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Patent Assignment Details
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Reel/Frame:046683/0139   Pages: 67
Recorded: 08/01/2018
Attorney Dkt #:2068279-5062
Conveyance: SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1156
Page 2 of 12
Pages: 1 2 3 4 5 6 7 8 9 10 11 12
1
Patent #:
5998857
Issue Dt:
12/07/1999
Application #:
09132241
Filing Dt:
08/11/1998
Title:
SEMICONDUCTOR PACKAGING STRUCTURE WITH THE BAR ON CHIP
2
Patent #:
5985695
Issue Dt:
11/16/1999
Application #:
09141928
Filing Dt:
08/28/1998
Title:
METHOD OF MAKING A MOLDED FLEX CIRCUIT BALL GRID ARRAY
3
Patent #:
6092281
Issue Dt:
07/25/2000
Application #:
09141936
Filing Dt:
08/28/1998
Title:
ELECTROMAGNETIC INTERFERENCE SHIELD DRIVER AND METHOD
4
Patent #:
6124637
Issue Dt:
09/26/2000
Application #:
09161189
Filing Dt:
09/25/1998
Title:
CARRIER STRIP AND MOLDED FLEX CIRCUIT BALL GRID ARRAY
5
Patent #:
6143588
Issue Dt:
11/07/2000
Application #:
09176048
Filing Dt:
10/20/1998
Title:
A METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE EMPLOYING A TRANSPARENT ENCAPSULANT
6
Patent #:
6281568
Issue Dt:
08/28/2001
Application #:
09176614
Filing Dt:
10/21/1998
Title:
PLASTIC INTEGRATED CIRCUIT DEVICE PACKAGE AND LEADFRAME HAVING PARTIALLY UNDERCUT LEADS AND DIE PAD
7
Patent #:
6207562
Issue Dt:
03/27/2001
Application #:
09199041
Filing Dt:
11/24/1998
Title:
METHOD OF FORMING TITANIUM SILICIDE
8
Patent #:
6114217
Issue Dt:
09/05/2000
Application #:
09199706
Filing Dt:
11/24/1998
Title:
METHOD FOR FORMING ISOLATION TRENCHES ON A SEMICONDUCTOR SUBSTRATE
9
Patent #:
6150709
Issue Dt:
11/21/2000
Application #:
09203720
Filing Dt:
12/01/1998
Title:
GRID ARRAY TYPE LEAD FRAME HAVING LEAD ENDS IN DIFFERENT PLANES
10
Patent #:
6329606
Issue Dt:
12/11/2001
Application #:
09203826
Filing Dt:
12/01/1998
Title:
GRID ARRAY ASSEMBLY OF CIRCUIT BOARDS WITH SINGULATION GROOVES
11
Patent #:
6132081
Issue Dt:
10/17/2000
Application #:
09220987
Filing Dt:
12/23/1998
Title:
METHOD FOR CALIBRATING OPTICAL SENSOR USED TO MEASURE THE TEMPERATURE OF A SUBSTRATE DURING RAPID THERMAL PROCESS
12
Patent #:
6091141
Issue Dt:
07/18/2000
Application #:
09222226
Filing Dt:
12/29/1998
Title:
BUMP CHIP SCALE SEMICONDUCTOR PACKAGE
13
Patent #:
6200841
Issue Dt:
03/13/2001
Application #:
09223236
Filing Dt:
12/30/1998
Title:
MOS TRANSISTOR THAT INHIBITS PUNCHTHROUGH AND METHOD FOR FABRICATING THE SAME
14
Patent #:
6013554
Issue Dt:
01/11/2000
Application #:
09223238
Filing Dt:
12/30/1998
Title:
METHOD FOR FABRICATING AN LDD MOS TRANSISTOR
15
Patent #:
6090715
Issue Dt:
07/18/2000
Application #:
09223458
Filing Dt:
12/30/1998
Title:
MASKING PROCESS FOR FORMING SELF-ALIGNED DUAL WELLS OR SELF-ALIGNED FIELD-DOPING REGIONS
16
Patent #:
6204131
Issue Dt:
03/20/2001
Application #:
09223471
Filing Dt:
12/30/1998
Title:
TRENCH STRUCTURE FOR ISOLATING SEMICONDUCTOR ELEMENTS AND METHOD FOR FORMING THE SAME
17
Patent #:
6201302
Issue Dt:
03/13/2001
Application #:
09223839
Filing Dt:
12/31/1998
Title:
SEMICONDUCTOR PACKAGE HAVING MULTI-DIES
18
Patent #:
6465329
Issue Dt:
10/15/2002
Application #:
09233980
Filing Dt:
01/20/1999
Title:
MICROCIRCUIT DIE-SAWING PROTECTOR AND METHOD
19
Patent #:
6246015
Issue Dt:
06/12/2001
Application #:
09240422
Filing Dt:
01/29/1999
Title:
"PRINTED CIRCUIT BOARD FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGES"
20
Patent #:
6214645
Issue Dt:
04/10/2001
Application #:
09240423
Filing Dt:
01/29/1999
Title:
METHOD OF MOLDING BALL GRID ARRAY SEMICONDUCTOR PACKAGES
21
Patent #:
6246566
Issue Dt:
06/12/2001
Application #:
09246574
Filing Dt:
02/08/1999
Title:
ELECTROSTATIC DISCHARGE PROTECTION PACKAGE AND METHOD
22
Patent #:
6403978
Issue Dt:
06/11/2002
Application #:
09261280
Filing Dt:
03/02/1999
Title:
TEST PATTERN FOR MEASURING VARIATIONS OF CRITICAL DIMENSIONS OF WIRING PATTERNS FORMED IN THE FABRICATION OF SEMICONDUCTOR DEVICES
23
Patent #:
6296988
Issue Dt:
10/02/2001
Application #:
09262789
Filing Dt:
03/04/1999
Title:
METHOD FOR FORMING A MENTAL WIRING PATTERN ON A SEMICONDUCTOR DEVICE
24
Patent #:
6389691
Issue Dt:
05/21/2002
Application #:
09286015
Filing Dt:
04/05/1999
Title:
METHODS FOR FORMING INTEGRATED REDISTRIBUTION ROUTING CONDUCTORS AND SOLDER BUMPS
25
Patent #:
6329608
Issue Dt:
12/11/2001
Application #:
09286143
Filing Dt:
04/05/1999
Title:
KEY-SHAPED SOLDER BUMPS AND UNDER BUMP METALLURGY
26
Patent #:
6303997
Issue Dt:
10/16/2001
Application #:
09287711
Filing Dt:
04/07/1999
Title:
THIN, STACKABLE SEMICONDUCTOR PACKAGES
27
Patent #:
6268568
Issue Dt:
07/31/2001
Application #:
09305170
Filing Dt:
05/04/1999
Title:
PRINTED CIRCUIT BOARD WITH OVAL SOLDER BALL LANDS FOR BGA SEMICONDUCTOR PACKAGES
28
Patent #:
6337228
Issue Dt:
01/08/2002
Application #:
09310660
Filing Dt:
05/12/1999
Title:
LOW-COST PRINTED CIRCUIT BOARD WITH INTEGRAL HEAT SINK FOR SEMICONDUCTOR PACKAGE
29
Patent #:
6274927
Issue Dt:
08/14/2001
Application #:
09324710
Filing Dt:
06/03/1999
Title:
PLASTIC PACKAGE FOR AN OPTICAL INTEGRATED CIRCUIT DEVICE AND METHOD OF MAKING
30
Patent #:
6211563
Issue Dt:
04/03/2001
Application #:
09343516
Filing Dt:
06/30/1999
Title:
SEMICONDUCTOR PACKAGE WITH AN IMPROVED LEADFRAME
31
Patent #:
6225379
Issue Dt:
05/01/2001
Application #:
09347794
Filing Dt:
07/06/1999
Title:
EPOXY RESIN COMPOSITION FOR BONDING SEMICONDUCTOR CHIPS
32
Patent #:
6228676
Issue Dt:
05/08/2001
Application #:
09348772
Filing Dt:
07/07/1999
Title:
NEAR CHIP SIZE INTEGRATED CIRCUIT PACKAGE
33
Patent #:
6258629
Issue Dt:
07/10/2001
Application #:
09370600
Filing Dt:
08/09/1999
Title:
METHOD OF MAKING AN ELECTRONIC DEVICE PACKAGE AND LEADFRAME
34
Patent #:
6177731
Issue Dt:
01/23/2001
Application #:
09380243
Filing Dt:
08/30/1999
Title:
SEMICONDUCTOR PACKAGE
35
Patent #:
6247229
Issue Dt:
06/19/2001
Application #:
09383022
Filing Dt:
08/25/1999
Title:
METHOD OF FORMING AN INTEGRATED CIRCUIT DEVICE PACKAGE USING A PLASTIC TAPE AS A BASE
36
Patent #:
6589801
Issue Dt:
07/08/2003
Application #:
09385694
Filing Dt:
08/30/1999
Title:
WAFER-SCALE PRODUCTION OF CHIP-SCALE SEMICONDUCTOR PACKAGES USING WAFER MAPPING TECHNIQUES
37
Patent #:
6428641
Issue Dt:
08/06/2002
Application #:
09385695
Filing Dt:
08/30/1999
Title:
METHOD FOR LAMINATING CIRCUIT PATTERN TAPE ON SEMICONDUCTOR WAFER
38
Patent #:
6448635
Issue Dt:
09/10/2002
Application #:
09385696
Filing Dt:
08/30/1999
Title:
SURFACE ACOUSTICAL WAVE FLIP CHIP
39
Patent #:
6479887
Issue Dt:
11/12/2002
Application #:
09387377
Filing Dt:
08/30/1999
Title:
CIRCUIT PATTERN TAPE FOR WAFER-SCALE PRODUCTION OF CHIP SIZE SEMICONDUCTOR PACKAGES
40
Patent #:
6437427
Issue Dt:
08/20/2002
Application #:
09391792
Filing Dt:
09/08/1999
Title:
LEAD FRAME USED FOR THE FABRICATION OF SEMICONDUCTOR PACKAGES AND SEMICONDUCTOR PACKAGE FABRICATED USING THE SAME
41
Patent #:
6455356
Issue Dt:
09/24/2002
Application #:
09395875
Filing Dt:
09/14/1999
Title:
METHOD FOR MOLDING A LEADFRAME IN PLASTIC INTEGRATED CIRCUIT DEVICES
42
Patent #:
6517656
Issue Dt:
02/11/2003
Application #:
09412889
Filing Dt:
10/05/1999
Title:
METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE USING A BATCH STEP FOR CURING A DIE ATTACHMENT FILM AND A TOOL SYSTEM FOR PERFORMING THE METHOD
43
Patent #:
6198163
Issue Dt:
03/06/2001
Application #:
09420065
Filing Dt:
10/18/1999
Title:
THIN LEADFRAME-TYPE SEMICONDUCTOR PACKAGE HAVING HEAT SINK WITH RECESS AND EXPOSED SURFACE
44
Patent #:
6426277
Issue Dt:
07/30/2002
Application #:
09421454
Filing Dt:
10/19/1999
Title:
METHODS AND A DEVICE FOR HEAT TREATMENT A SEMICONDUCTOR WAFER HAVING DIFFERENT KINDS OF IMPURITIES
45
Patent #:
6117193
Issue Dt:
09/12/2000
Application #:
09422008
Filing Dt:
10/20/1999
Title:
OPTICAL SENSOR ARRAY MOUNTING AND ALIGNMEMT
46
Patent #:
6462274
Issue Dt:
10/08/2002
Application #:
09422027
Filing Dt:
10/20/1999
Title:
CHIP-SCALE SEMICONDUCTOR PACKAGE OF THE FAN-OUT TYPE AND METHOD OF MANUFACTURING SUCH PACKAGES
47
Patent #:
6489667
Issue Dt:
12/03/2002
Application #:
09422115
Filing Dt:
10/20/1999
Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SUCH DEVICE
48
Patent #:
6331451
Issue Dt:
12/18/2001
Application #:
09434546
Filing Dt:
11/05/1999
Title:
METHODS OF MAKING THIN INTEGRATED CIRCUIT DEVICE PACKAGES WITH IMPROVED THERMAL PERFORMANCE AND SUBSTRATES FOR MAKING THE PACKAGES
49
Patent #:
6580159
Issue Dt:
06/17/2003
Application #:
09434589
Filing Dt:
11/05/1999
Title:
INTEGRATED CIRCUIT DEVICE PACKAGES AND SUBSTRATES FOR MAKING THE PACKAGES
50
Patent #:
6847103
Issue Dt:
01/25/2005
Application #:
09436158
Filing Dt:
11/09/1999
Title:
SEMICONDUCTOR PACKAGE WITH EXPOSED DIE PAD AND BODY-LOCKING LEADFRAME
51
Patent #:
6291884
Issue Dt:
09/18/2001
Application #:
09437013
Filing Dt:
11/09/1999
Title:
CHIP-SIZE SEMICONDUCTOR PACKAGES
52
Patent #:
6268654
Issue Dt:
07/31/2001
Application #:
09437574
Filing Dt:
11/09/1999
Title:
INTEGRATED CIRCUIT PACKAGE HAVING ADHESIVE BEAD SUPPORTING PLANAR LID ABOVE PLANAR SUBSTRATE
53
Patent #:
6476478
Issue Dt:
11/05/2002
Application #:
09439917
Filing Dt:
11/12/1999
Title:
CAVITY SEMICONDUCTOR PACKAGE WITH EXPOSED LEADS AND DIE PAD AND METHOD FOR MAKING THE SAME
54
Patent #:
6415505
Issue Dt:
07/09/2002
Application #:
09440808
Filing Dt:
11/15/1999
Title:
MICROMACHINE PACKAGE FABRICATION METHOD
55
Patent #:
6309916
Issue Dt:
10/30/2001
Application #:
09441115
Filing Dt:
11/17/1999
Title:
METHOD OF MOLDING PLASTIC SEMICONDUCTOR PACKAGES
56
Patent #:
6448633
Issue Dt:
09/10/2002
Application #:
09444035
Filing Dt:
11/19/1999
Title:
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING USING LEADFRAME HAVING LEAD LOCKS TO SECURE LEADS TO ENCAPSULANT
57
Patent #:
6627864
Issue Dt:
09/30/2003
Application #:
09447202
Filing Dt:
11/22/1999
Title:
THIN IMAGE SENSOR PACKAGE HAVING TRANSPARENT SUBSTRATE
58
Patent #:
6396043
Issue Dt:
05/28/2002
Application #:
09448538
Filing Dt:
11/22/1999
Title:
THIN IMAGE SENSOR PACKAGE FABRICATION METHOD
59
Patent #:
6319755
Issue Dt:
11/20/2001
Application #:
09452545
Filing Dt:
12/01/1999
Title:
CONDUCTIVE STRAP ATTACHMENT PROCESS THAT ALLOWS ELECTRICAL CONNECTOR BETWEEN AN INTEGRATED CIRCUITE DIE AND LEADFRAME.
60
Patent #:
6455774
Issue Dt:
09/24/2002
Application #:
09457505
Filing Dt:
12/08/1999
Title:
MOLDED IMAGE SENSOR PACKAGE
61
Patent #:
6483101
Issue Dt:
11/19/2002
Application #:
09457513
Filing Dt:
12/08/1999
Title:
MOLDED IMAGE SENSOR PACKAGE HAVING LENS HOLDER
62
Patent #:
6526653
Issue Dt:
03/04/2003
Application #:
09457515
Filing Dt:
12/08/1999
Title:
METHOD OF ASSEMBLING A SNAP LID IMAGE SENSOR PACKAGE
63
Patent #:
6483030
Issue Dt:
11/19/2002
Application #:
09457516
Filing Dt:
12/08/1999
Title:
SNAP LID IMAGE SENSOR PACKAGE
64
Patent #:
6389687
Issue Dt:
05/21/2002
Application #:
09457517
Filing Dt:
12/08/1999
Title:
METHOD OF FABRICATING IMAGE SENSOR PACKAGES IN AN ARRAY
65
Patent #:
6266197
Issue Dt:
07/24/2001
Application #:
09458033
Filing Dt:
12/08/1999
Title:
MOLDED WINDOW ARRAY FOR IMAGE SENSOR PACKAGES
66
Patent #:
6423576
Issue Dt:
07/23/2002
Application #:
09460175
Filing Dt:
12/10/1999
Title:
A MICROELECTRONIC DEVICE PACKAGE HAVING A HEAT SINK STRUCTURE FOR INCREASING THE THERMAL CONDUCTIVITY OF THE PACKAGE
67
Patent #:
6369454
Issue Dt:
04/09/2002
Application #:
09461523
Filing Dt:
12/14/1999
Title:
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
68
Patent #:
6320251
Issue Dt:
11/20/2001
Application #:
09484192
Filing Dt:
01/18/2000
Title:
Stackable package for an integrated circuit
69
Patent #:
6414396
Issue Dt:
07/02/2002
Application #:
09490317
Filing Dt:
01/24/2000
Title:
PACKAGE FOR STACKED INTEGRATED CIRCUITS
70
Patent #:
6515269
Issue Dt:
02/04/2003
Application #:
09490717
Filing Dt:
01/25/2000
Title:
PROTECTED IMAGE SENSOR PACKAGE
71
Patent #:
6512219
Issue Dt:
01/28/2003
Application #:
09491112
Filing Dt:
01/25/2000
Title:
PROTECTED IMAGE SENSOR PACKAGE FABRICATION METHOD
72
Patent #:
6656765
Issue Dt:
12/02/2003
Application #:
09496991
Filing Dt:
02/02/2000
Title:
FABRICATING VERY THIN CHIP SIZE SEMICONDUCTOR PACKAGES
73
Patent #:
6404046
Issue Dt:
06/11/2002
Application #:
09497377
Filing Dt:
02/03/2000
Title:
MODULE OF STACKED INTEGRATED CIRCUIT PACKAGES INCLUDING AN INTERPOSER
74
Patent #:
6338985
Issue Dt:
01/15/2002
Application #:
09498144
Filing Dt:
02/04/2000
Title:
Making chip size semiconductor packages
75
Patent #:
6448509
Issue Dt:
09/10/2002
Application #:
09505395
Filing Dt:
02/16/2000
Title:
PRINTED CIRCUIT BOARD WITH HEAT SPREADER AND METHOD OF MAKING
76
Patent #:
7009283
Issue Dt:
03/07/2006
Application #:
09513067
Filing Dt:
02/24/2000
Title:
NONEXPOSED HEAT SINK FOR SEMICONDUCTOR PACKAGE
77
Patent #:
6424023
Issue Dt:
07/23/2002
Application #:
09513232
Filing Dt:
02/24/2000
Title:
LEADFRAME FOR MOLDED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MADE USING THE LEADFRAME
78
Patent #:
6255176
Issue Dt:
07/03/2001
Application #:
09517362
Filing Dt:
03/02/2000
Title:
Method of forming trench for semiconductor device isolation
79
Patent #:
6339004
Issue Dt:
01/15/2002
Application #:
09523372
Filing Dt:
03/10/2000
Title:
Method of forming shallow trench isolation for preventing torn oxide
80
Patent #:
6596212
Issue Dt:
07/22/2003
Application #:
09528884
Filing Dt:
03/20/2000
Title:
METHOD AND APPARATUS FOR INCREASING THICKNESS OF MOLDED BODY SEMICONDUCTOR PACKAGE
81
Patent #:
6459147
Issue Dt:
10/01/2002
Application #:
09536236
Filing Dt:
03/27/2000
Title:
ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES WITH CONDUCTIVE STRAPS
82
Patent #:
6571466
Issue Dt:
06/03/2003
Application #:
09536830
Filing Dt:
03/27/2000
Title:
FLIP CHIP IMAGE SENSOR PACKAGE FABRICATION METHPD
83
Patent #:
6444499
Issue Dt:
09/03/2002
Application #:
09539314
Filing Dt:
03/30/2000
Title:
METHOD FOR FABRICATING A SNAPABLE MULTI-PACKAGE ARRAY SUBSTRATE, SNAPABLE MULTI-PACKAGE ARRAY AND SNAPABLE PACKAGED ELECTRONIC COMPONENTS
84
Patent #:
6472598
Issue Dt:
10/29/2002
Application #:
09548702
Filing Dt:
04/13/2000
Title:
ELECTROMAGNETIC INTERFERENCE SHIELD DEVICE AND METHOD
85
Patent #:
6580620
Issue Dt:
06/17/2003
Application #:
09548705
Filing Dt:
04/13/2000
Title:
MATRIX TYPE PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGES
86
Patent #:
6601293
Issue Dt:
08/05/2003
Application #:
09551416
Filing Dt:
04/18/2000
Title:
METHOD OF MAKING AN ELECTROMAGNETIC INTERFERENCE SHIELD DEVICE
87
Patent #:
6309943
Issue Dt:
10/30/2001
Application #:
09558392
Filing Dt:
04/25/2000
Title:
Precision marking and singulation method
88
Patent #:
6441504
Issue Dt:
08/27/2002
Application #:
09558397
Filing Dt:
04/25/2000
Title:
PRECISION ALIGNED AND MARKED STRUCTURE
89
Patent #:
6372540
Issue Dt:
04/16/2002
Application #:
09561180
Filing Dt:
04/27/2000
Title:
Moisture-resistant integrated circuit chip package and method
90
Patent #:
6407458
Issue Dt:
06/18/2002
Application #:
09565586
Filing Dt:
05/04/2000
Title:
MOISTURE-RESISTANT INTEGRATED CIRCUIT CHIP PACKAGE
91
Patent #:
6429515
Issue Dt:
08/06/2002
Application #:
09565881
Filing Dt:
05/05/2000
Title:
LONG WIRE IC PACKAGE
92
Patent #:
6515356
Issue Dt:
02/04/2003
Application #:
09566069
Filing Dt:
05/05/2000
Title:
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
93
Patent #:
6518659
Issue Dt:
02/11/2003
Application #:
09566658
Filing Dt:
05/08/2000
Title:
STACKABLE PACKAGE HAVING A CAVITY AND A LID FOR AN ELECTRONIC DEVICE
94
Patent #:
6424031
Issue Dt:
07/23/2002
Application #:
09566680
Filing Dt:
05/08/2000
Title:
STACKABLE PACKAGE WITH HEAT SINK
95
Patent #:
6326235
Issue Dt:
12/04/2001
Application #:
09566849
Filing Dt:
05/05/2000
Title:
Lowwire ic package fabrication method
96
Patent #:
6441485
Issue Dt:
08/27/2002
Application #:
09569716
Filing Dt:
05/11/2000
Title:
APPARATUS FOR ELECTRICALLY MOUNTING AN ELECTRONIC DEVICE TO A SUBSTRATE WITHOUT SOLDERING
97
Patent #:
6501184
Issue Dt:
12/31/2002
Application #:
09574006
Filing Dt:
05/19/2000
Title:
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
98
Patent #:
6395578
Issue Dt:
05/28/2002
Application #:
09574541
Filing Dt:
05/19/2000
Title:
Semiconductor package and method for fabricating the same
99
Patent #:
6492197
Issue Dt:
12/10/2002
Application #:
09576477
Filing Dt:
05/23/2000
Title:
TRILAYER/BILAYER SOLDER BUMPS AND FABRICATION METHODS THEREFOR
100
Patent #:
6492699
Issue Dt:
12/10/2002
Application #:
09577692
Filing Dt:
05/22/2000
Title:
IMAGE SENSOR PACKAGE HAVING SEALED CAVITY OVER ACTIVE AREA
Assignor
1
AMKOR TECHNOLOGY, INC.
Exec Dt:
07/13/2018
Assignee
1
BANK OF AMERICA, N.A., AS AGENT
333 SOUTH HOPE STREET
19TH FLOOR
LOS ANGELES, CALIFORNIA 90071
Correspondence name and address
MCGUIREWOODS LLP
1750 TYSONS BOULEVARD
SUITE 1800
TYSONS, VA 22102

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