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Reel/Frame:	046683/0139			Pages:	67
		Recorded:	08/01/2018
Attorney Dkt #:	2068279-5062
Conveyance:	SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 1156
Page 4 of 12
Pages: 1 2 3 4 5 6 7 8 9 10 11 12

Patent #:	6528875	Issue Dt:	03/04/2003	Application #:	09839305	Filing Dt:	04/20/2001
Title:	VACUUM SEALED PACKAGE FOR SEMICONDUCTOR CHIP

Patent #:	6420204	Issue Dt:	07/16/2002	Application #:	09839861	Filing Dt:	04/20/2001
Publication #:	US20010014486	Pub Dt:	08/16/2001
Title:	METHOD OF MAKING A PLASTIC PAKAGE FOR AN OPTICAL INTEGRATED CIRCUIT DEVICE

Patent #:	7042068	Issue Dt:	05/09/2006	Application #:	09845601	Filing Dt:	04/27/2001
Publication #:	US20050029638	Pub Dt:	02/10/2005
Title:	LEADFRAME AND SEMICONDUCTOR PACKAGE MADE USING THE LEADFRAME

Patent #:	6614102	Issue Dt:	09/02/2003	Application #:	09848864	Filing Dt:	05/04/2001
Title:	SHIELDED SEMICONDUCTOR LEADFRAME PACKAGE

Patent #:	6707168	Issue Dt:	03/16/2004	Application #:	09848932	Filing Dt:	05/04/2001
Title:	SHIELDED SEMICONDUCTOR PACKAGE WITH SINGLE-SIDED SUBSTRATE AND METHOD FOR MAKING THE SAME

Patent #:	6620862	Issue Dt:	09/16/2003	Application #:	09851564	Filing Dt:	05/08/2001
Publication #:	US20020001688	Pub Dt:	01/03/2002
Title:	SHEET RESIN COMPOSITION

Patent #:	6686649	Issue Dt:	02/03/2004	Application #:	09855244	Filing Dt:	05/14/2001
Title:	MULTI-CHIP SEMICONDUCTOR PACKAGE WITH INTEGRAL SHIELD AND ANTENNA

Patent #:	6586677	Issue Dt:	07/01/2003	Application #:	09863359	Filing Dt:	05/22/2001
Publication #:	US20020027010	Pub Dt:	03/07/2002
Title:	PLASTIC INTEGRATED CIRCUIT DEVICE PACKAGE HAVING EXPOSED LEAD SURFACE

Patent #:	6429513	Issue Dt:	08/06/2002	Application #:	09866100	Filing Dt:	05/25/2001
Title:	ACTIVE HEAT SINK FOR COOLING A SEMICONDUCTOR CHIP

Patent #:	6670551	Issue Dt:	12/30/2003	Application #:	09871993	Filing Dt:	06/04/2001
Publication #:	US20020048842	Pub Dt:	04/25/2002
Title:	IMAGE SENSING COMPONENT PACKAGE AND MANUFACTURE METHOD THEREOF

Patent #:	6632997	Issue Dt:	10/14/2003	Application #:	09880277	Filing Dt:	06/13/2001
Publication #:	US20030000722	Pub Dt:	01/02/2003
Title:	PERSONALIZED CIRCUIT MODULE PACKAGE AND METHOD FOR PACKAGING CIRCUIT MODULES

Patent #:	6627987	Issue Dt:	09/30/2003	Application #:	09881343	Filing Dt:	06/13/2001
Title:	HERMETIC CERAMIC SEMICONDUCTOR PACKAGE

Patent #:	6586826	Issue Dt:	07/01/2003	Application #:	09881344	Filing Dt:	06/13/2001
Title:	INTEGRATED CIRCUIT PACKAGE HAVING POSTS FOR CONNECTION TO OTHER PACKAGES AND SUBSTRATES

Patent #:	6967124	Issue Dt:	11/22/2005	Application #:	09884193	Filing Dt:	06/19/2001
Title:	IMPRINTED INTEGRATED CIRCUIT SUBSTRATE AND METHOD FOR IMPRINTING AN INTEGRATED CIRCUIT SUBSTRATE

Patent #:	6417576	Issue Dt:	07/09/2002	Application #:	09884357	Filing Dt:	06/18/2001
Title:	METHOD AND APPARATUS FOR ATTACHING MULTIPLE METAL COMPONENTS TO INTEGRATED CIRCUIT MODULES

Patent #:	6660559	Issue Dt:	12/09/2003	Application #:	09888950	Filing Dt:	06/25/2001
Title:	METHOD OF MAKING A CHIP CARRIER PACKAGE USING LASER ABLATION

Patent #:	6765801	Issue Dt:	07/20/2004	Application #:	09891678	Filing Dt:	06/25/2001
Title:	OPTICAL TRACK DRAIN PACKAGE

Patent #:	6534338	Issue Dt:	03/18/2003	Application #:	09895767	Filing Dt:	06/29/2001
Title:	METHOD FOR MOLDING SEMICONDUCTOR PACKAGE HAVING A CERAMIC SUBSTRATE

Patent #:	6548759	Issue Dt:	04/15/2003	Application #:	09895994	Filing Dt:	06/28/2001
Title:	PRE-DRILLED IMAGE SENSOR PACKAGE

Patent #:	6661080	Issue Dt:	12/09/2003	Application #:	09895996	Filing Dt:	06/28/2001
Title:	STRUCTURE FOR BACKSIDE SAW CAVITY PROTECTION

Patent #:	6734419	Issue Dt:	05/11/2004	Application #:	09896014	Filing Dt:	06/28/2001
Title:	METHOD FOR FORMING AN IMAGE SENSOR PACKAGE WITH VISION DIE IN LENS HOUSING

Patent #:	6730536	Issue Dt:	05/04/2004	Application #:	09896074	Filing Dt:	06/28/2001
Title:	PRE-DRILLED IMAGE SENSOR PACKAGE FABRICATION METHOD

Patent #:	6717126	Issue Dt:	04/06/2004	Application #:	09906868	Filing Dt:	07/16/2001
Title:	METHOD OF FABRICATING AND USING AN IMAGE SENSOR PACKAGE WITH REFLECTOR

Patent #:	6686580	Issue Dt:	02/03/2004	Application #:	09906992	Filing Dt:	07/16/2001
Title:	IMAGE SENSOR PACKAGE WITH REFLECTOR

Patent #:	6657298	Issue Dt:	12/02/2003	Application #:	09909160	Filing Dt:	07/18/2001
Title:	INTEGRATED CIRCUIT CHIP PACKAGE HAVING AN INTERNAL LEAD

Patent #:	6586824	Issue Dt:	07/01/2003	Application #:	09916716	Filing Dt:	07/26/2001
Title:	REDUCED THICKNESS PACKAGED ELECTRONIC DEVICE

Patent #:	6399418	Issue Dt:	06/04/2002	Application #:	09916719	Filing Dt:	07/26/2001
Title:	METHOD FOR FORMING A REDUCED THICKNESS PACKAGED ELECTRONIC DEVICE

Patent #:	6486545	Issue Dt:	11/26/2002	Application #:	09916848	Filing Dt:	07/26/2001
Title:	PRE-DRILLED BALL GRID ARRAY PACKAGE

Patent #:	7126218	Issue Dt:	10/24/2006	Application #:	09923834	Filing Dt:	08/07/2001
Title:	EMBEDDED HEAT SPREADER BALL GRID ARRAY

Patent #:	6577012	Issue Dt:	06/10/2003	Application #:	09929239	Filing Dt:	08/13/2001
Title:	LASER DEFINED PADS FOR FLIP CHIP ON LEADFRAME PACKAGE

Patent #:	6593545	Issue Dt:	07/15/2003	Application #:	09929428	Filing Dt:	08/13/2001
Title:	LASER DEFINED PADS FOR FLIP CHIP ON LEADFRAME PACKAGE FABRICATION METHOD

Patent #:	6784376	Issue Dt:	08/31/2004	Application #:	09931144	Filing Dt:	08/16/2001
Title:	SOLDERABLE INJECTION-MOLDED INTEGRATED CIRCUIT SUBSTRATE AND METHOD THEREFOR

Patent #:	6476476	Issue Dt:	11/05/2002	Application #:	09932109	Filing Dt:	08/16/2001
Title:	INTEGRATED CIRCUIT PACKAGE INCLUDING PIN AND BARREL INTERCONNECTS

Patent #:	7102216	Issue Dt:	09/05/2006	Application #:	09932290	Filing Dt:	08/17/2001
Title:	SEMICONDUCTOR PACKAGE AND LEADFRAME WITH HORIZONTAL LEADS SPACED IN THE VERTICAL DIRECTION AND METHOD OF MAKING

Patent #:	6534391	Issue Dt:	03/18/2003	Application #:	09932528	Filing Dt:	08/17/2001
Title:	SEMICONDUCTOR PACKAGE HAVING SUBSTRATE WITH LASER-FORMED APERTURE THROUGH SOLDER MASK LAYER

Patent #:	6570825	Issue Dt:	05/27/2003	Application #:	09934040	Filing Dt:	08/21/2001
Publication #:	US20030043551	Pub Dt:	03/06/2003
Title:	METHOD AND CIRCUIT MODULE PACKAGE FOR AUTOMATED SWITCH ACTUATOR INSERTION

Patent #:	6816523	Issue Dt:	11/09/2004	Application #:	09940103	Filing Dt:	08/27/2001
Title:	VCSEL PACKAGE AND FABRICATION METHOD

Patent #:	6861720	Issue Dt:	03/01/2005	Application #:	09943068	Filing Dt:	08/29/2001
Title:	PLACEMENT TEMPLATE AND METHOD FOR PLACING OPTICAL DIES

Patent #:	6603183	Issue Dt:	08/05/2003	Application #:	09946750	Filing Dt:	09/04/2001
Title:	QUICK SEALING GLASS-LIDDED PACKAGE

Patent #:	6759266	Issue Dt:	07/06/2004	Application #:	09946861	Filing Dt:	09/04/2001
Title:	QUICK SEALING GLASS-LIDDED PACKAGE FABRICATION METHOD

Patent #:	6396130	Issue Dt:	05/28/2002	Application #:	09953422	Filing Dt:	09/14/2001
Title:	SEMICONDUCTOR PACKAGE HAVING MULTIPLE DIES WITH INDEPENDENTLY BIASED BACK SURFACES

Patent #:	6900527	Issue Dt:	05/31/2005	Application #:	09956190	Filing Dt:	09/19/2001
Title:	LEAD-FRAME METHOD AND ASSEMBLY FOR INTERCONNECTING CIRCUITS WITHIN A CIRCUIT MODULE

Patent #:	6762122	Issue Dt:	07/13/2004	Application #:	09966316	Filing Dt:	09/27/2001
Publication #:	US20030057559	Pub Dt:	03/27/2003
Title:	METHODS OF FORMING METALLURGY STRUCTURES FOR WIRE AND SOLDER BONDING

Patent #:	6555917	Issue Dt:	04/29/2003	Application #:	09974541	Filing Dt:	10/09/2001
Title:	SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD OF MAKING THE SAME

Patent #:	6611047	Issue Dt:	08/26/2003	Application #:	09976866	Filing Dt:	10/12/2001
Publication #:	US20030073265	Pub Dt:	04/17/2003
Title:	SEMICONDUCTOR PACKAGE WITH SINGULATION CREASE

Patent #:	6608497	Issue Dt:	08/19/2003	Application #:	09978535	Filing Dt:	10/15/2001
Title:	APPARATUS AND METHOD FOR ALLOWING TESTING OF SEMICONDUCTOR DEVICES AT DIFFERENT TEMPERATURES

Patent #:	6686651	Issue Dt:	02/03/2004	Application #:	09996226	Filing Dt:	11/27/2001
Title:	MULTI-LAYER LEAD FRAME STRUCTURE

Patent #:	6605865	Issue Dt:	08/12/2003	Application #:	09998844	Filing Dt:	10/19/2001
Publication #:	US20020130400	Pub Dt:	09/19/2002
Title:	SEMICONDUCTOR PACKAGE WITH OPTIMIZED LEADFRAME BONDING STRENGTH

Patent #:	6507102	Issue Dt:	01/14/2003	Application #:	10006642	Filing Dt:	12/05/2001
Publication #:	US20020043402	Pub Dt:	04/18/2002
Title:	PRINTED CIRCUIT BOARD WITH INTEGRAL HEAT SINK FOR SEMICONDUCTOR PACKAGE

Patent #:	6684496	Issue Dt:	02/03/2004	Application #:	10007337	Filing Dt:	10/22/2001
Publication #:	US20020038714	Pub Dt:	04/04/2002
Title:	METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE

Patent #:	6630726	Issue Dt:	10/07/2003	Application #:	10008048	Filing Dt:	11/07/2001
Title:	POWER SEMICONDUCTOR PACKAGE WITH STRAP

Patent #:	7032806	Issue Dt:	04/25/2006	Application #:	10008466	Filing Dt:	11/09/2001
Publication #:	US20020153092	Pub Dt:	10/24/2002
Title:	METHODS OF POSITIONING COMPONENTS USING LIQUID PRIME MOVERS AND RELATED STRUCTURES

Patent #:	6630661	Issue Dt:	10/07/2003	Application #:	10012378	Filing Dt:	12/12/2001
Title:	SENSOR MODULE WITH INTEGRATED DISCRETE COMPONENTS

Patent #:	6713322	Issue Dt:	03/30/2004	Application #:	10013160	Filing Dt:	12/10/2001
Publication #:	US20020140061	Pub Dt:	10/03/2002
Title:	LEAD FRAME FOR SEMICONDUCTOR PACKAGE

Patent #:	6737750	Issue Dt:	05/18/2004	Application #:	10013396	Filing Dt:	12/07/2001
Title:	STRUCTURES FOR IMPROVING HEAT DISSIPATION IN STACKED SEMICONDUCTOR PACKAGES

Patent #:	6666368	Issue Dt:	12/23/2003	Application #:	10016270	Filing Dt:	11/02/2001
Publication #:	US20020109000	Pub Dt:	08/15/2002
Title:	METHODS AND SYSTEMS FOR POSITIONING SUBSTRATES USING SPRING FORCE OF PHASE-CHANGEABLE BUMPS THEREBETWEEN

Patent #:	6863209	Issue Dt:	03/08/2005	Application #:	10017350	Filing Dt:	12/14/2001
Publication #:	US20020074381	Pub Dt:	06/20/2002
Title:	LOW TEMPERATURE METHODS OF BONDING COMPONENTS AND RELATED STRUCTURES

Patent #:	6803645	Issue Dt:	10/12/2004	Application #:	10034656	Filing Dt:	12/26/2001
Publication #:	US20020084534	Pub Dt:	07/04/2002
Title:	SEMICONDUCTOR PACKAGE INCLUDING FLIP CHIP

Patent #:	6927478	Issue Dt:	08/09/2005	Application #:	10043946	Filing Dt:	01/11/2002
Publication #:	US20020093087	Pub Dt:	07/18/2002
Title:	REDUCED SIZE SEMICONDUCTOR PACKAGE WITH STACKED DIES

Patent #:	6793792	Issue Dt:	09/21/2004	Application #:	10044387	Filing Dt:	01/11/2002
Publication #:	US20020092771	Pub Dt:	07/18/2002
Title:	ELECTROPLATING METHODS INCLUDING MAINTAINING A DETERMINED ELECTROPLATING VOLTAGE AND RELATED SYSTEMS

Patent #:	6740950	Issue Dt:	05/25/2004	Application #:	10046995	Filing Dt:	01/14/2002
Publication #:	US20020093078	Pub Dt:	07/18/2002
Title:	OPTICAL DEVICE PACKAGES HAVING IMPROVED CONDUCTOR EFFICIENCY, OPTICAL COUPLING AND THERMAL TRANSFER

Patent #:	6798046	Issue Dt:	09/28/2004	Application #:	10054124	Filing Dt:	01/22/2002
Title:	SEMICONDUCTOR PACKAGE INCLUDING RINGS STRUCTURE CONNECTED TO LEADS WITH VERTICALLY DOWNSET INNER ENDS

Patent #:	6784534	Issue Dt:	08/31/2004	Application #:	10067068	Filing Dt:	02/06/2002
Title:	THIN INTEGRATED CIRCUIT PACKAGE HAVING AN OPTICALLY TRANSPARENT WINDOW

Patent #:	6670698	Issue Dt:	12/30/2003	Application #:	10068717	Filing Dt:	02/05/2002
Title:	INTEGRATED CIRCUIT PACKAGE MOUNTING

Patent #:	6982485	Issue Dt:	01/03/2006	Application #:	10076701	Filing Dt:	02/13/2002
Title:	STACKING STRUCTURE FOR SEMICONDUCTOR CHIPS AND A SEMICONDUCTOR PACKAGE USING IT

Patent #:	7019387	Issue Dt:	03/28/2006	Application #:	10076896	Filing Dt:	02/14/2002
Title:	LEAD-FRAME CONNECTOR AND CIRCUIT MODULE ASSEMBLY

Patent #:	6710438	Issue Dt:	03/23/2004	Application #:	10078718	Filing Dt:	02/19/2002
Publication #:	US20030155641	Pub Dt:	08/21/2003
Title:	ENHANCED CHIP SCALE PACKAGE FOR WIRE BOND DIES

Patent #:	7154171	Issue Dt:	12/26/2006	Application #:	10082472	Filing Dt:	02/22/2002
Title:	STACKING STRUCTURE FOR SEMICONDUCTOR DEVICES USING A FOLDED OVER FLEXIBLE SUBSTRATE AND METHOD THEREFOR

Patent #:	6576998	Issue Dt:	06/10/2003	Application #:	10086293	Filing Dt:	02/28/2002
Title:	THIN SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR CHIP AND ELECTRONIC DISCRETE DEVICE

Patent #:	6885086	Issue Dt:	04/26/2005	Application #:	10093267	Filing Dt:	03/05/2002
Title:	REDUCED COPPER LEAD FRAME FOR SAW-SINGULATED CHIP PACKAGE

Patent #:	6509637	Issue Dt:	01/21/2003	Application #:	10094731	Filing Dt:	03/08/2002
Title:	LOW PROFILE MOUNTING OF THICK INTEGRATED CIRCUIT PACKAGES WITHIN LOW-PROFILE CIRCUIT MODULES

Patent #:	6838309	Issue Dt:	01/04/2005	Application #:	10097905	Filing Dt:	03/13/2002
Title:	FLIP-CHIP MICROMACHINE PACKAGE USING SEAL LAYER

Patent #:	6700187	Issue Dt:	03/02/2004	Application #:	10103048	Filing Dt:	03/21/2002
Publication #:	US20020140065	Pub Dt:	10/03/2002
Title:	SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Patent #:	6995448	Issue Dt:	02/07/2006	Application #:	10107656	Filing Dt:	03/25/2002
Publication #:	US20020140085	Pub Dt:	10/03/2002
Title:	SEMICONDUCTOR PACKAGE INCLUDING PASSIVE ELEMENTS AND METHOD OF MANUFACTURE

Patent #:	6770961	Issue Dt:	08/03/2004	Application #:	10115218	Filing Dt:	04/02/2002
Publication #:	US20020149092	Pub Dt:	10/17/2002
Title:	CARRIER FRAME AND SEMICONDUCTOR PACKAGE INCLUDING CARRIER FRAME

Patent #:	6683795	Issue Dt:	01/27/2004	Application #:	10121215	Filing Dt:	04/10/2002
Title:	SHIELD CAP AND SEMICONDUCTOR PACKAGE INCLUDING SHIELD CAP

Patent #:	6608366	Issue Dt:	08/19/2003	Application #:	10122598	Filing Dt:	04/15/2002
Title:	LEAD FRAME WITH PLATED END LEADS AND RECESSES

Patent #:	6930256	Issue Dt:	08/16/2005	Application #:	10138225	Filing Dt:	05/01/2002
Title:	INTEGRATED CIRCUIT SUBSTRATE HAVING LASER-EMBEDDED CONDUCTIVE PATTERNS AND METHOD THEREFOR

Patent #:	6627977	Issue Dt:	09/30/2003	Application #:	10142222	Filing Dt:	05/09/2002
Title:	SEMICONDUCTOR PACKAGE INCLUDING ISOLATED RING STRUCTURE

Patent #:	6807218	Issue Dt:	10/19/2004	Application #:	10144905	Filing Dt:	05/13/2002
Title:	LASER MODULE AND OPTICAL SUBASSEMBLY

Patent #:	6962829	Issue Dt:	11/08/2005	Application #:	10150400	Filing Dt:	05/17/2002
Publication #:	US20020168798	Pub Dt:	11/14/2002
Title:	METHOD OF MAKING NEAR CHIP SIZE INTEGRATED CIRCUIT PACKAGE

Patent #:	6825062	Issue Dt:	11/30/2004	Application #:	10152945	Filing Dt:	05/22/2002
Publication #:	US20030020146	Pub Dt:	01/30/2003
Title:	SEMICONDUCTOR PACKAGE AND METHOD OF MAKING USING LEADFRAME HAVING LEAD LOCKS TO SECURE LEADS TO ENCAPSULANT

Patent #:	6710945	Issue Dt:	03/23/2004	Application #:	10161963	Filing Dt:	06/03/2002
Title:	INJECTION MOLDED LENS-BARREL ASSEMBLY AND METHOD FOR FABRICATING LENS-BARREL AND MOUNT ASSEMBLIES

Patent #:	6830955	Issue Dt:	12/14/2004	Application #:	10162953	Filing Dt:	06/04/2002
Publication #:	US20030001285	Pub Dt:	01/02/2003
Title:	SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Patent #:	6630728	Issue Dt:	10/07/2003	Application #:	10171702	Filing Dt:	06/14/2002
Publication #:	US20020148630	Pub Dt:	10/17/2002
Title:	PLASTIC INTEGRATED CIRCUIT PACKAGE AND LEADFRAME FOR MAKING THE PACKAGE

Patent #:	6841414	Issue Dt:	01/11/2005	Application #:	10174603	Filing Dt:	06/19/2002
Title:	SAW AND ETCH SINGULATION METHOD FOR A CHIP PACKAGE

Patent #:	6867071	Issue Dt:	03/15/2005	Application #:	10194557	Filing Dt:	07/12/2002
Title:	LEADFRAME INCLUDING CORNER LEADS AND SEMICONDUCTOR PACKAGE USING SAME

Patent #:	7042072	Issue Dt:	05/09/2006	Application #:	10212496	Filing Dt:	08/02/2002
Title:	SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME WHICH REDUCES WARPAGE

Patent #:	6831371	Issue Dt:	12/14/2004	Application #:	10223747	Filing Dt:	08/19/2002
Title:	INTEGRATED CIRCUIT SUBSTRATE HAVING EMBEDDED WIRE CONDUCTORS AND METHOD THEREFOR

Patent #:	6747352	Issue Dt:	06/08/2004	Application #:	10223749	Filing Dt:	08/19/2002
Title:	INTEGRATED CIRCUIT HAVING MULTIPLE POWER/GROUND CONNECTIONS TO A SINGLE EXTERNAL TERMINAL AND METHOD THEREFOR

Patent #:	6650019	Issue Dt:	11/18/2003	Application #:	10224864	Filing Dt:	08/20/2002
Publication #:	US20020195624	Pub Dt:	12/26/2002
Title:	METHOD OF MAKING A SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR DIES

Patent #:	7146106	Issue Dt:	12/05/2006	Application #:	10227051	Filing Dt:	08/23/2002
Publication #:	US20040036135	Pub Dt:	02/26/2004
Title:	OPTIC SEMICONDUCTOR MODULE AND MANUFACTURING METHOD

Patent #:	6646290	Issue Dt:	11/11/2003	Application #:	10227054	Filing Dt:	08/23/2002
Title:	OPTIC SEMICONDUCTOR PACKAGE

Patent #:	6816032	Issue Dt:	11/09/2004	Application #:	10235135	Filing Dt:	09/03/2002
Title:	LAMINATED LOW-PROFILE DUAL FILTER MODULE FOR TELECOMMUNICATIONS DEVICES AND METHOD THEREFOR

Patent #:	6818973	Issue Dt:	11/16/2004	Application #:	10237293	Filing Dt:	09/09/2002
Title:	EXPOSED LEAD QFP PACKAGE FABRICATED THROUGH THE USE OF A PARTIAL SAW PROCESS

Patent #:	6919620	Issue Dt:	07/19/2005	Application #:	10245071	Filing Dt:	09/17/2002
Title:	COMPACT FLASH MEMORY CARD WITH CLAMSHELL LEADFRAME

Patent #:	6717822	Issue Dt:	04/06/2004	Application #:	10251410	Filing Dt:	09/20/2002
Title:	LEAD-FRAME METHOD AND CIRCUIT MODULE ASSEMBLY INCLUDING EDGE STIFFENER

Patent #:	6707138	Issue Dt:	03/16/2004	Application #:	10256905	Filing Dt:	09/26/2002
Publication #:	US20030075785	Pub Dt:	04/24/2003
Title:	SEMICONDUCTOR DEVICE INCLUDING METAL STRAP ELECTRICALLY COUPLED BETWEEN SEMICONDUCTOR DIE AND METAL LEADFRAME

Patent #:	6910635	Issue Dt:	06/28/2005	Application #:	10266329	Filing Dt:	10/08/2002
Title:	DIE DOWN MULTI-MEDIA CARD AND METHOD OF MAKING SAME

100

Patent #:	6841874	Issue Dt:	01/11/2005	Application #:	10285978	Filing Dt:	11/01/2002
Title:	WAFER-LEVEL CHIP-SCALE PACKAGE

Assignor

AMKOR TECHNOLOGY, INC.

Exec Dt:

07/13/2018

Assignee

BANK OF AMERICA, N.A., AS AGENT

333 SOUTH HOPE STREET

19TH FLOOR

LOS ANGELES, CALIFORNIA 90071

Correspondence name and address
	MCGUIREWOODS LLP
	1750 TYSONS BOULEVARD
	SUITE 1800
	TYSONS, VA 22102

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