dt:
06/04/2019
Application #:
15707646
Filing Dt:
09/18/2017
Publication #:
US20180005987
Pub Dt:
01/04/2018
Title:
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
16
Patent #:
10304697
Issue Dt:
05/28/2019
Application #:
15725938
Filing Dt:
10/05/2017
Publication #:
US20190109018
Pub Dt:
04/11/2019
Title:
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD THEREOF
17
Patent #:
10312186
Issue Dt:
06/04/2019
Application #:
15799941
Filing Dt:
10/31/2017
Publication #:
US20190131219
Pub Dt:
05/02/2019
Title:
HEAT SINK ATTACHED TO AN ELECTRONIC COMPONENT IN A PACKAGED DEVICE
18
Patent #:
10144634
Issue Dt:
12/04/2018
Application #:
15806074
Filing Dt:
11/07/2017
Publication #:
US20180057353
Pub Dt:
03/01/2018
Title:
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
19
Patent #:
10199322
Issue Dt:
02/05/2019
Application #:
15812202
Filing Dt:
11/14/2017
Publication #:
US20180138117
Pub Dt:
05/17/2018
Title:
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSULATION AND NON-PHOTOSENSITIVE PASSIVATION LAYERS
20
Patent #:
10269744
Issue Dt:
04/23/2019
Application #:
15812741
Filing Dt:
11/14/2017
Publication #:
US20180068966
Pub Dt:
03/08/2018
Title:
SEMICONDUCTOR DEVICE WITH THIN REDISTRIBUTION LAYERS
21
Patent #:
10163855
Issue Dt:
12/25/2018
Application #:
15812953
Filing Dt:
11/14/2017
Publication #:
US20180076172
Pub Dt:
03/15/2018
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
22
Patent #:
11328969
Issue Dt:
05/10/2022
Application #:
15815243
Filing Dt:
11/16/2017
Publication #:
US20190148254
Pub Dt:
05/16/2019
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
23
Patent #:
11018079
Issue Dt:
05/25/2021
Application #:
15823737
Filing Dt:
11/28/2017
Publication #:
US20180082932
Pub Dt:
03/22/2018
Title:
LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
24
Patent #:
10304890
Issue Dt:
05/28/2019
Application #:
15823987
Filing Dt:
11/28/2017
Publication #:
US20180083061
Pub Dt:
03/22/2018
Title:
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
25
Patent #:
10056349
Issue Dt:
08/21/2018
Application #:
15831771
Filing Dt:
12/05/2017
Publication #:
US20180102342
Pub Dt:
04/12/2018
Title:
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE THEREOF
26
Patent #:
10586761
Issue Dt:
03/10/2020
Application #:
15832027
Filing Dt:
12/05/2017
Publication #:
US20180096928
Pub Dt:
04/05/2018
Title:
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
27
Patent #:
10504871
Issue Dt:
12/10/2019
Application #:
15837917
Filing Dt:
12/11/2017
Publication #:
US20190181117
Pub Dt:
06/13/2019
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
28
Patent #:
10134687
Issue Dt:
11/20/2018
Application #:
15841892
Filing Dt:
12/14/2017
Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
29
Patent #:
10410999
Issue Dt:
09/10/2019
Application #:
15847242
Filing Dt:
12/19/2017
Publication #:
US20190189599
Pub Dt:
06/20/2019
Title:
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACTURING METHOD THEREOF
30
Patent #:
10340244
Issue Dt:
07/02/2019
Application #:
15847329
Filing Dt:
12/19/2017
Publication #:
US20180211929
Pub Dt:
07/26/2018
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
31
Patent #:
10192816
Issue Dt:
01/29/2019
Application #:
15854095
Filing Dt:
12/26/2017
Publication #:
US20180240744
Pub Dt:
08/23/2018
Title:
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
32
Patent #:
10896869
Issue Dt:
01/19/2021
Application #:
15869447
Filing Dt:
01/12/2018
Publication #:
US20190221506
Pub Dt:
07/18/2019
Title:
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
33
Patent #:
10163867
Issue Dt:
12/25/2018
Application #:
15871617
Filing Dt:
01/15/2018
Publication #:
US20180138155
Pub Dt:
05/17/2018
Title:
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
34
Patent #:
10665567
Issue Dt:
05/26/2020
Application #:
15872397
Filing Dt:
01/16/2018
Title:
WAFER LEVEL PACKAGE AND FABRICATION METHOD
35
Patent #:
10468343
Issue Dt:
11/05/2019
Application #:
15874602
Filing Dt:
01/18/2018
Publication #:
US20180145019
Pub Dt:
05/24/2018
Title:
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME
36
Patent #:
10910298
Issue Dt:
02/02/2021
Application #:
15888003
Filing Dt:
02/03/2018
Publication #:
US20180158767
Pub Dt:
06/07/2018
Title:
METHOD OF FORMING A MOLDED SUBSTRATE ELECTRONIC PACKAGE AND STRUCTURE
37
Patent #:
11011455
Issue Dt:
05/18/2021
Application #:
15893591
Filing Dt:
02/10/2018
Publication #:
US20180166365
Pub Dt:
06/14/2018
Title:
ELECTRONIC PACKAGE STRUCTURE WITH IMPROVED BOARD LEVEL RELIABILITY
38
Patent #:
10468272
Issue Dt:
11/05/2019
Application #:
15905602
Filing Dt:
02/26/2018
Publication #:
US20180190514
Pub Dt:
07/05/2018
Title:
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURED THEREBY
39
Patent #:
10847478
Issue Dt:
11/24/2020
Application #:
15907039
Filing Dt:
02/27/2018
Publication #:
US20190267334
Pub Dt:
08/29/2019
Title:
METHOD OF FORMING AN ELECTRONIC DEVICE STRUCTURE HAVING AN ELECTRONIC COMPONENT WITH AN ON-EDGE ORIENTATION AND RELATED STRUCTURES
40
Patent #:
10566680
Issue Dt:
02/18/2020
Application #:
15911082
Filing Dt:
03/03/2018
Publication #:
US20180191055
Pub Dt:
07/05/2018
Title:
PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING STRUCTURE
41
Patent #:
10304698
Issue Dt:
05/28/2019
Application #:
15919569
Filing Dt:
03/13/2018
Publication #:
US20180204740
Pub Dt:
07/19/2018
Title:
SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF SEMICONDUCTOR DIE
42
Patent #:
10504857
Issue Dt:
12/10/2019
Application #:
15919791
Filing Dt:
03/13/2018
Publication #:
US20180204809
Pub Dt:
07/19/2018
Title:
SEMICONDUCTOR PACKAGE STRUCTURE FOR IMPROVING DIE WARPAGE AND MANUFACTURING METHOD THEREOF
43
Patent #:
10221064
Issue Dt:
03/05/2019
Application #:
15934267
Filing Dt:
03/23/2018
Publication #:
US20180251369
Pub Dt:
09/06/2018
Title:
SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPARTMENTS
44
Patent #:
10535620
Issue Dt:
01/14/2020
Application #:
15936877
Filing Dt:
03/27/2018
Publication #:
US20180240768
Pub Dt:
08/23/2018
Title:
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
45
Patent #:
10790161
Issue Dt:
09/29/2020
Application #:
15937423
Filing Dt:
03/27/2018
Publication #:
US20190304807
Pub Dt:
10/03/2019
Title:
ELECTRONIC DEVICE WITH ADAPTIVE VERTICAL INTERCONNECT AND FABRICATING METHOD THEREOF
46
Patent #:
10818602
Issue Dt:
10/27/2020
Application #:
15943097
Filing Dt:
04/02/2018
Publication #:
US20190304916
Pub Dt:
10/03/2019
Title:
EMBEDDED BALL LAND SUBSTRATE, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHODS
47
Patent #:
10388582
Issue Dt:
08/20/2019
Application #:
15945938
Filing Dt:
04/05/2018
Publication #:
US20180226312
Pub Dt:
08/09/2018
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
48
Patent #:
10490716
Issue Dt:
11/26/2019
Application #:
15947245
Filing Dt:
04/06/2018
Publication #:
US20180233641
Pub Dt:
08/16/2018
Title:
SEMICONDUCTOR DEVICE WITH OPTICALLY-TRANSMISSIVE LAYER AND MANUFACTURING METHOD THEREOF
49
Patent #:
10410967
Issue Dt:
09/10/2019
Application #:
15953024
Filing Dt:
04/13/2018
Title:
Electronic device comprising a conductive pad on a protruding-through electrode
50
Patent #:
10672715
Issue Dt:
06/02/2020
Application #:
15953591
Filing Dt:
04/16/2018
Publication #:
US20190318994
Pub Dt:
10/17/2019
Title:
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
51
Patent #:
10734343
Issue Dt:
08/04/2020
Application #:
15968360
Filing Dt:
05/01/2018
Publication #:
US20180247909
Pub Dt:
08/30/2018
Title:
METHOD AND SYSTEM FOR PACKING OPTIMIZATION OF SEMICONDUCTOR DEVICES
52
Patent #:
10283400
Issue Dt:
05/07/2019
Application #:
15973329
Filing Dt:
05/07/2018
Title:
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
53
Patent #:
10297466
Issue Dt:
05/21/2019
Application #:
15973799
Filing Dt:
05/08/2018
Publication #:
US20180261468
Pub Dt:
09/13/2018
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
54
Patent #:
NONE
Issue Dt:
Application #:
15987075
Filing Dt:
05/23/2018
Publication #:
US20180269145
Pub Dt:
09/20/2018
Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
55
Patent #:
10672676
Issue Dt:
06/02/2020
Application #:
15988940
Filing Dt:
05/24/2018
Publication #:
US20180269121
Pub Dt:
09/20/2018
Title:
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
56
Patent #:
10553451
Issue Dt:
02/04/2020
Application #:
16017735
Filing Dt:
06/25/2018
Publication #:
US20180308712
Pub Dt:
10/25/2018
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Assignor
1
AMKOR TECHNOLOGY, INC.
Exec Dt:
07/13/2018
Assignee
1
BANK OF AMERICA, N.A., AS AGENT
333 SOUTH HOPE STREET
19TH FLOOR
LOS ANGELES, CALIFORNIA 90071
Correspondence name and address
MCGUIREWOODS LLP
1750 TYSONS BOULEVARD
SUITE 1800
TYSONS, VA 22102

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