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Reel/Frame:046683/0139   Pages: 67
Recorded: 08/01/2018
Attorney Dkt #:2068279-5062
Conveyance: SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1156
Page 3 of 12
Pages: 1 2 3 4 5 6 7 8 9 10 11 12
1
Patent #:
6683377
Issue Dt:
01/27/2004
Application #:
09583183
Filing Dt:
05/30/2000
Title:
MULTI-STACKED MEMORY PACKAGE
2
Patent #:
6400033
Issue Dt:
06/04/2002
Application #:
09585506
Filing Dt:
06/01/2000
Title:
REINFORCING SOLDER CONNECTIONS OF ELECTRONIC DEVICES
3
Patent #:
6531784
Issue Dt:
03/11/2003
Application #:
09585915
Filing Dt:
06/02/2000
Title:
SEMICONDUCTOR PACKAGE WITH SPACER STRIPS
4
Patent #:
6521982
Issue Dt:
02/18/2003
Application #:
09587136
Filing Dt:
06/02/2000
Title:
PACKAGING HIGH POWER INTEGRATED CIRCUIT DEVICES
5
Patent #:
6512288
Issue Dt:
01/28/2003
Application #:
09589713
Filing Dt:
06/07/2000
Title:
CIRCUIT BOARD SEMICONDUCTOR PACKAGE
6
Patent #:
6201305
Issue Dt:
03/13/2001
Application #:
09591705
Filing Dt:
06/09/2000
Title:
Making solder ball mounting pads on substrates
7
Patent #:
6339252
Issue Dt:
01/15/2002
Application #:
09593269
Filing Dt:
06/13/2000
Title:
Electronic device package and leadframe
8
Patent #:
6489651
Issue Dt:
12/03/2002
Application #:
09595851
Filing Dt:
06/16/2000
Title:
MOS TRANSISTOR THAT INHIBITS PUNCHTHROUGH
9
Patent #:
6889813
Issue Dt:
05/10/2005
Application #:
09602162
Filing Dt:
06/22/2000
Title:
MATERIAL TRANSPORT METHOD
10
Patent #:
6695120
Issue Dt:
02/24/2004
Application #:
09602195
Filing Dt:
06/22/2000
Title:
ASSEMBLY FOR TRANSPORTING MATERIAL
11
Patent #:
6530735
Issue Dt:
03/11/2003
Application #:
09602196
Filing Dt:
06/22/2000
Title:
GRIPPER ASSEMBLY
12
Patent #:
6469369
Issue Dt:
10/22/2002
Application #:
09607778
Filing Dt:
06/30/2000
Title:
LEADFRAME HAVING A MOLD INFLOW GROOVE AND METHOD FOR MAKING
13
Patent #:
6452278
Issue Dt:
09/17/2002
Application #:
09608197
Filing Dt:
06/30/2000
Title:
LOW PROFILE PACKAGE FOR PLURAL SEMICONDUCTOR DIES
14
Patent #:
6534876
Issue Dt:
03/18/2003
Application #:
09608298
Filing Dt:
06/30/2000
Title:
FLIP-CHIP MICROMACHINE PACKAGE
15
Patent #:
6546620
Issue Dt:
04/15/2003
Application #:
09608357
Filing Dt:
06/29/2000
Title:
FLIP CHIP INTEGRATED CIRCUIT AND PASSIVE CHIP COMPONENT PACKAGE FABRICATION METHOD
16
Patent #:
6667544
Issue Dt:
12/23/2003
Application #:
09608419
Filing Dt:
06/30/2000
Title:
STACKABLE PACKAGE HAVING CLIPS FOR FASTENING PACKAGE AND TOOL FOR OPENING CLIPS
17
Patent #:
6214644
Issue Dt:
04/10/2001
Application #:
09608502
Filing Dt:
06/30/2000
Title:
Flip-chip micromachine package fabrication method
18
Patent #:
6356453
Issue Dt:
03/12/2002
Application #:
09608678
Filing Dt:
06/29/2000
Title:
Electronic package having flip chip integrated circuit and passive chip component
19
Patent #:
6503780
Issue Dt:
01/07/2003
Application #:
09610309
Filing Dt:
07/05/2000
Title:
WAFER SCALE IMAGE SENSOR PACKAGE FABRICATION METHOD
20
Patent #:
6407381
Issue Dt:
06/18/2002
Application #:
09610314
Filing Dt:
07/05/2000
Title:
Wafer scale image sensor package
21
Patent #:
6433277
Issue Dt:
08/13/2002
Application #:
09615107
Filing Dt:
07/13/2000
Title:
PLASTIC INTERGRATED CIRCUIT PACKAGE AND METHOD AND LEADFRAME FOR MAKING THE PACKAGE
22
Patent #:
6563204
Issue Dt:
05/13/2003
Application #:
09615670
Filing Dt:
07/14/2000
Title:
MICROCIRCUIT DIE-SAWING PROTECTOR
23
Patent #:
6472758
Issue Dt:
10/29/2002
Application #:
09620444
Filing Dt:
07/20/2000
Title:
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR DIES AND BOND WIRES
24
Patent #:
6424315
Issue Dt:
07/23/2002
Application #:
09631449
Filing Dt:
08/02/2000
Title:
SEMICONDUCTOR CHIP HAVING A RADIO-FREQUENCY IDENTIFICATION TRANSCEIVER
25
Patent #:
6798049
Issue Dt:
09/28/2004
Application #:
09648284
Filing Dt:
08/24/2000
Title:
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
26
Patent #:
6469258
Issue Dt:
10/22/2002
Application #:
09648946
Filing Dt:
08/23/2000
Title:
CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE
27
Patent #:
6406934
Issue Dt:
06/18/2002
Application #:
09654978
Filing Dt:
09/05/2000
Title:
WAFER LEVEL PRODUCTION OF CHIP SIZE SEMICONDUCTOR PACKAGES
28
Patent #:
6577013
Issue Dt:
06/10/2003
Application #:
09655439
Filing Dt:
09/05/2000
Title:
CHIP SIZE SEMICONDUCTOR PACKAGES WITH STACKED DIES
29
Patent #:
6624005
Issue Dt:
09/23/2003
Application #:
09656253
Filing Dt:
09/06/2000
Title:
SEMICONDUCTOR MEMORY CARDS AND METHOD OF MAKING SAME
30
Patent #:
6552416
Issue Dt:
04/22/2003
Application #:
09659017
Filing Dt:
09/08/2000
Title:
MULTIPLE DIE LEAD FRAME PACKAGE WITH ENHANCED DIE-TO DIE INTERCONNECT ROUTING USING INTERNAL LEAD TRACE WIRING
31
Patent #:
6522015
Issue Dt:
02/18/2003
Application #:
09670499
Filing Dt:
09/26/2000
Title:
MICROMACHINE STACKED WIREBONDED PACKAGE
32
Patent #:
6638789
Issue Dt:
10/28/2003
Application #:
09670500
Filing Dt:
09/26/2000
Title:
MICROMACHINE STACKED WIREBONDED PACKAGE FABRICATION METHOD
33
Patent #:
6530515
Issue Dt:
03/11/2003
Application #:
09670501
Filing Dt:
09/26/2000
Title:
MICROMACHINE STACKED FLIP CHIP PACKAGE FABRICATION METHOD
34
Patent #:
7102208
Issue Dt:
09/05/2006
Application #:
09687048
Filing Dt:
10/13/2000
Title:
LEADFRAME AND SEMICONDUCTOR PACKAGE WITH IMPROVED SOLDER JOINT STRENGTH
35
Patent #:
6525406
Issue Dt:
02/25/2003
Application #:
09687049
Filing Dt:
10/13/2000
Title:
SEMICONDUCTOR DEVICE HAVING INCREASED MOISTURE PATH AND INCREASED SOLDER JOINT STRENGTH
36
Patent #:
6616436
Issue Dt:
09/09/2003
Application #:
09687126
Filing Dt:
10/13/2000
Title:
APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGES
37
Patent #:
6627976
Issue Dt:
09/30/2003
Application #:
09687331
Filing Dt:
10/13/2000
Title:
LEADFRAME FOR SEMICONDUCTOR PACKAGE AND MOLD FOR MOLDING THE SAME
38
Patent #:
6501161
Issue Dt:
12/31/2002
Application #:
09687485
Filing Dt:
10/13/2000
Title:
SEMICONDUCTOR PACKAGE HAVING INCREASED SOLDER JOINT STRENGTH
39
Patent #:
6677662
Issue Dt:
01/13/2004
Application #:
09687487
Filing Dt:
10/13/2000
Title:
CLAMP AND HEAT BLOCK ASSEMBLY FOR WIRE BONDING A SEMICONDUCTOR PACKAGE ASSEMBLY
40
Patent #:
6853059
Issue Dt:
02/08/2005
Application #:
09687493
Filing Dt:
10/13/2000
Title:
SEMICONDUCTOR PACKAGE HAVING IMPROVED ADHESIVENESS AND GROUND BONDING
41
Patent #:
6753597
Issue Dt:
06/22/2004
Application #:
09687495
Filing Dt:
10/13/2000
Title:
ENCAPSULATED SEMICONDUCTOR PACKAGE INCLUDING CHIP PADDLE AND LEADS
42
Patent #:
6730544
Issue Dt:
05/04/2004
Application #:
09687530
Filing Dt:
10/13/2000
Title:
STACKABLE SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
43
Patent #:
6605866
Issue Dt:
08/12/2003
Application #:
09687531
Filing Dt:
10/13/2000
Title:
STACKABLE SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
44
Patent #:
6475827
Issue Dt:
11/05/2002
Application #:
09687532
Filing Dt:
10/13/2000
Title:
METHOD FOR MAKING A SEMICONDUCTOR PACKAGE HAVING IMPROVED DEFECT TESTING AND INCREASED PRODUCTION YIELD
45
Patent #:
6677663
Issue Dt:
01/13/2004
Application #:
09687536
Filing Dt:
10/13/2000
Title:
END GRID ARRAY SEMICONDUCTOR PACKAGE
46
Patent #:
6555899
Issue Dt:
04/29/2003
Application #:
09687541
Filing Dt:
10/13/2000
Title:
SEMICONDUCTOR PACKAGE LEADFRAME ASSEMBLY AND METHOD OF MANUFACTURE
47
Patent #:
6696747
Issue Dt:
02/24/2004
Application #:
09687585
Filing Dt:
10/13/2000
Title:
SEMICONDUCTOR PACKAGE HAVING REDUCED THICKNESS
48
Patent #:
6646339
Issue Dt:
11/11/2003
Application #:
09687787
Filing Dt:
10/13/2000
Title:
THIN AND HEAT RADIANT SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING
49
Patent #:
6639308
Issue Dt:
10/28/2003
Application #:
09687876
Filing Dt:
10/13/2000
Title:
NEAR CHIP SIZE SEMICONDUCTOR PACKAGE
50
Patent #:
6340623
Issue Dt:
01/22/2002
Application #:
09693466
Filing Dt:
10/20/2000
Title:
Method of fabricating semiconductor device
51
Patent #:
6521987
Issue Dt:
02/18/2003
Application #:
09703195
Filing Dt:
10/31/2000
Title:
PLASTIC INTEGRATED CIRCUIT DEVICE PACKAGE AND METHOD FOR MAKING THE PACKAGE
52
Patent #:
6509560
Issue Dt:
01/21/2003
Application #:
09711993
Filing Dt:
11/13/2000
Title:
CHIP SIZE IMAGE SENSOR IN WIREBOND PACKAGE WITH STEP-UP RING FOR ELECTRICAL CONTACT
53
Patent #:
6629633
Issue Dt:
10/07/2003
Application #:
09711994
Filing Dt:
11/13/2000
Title:
CHIP SIZE IMAGE SENSOR BUMPER PACKAGE FABRICATION METHOD
54
Patent #:
6528857
Issue Dt:
03/04/2003
Application #:
09712313
Filing Dt:
11/13/2000
Title:
CHIP SIZE IMAGE SENSOR BUMPED PACKAGE
55
Patent #:
6620646
Issue Dt:
09/16/2003
Application #:
09712314
Filing Dt:
11/13/2000
Title:
CHIP SIZE IMAGE SENSOR WIREBOND PACKAGE FABRICATION METHOD
56
Patent #:
6849916
Issue Dt:
02/01/2005
Application #:
09713848
Filing Dt:
11/15/2000
Title:
FLIP CHIP ON GLASS IMAGE SENSOR PACKAGE
57
Patent #:
6418033
Issue Dt:
07/09/2002
Application #:
09714311
Filing Dt:
11/16/2000
Title:
MICROELECTRONIC PACKAGES IN WHICH SECOND MICROELECTRONIC SUBSTRATES ARE ORIENTED RELATIVE TO FIRST MICROELECTRONIC SUBSTRATES AT ACUTE ANGLES
58
Patent #:
6532157
Issue Dt:
03/11/2003
Application #:
09714622
Filing Dt:
11/16/2000
Title:
ANGULATED SEMICONDUCTOR PACKAGES
59
Patent #:
6342406
Issue Dt:
01/29/2002
Application #:
09714682
Filing Dt:
11/15/2000
Title:
Flip chip on glass image sensor package fabrication method
60
Patent #:
6340846
Issue Dt:
01/22/2002
Application #:
09730721
Filing Dt:
12/06/2000
Title:
Making semiconductor packages with stacked dies and reinforced wire bonds
61
Patent #:
6566164
Issue Dt:
05/20/2003
Application #:
09733148
Filing Dt:
12/07/2000
Title:
EXPOSED COPPER STRAP IN A SEMICONDUCTOR PACKAGE
62
Patent #:
6642610
Issue Dt:
11/04/2003
Application #:
09745265
Filing Dt:
12/20/2000
Publication #:
US20020064905
Pub Dt:
05/30/2002
Title:
WIRE BONDING METHOD AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE SAME
63
Patent #:
6963141
Issue Dt:
11/08/2005
Application #:
09746018
Filing Dt:
12/26/2000
Publication #:
US20010019181
Pub Dt:
09/06/2001
Title:
STRUCTURE OF HEAT SLUG-EQUIPPED PACKAGES AND THE PACKAGING METHOD OF THE SAME
64
Patent #:
6672773
Issue Dt:
01/06/2004
Application #:
09751536
Filing Dt:
12/29/2000
Title:
OPTICAL FIBER HAVING TAPERED END AND OPTICAL CONNECTOR WITH RECIPROCAL OPENING
65
Patent #:
6875379
Issue Dt:
04/05/2005
Application #:
09751537
Filing Dt:
12/29/2000
Publication #:
US20040245659
Pub Dt:
12/09/2004
Title:
TOOL AND METHOD FOR FORMING AN INTEGRATED OPTICAL CIRCUIT
66
Patent #:
6564454
Issue Dt:
05/20/2003
Application #:
09752244
Filing Dt:
12/28/2000
Title:
METHOD OF MAKING AND STACKING A SEMICONDUCTOR PACKAGE
67
Patent #:
6448506
Issue Dt:
09/10/2002
Application #:
09752662
Filing Dt:
12/28/2000
Title:
SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD FOR MAKING THE PACKAGE
68
Patent #:
6420201
Issue Dt:
07/16/2002
Application #:
09754229
Filing Dt:
01/03/2001
Title:
METHOD FOR FORMING A BOND WIRE PRESSURE SENSOR DIE PACKAGE
69
Patent #:
6432737
Issue Dt:
08/13/2002
Application #:
09754239
Filing Dt:
01/03/2001
Title:
METHOD FOR FORMING A FLIP CHIP PRESSURE SENSOR DIE PACKAGE
70
Patent #:
6441503
Issue Dt:
08/27/2002
Application #:
09754393
Filing Dt:
01/03/2001
Title:
BOND WIRE PRESSURE SENSOR DIE PACKAGE
71
Patent #:
6990226
Issue Dt:
01/24/2006
Application #:
09758325
Filing Dt:
01/10/2001
Publication #:
US20010051000
Pub Dt:
12/13/2001
Title:
PATTERN RECOGNITION METHOD
72
Patent #:
6984879
Issue Dt:
01/10/2006
Application #:
09758332
Filing Dt:
01/10/2001
Publication #:
US20010053244
Pub Dt:
12/20/2001
Title:
CLAMP FOR PATTERN RECOGNITION
73
Patent #:
6686588
Issue Dt:
02/03/2004
Application #:
09764165
Filing Dt:
01/16/2001
Title:
OPTICAL MODULE WITH LENS INTEGRAL HOLDER
74
Patent #:
6610167
Issue Dt:
08/26/2003
Application #:
09764166
Filing Dt:
01/16/2001
Title:
METHOD FOR FABRICATING A SPECIAL-PURPOSE DIE USING A POLYMERIZABLE TAPE
75
Patent #:
6572944
Issue Dt:
06/03/2003
Application #:
09764190
Filing Dt:
01/16/2001
Title:
STRUCTURE FOR FABRICATING A SPECIAL-PURPOSE DIE USING A POLYMERIZABLE TAPE
76
Patent #:
7059040
Issue Dt:
06/13/2006
Application #:
09764196
Filing Dt:
01/16/2001
Title:
OPTICAL MODULE WITH LENS INTEGRAL HOLDER FABRICATION METHOD
77
Patent #:
6445075
Issue Dt:
09/03/2002
Application #:
09770859
Filing Dt:
01/26/2001
Title:
SEMICONDUCTOR MODULE PACKAGE SUBSTRATE
78
Patent #:
6494361
Issue Dt:
12/17/2002
Application #:
09770861
Filing Dt:
01/26/2001
Title:
SEMICONDUCTOR MODULE PACKAGE SUBSTRATE FABRICATION METHOD
79
Patent #:
6762078
Issue Dt:
07/13/2004
Application #:
09774952
Filing Dt:
01/30/2001
Publication #:
US20010005601
Pub Dt:
06/28/2001
Title:
SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR CHIP WITHIN CENTRAL APERTURE OF SUBSTRATE
80
Patent #:
6476331
Issue Dt:
11/05/2002
Application #:
09783797
Filing Dt:
02/14/2001
Title:
PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
81
Patent #:
6392163
Issue Dt:
05/21/2002
Application #:
09790421
Filing Dt:
02/22/2001
Publication #:
US20020020551
Pub Dt:
02/21/2002
Title:
CONTROLLED-SHAPED SOLDER RESERVOIRS FOR INCREASING THE VOLUME OF SOLDER BUMPS
82
Patent #:
6399463
Issue Dt:
06/04/2002
Application #:
09797756
Filing Dt:
03/01/2001
Title:
METHOD OF SINGULATION USING LASER CUTTING
83
Patent #:
6420776
Issue Dt:
07/16/2002
Application #:
09797759
Filing Dt:
03/01/2001
Title:
STRUCTURE INCLUDING ELECTRONIC COMPONENTS SINGULATED USING LASER CUTTING
84
Patent #:
6869861
Issue Dt:
03/22/2005
Application #:
09803083
Filing Dt:
03/08/2001
Title:
BACK-SIDE WAFER SINGULATION METHOD
85
Patent #:
6943429
Issue Dt:
09/13/2005
Application #:
09803084
Filing Dt:
03/08/2001
Title:
Wafer having alignment marks extending from a first to a second surface of the wafer
86
Patent #:
6455927
Issue Dt:
09/24/2002
Application #:
09804749
Filing Dt:
03/12/2001
Title:
MICROMIRROR DEVICE PACKAGE
87
Patent #:
6624921
Issue Dt:
09/23/2003
Application #:
09804805
Filing Dt:
03/12/2001
Title:
MICROMIRROR DEVICE PACKAGE FABRICATION METHOD
88
Patent #:
6580153
Issue Dt:
06/17/2003
Application #:
09811183
Filing Dt:
03/14/2001
Title:
STRUCTURE FOR PROTECTING A MICROMACHINE WITH A CAVITY IN A UV TAPE
89
Patent #:
6486537
Issue Dt:
11/26/2002
Application #:
09812426
Filing Dt:
03/19/2001
Title:
SEMICONDUCTOR PACKAGE WITH WARPAGE RESISTANT SUBSTRATE
90
Patent #:
6545345
Issue Dt:
04/08/2003
Application #:
09813485
Filing Dt:
03/20/2001
Title:
MOUNTING FOR A PACKAGE CONTAINING A CHIP
91
Patent #:
6759737
Issue Dt:
07/06/2004
Application #:
09816599
Filing Dt:
03/23/2001
Publication #:
US20030001252
Pub Dt:
01/02/2003
Title:
SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS WITH ALIGNED INPUT/OUTPUT PADS
92
Patent #:
6858919
Issue Dt:
02/22/2005
Application #:
09816852
Filing Dt:
03/23/2001
Publication #:
US20020020907
Pub Dt:
02/21/2002
Title:
SEMICONDUCTOR PACKAGE
93
Patent #:
6597059
Issue Dt:
07/22/2003
Application #:
09825785
Filing Dt:
04/04/2001
Title:
THERMALLY ENHANCED CHIP SCALE LEAD ON CHIP SEMICONDUCTOR PACKAGE
94
Patent #:
6528869
Issue Dt:
03/04/2003
Application #:
09827619
Filing Dt:
04/06/2001
Title:
SEMICONDUCTOR PACKAGE WITH MOLDED SUBSTRATE AND RECESSED INPUT/OUTPUT TERMINALS
95
Patent #:
6756658
Issue Dt:
06/29/2004
Application #:
09827791
Filing Dt:
04/06/2001
Title:
MAKING TWO LEAD SURFACE MOUNTING HIGH POWER MICROLEADFRAME SEMICONDUCTOR PACKAGES
96
Patent #:
6603072
Issue Dt:
08/05/2003
Application #:
09828046
Filing Dt:
04/06/2001
Title:
MAKING LEADFRAME SEMICONDUCTOR PACKAGES WITH STACKED DIES AND INTERCONNECTING INTERPOSER
97
Patent #:
6437449
Issue Dt:
08/20/2002
Application #:
09828396
Filing Dt:
04/06/2001
Title:
MAKING SEMICONDUCTOR DEVICES HAVING STACKED DIES WITH BIASED BACK SURFACES
98
Patent #:
6791166
Issue Dt:
09/14/2004
Application #:
09829341
Filing Dt:
04/09/2001
Title:
STACKABLE LEAD FRAME PACKAGE USING EXPOSED INTERNAL LEAD TRACES
99
Patent #:
6580167
Issue Dt:
06/17/2003
Application #:
09839284
Filing Dt:
04/20/2001
Title:
HEAT SPREADER WITH SPRING IC PACKAGE
100
Patent #:
6562655
Issue Dt:
05/13/2003
Application #:
09839288
Filing Dt:
04/20/2001
Title:
HEAT SPREADER WITH SPRING IC PACKAGE FABRICATION METHOD
Assignor
1
AMKOR TECHNOLOGY, INC.
Exec Dt:
07/13/2018
Assignee
1
BANK OF AMERICA, N.A., AS AGENT
333 SOUTH HOPE STREET
19TH FLOOR
LOS ANGELES, CALIFORNIA 90071
Correspondence name and address
MCGUIREWOODS LLP
1750 TYSONS BOULEVARD
SUITE 1800
TYSONS, VA 22102

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