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Reel/Frame:046683/0139   Pages: 67
Recorded: 08/01/2018
Attorney Dkt #:2068279-5062
Conveyance: SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1156
Page 6 of 12
Pages: 1 2 3 4 5 6 7 8 9 10 11 12
1
Patent #:
7629674
Issue Dt:
12/08/2009
Application #:
10992036
Filing Dt:
11/17/2004
Title:
SHIELDED PACKAGE HAVING SHIELD FENCE
2
Patent #:
6987319
Issue Dt:
01/17/2006
Application #:
11006210
Filing Dt:
12/06/2004
Title:
WAFER-LEVEL CHIP-SCALE PACKAGE
3
Patent #:
7001799
Issue Dt:
02/21/2006
Application #:
11009262
Filing Dt:
12/09/2004
Title:
METHOD OF MAKING A LEADFRAME FOR SEMICONDUCTOR DEVICES
4
Patent #:
7064009
Issue Dt:
06/20/2006
Application #:
11018731
Filing Dt:
12/21/2004
Title:
THERMALLY ENHANCED CHIP SCALE LEAD ON CHIP SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME
5
Patent #:
7030474
Issue Dt:
04/18/2006
Application #:
11021340
Filing Dt:
12/22/2004
Title:
PLASTIC INTEGRATED CIRCUIT PACKAGE AND METHOD AND LEADFRAME FOR MAKING THE PACKAGE
6
Patent #:
7312103
Issue Dt:
12/25/2007
Application #:
11021977
Filing Dt:
12/22/2004
Title:
METHOD FOR MAKING AN INTEGRATED CIRCUIT SUBSTRATE HAVING LASER-EMBEDDED CONDUCTIVE PATTERNS
7
Patent #:
7176062
Issue Dt:
02/13/2007
Application #:
11035239
Filing Dt:
01/13/2005
Title:
LEAD-FRAME METHOD AND ASSEMBLY FOR INTERCONNECTING CIRCUITS WITHIN A CIRCUIT MODULE
8
Patent #:
7145251
Issue Dt:
12/05/2006
Application #:
11038756
Filing Dt:
01/19/2005
Publication #:
US20050156327
Pub Dt:
07/21/2005
Title:
COLORED CONDUCTIVE WIRES FOR A SEMICONDUCTOR PACKAGE
9
Patent #:
7214326
Issue Dt:
05/08/2007
Application #:
11039434
Filing Dt:
01/19/2005
Title:
INCREASED CAPACITY LEADFRAME AND SEMICONDUCTOR PACKAGE USING THE SAME
10
Patent #:
7247523
Issue Dt:
07/24/2007
Application #:
11047848
Filing Dt:
01/31/2005
Title:
TWO-SIDED WAFER ESCAPE PACKAGE
11
Patent #:
7220915
Issue Dt:
05/22/2007
Application #:
11060263
Filing Dt:
02/17/2005
Title:
MEMORY CARD AND ITS MANUFACTURING METHOD
12
Patent #:
7112875
Issue Dt:
09/26/2006
Application #:
11060264
Filing Dt:
02/17/2005
Title:
SECURE DIGITAL MEMORY CARD USING LAND GRID ARRAY STRUCTURE
13
Patent #:
6995459
Issue Dt:
02/07/2006
Application #:
11063299
Filing Dt:
02/22/2005
Publication #:
US20050139969
Pub Dt:
06/30/2005
Title:
SEMICONDUCTOR PACKAGE WITH INCREASED NUMBER OF INPUT AND OUTPUT PINS
14
Patent #:
7427557
Issue Dt:
09/23/2008
Application #:
11075474
Filing Dt:
03/09/2005
Publication #:
US20050215045
Pub Dt:
09/29/2005
Title:
METHODS OF FORMING BUMPS USING BARRIER LAYERS AS ETCH MASKS
15
Patent #:
7334326
Issue Dt:
02/26/2008
Application #:
11078833
Filing Dt:
03/11/2005
Title:
METHOD FOR MAKING AN INTEGRATED CIRCUIT SUBSTRATE HAVING EMBEDDED PASSIVE COMPONENTS
16
Patent #:
8826531
Issue Dt:
09/09/2014
Application #:
11098995
Filing Dt:
04/05/2005
Title:
Method for making an integrated circuit substrate having laminated laser-embedded circuit layers
17
Patent #:
7358174
Issue Dt:
04/15/2008
Application #:
11103690
Filing Dt:
04/12/2005
Publication #:
US20050245066
Pub Dt:
11/03/2005
Title:
METHODS OF FORMING SOLDER BUMPS ON EXPOSED METAL PADS
18
Patent #:
7362038
Issue Dt:
04/22/2008
Application #:
11108359
Filing Dt:
04/18/2005
Title:
SURFACE ACOUSTIC WAVE (SAW) DEVICE PACKAGE AND METHOD FOR PACKAGING A SAW DEVICE
19
Patent #:
7011251
Issue Dt:
03/14/2006
Application #:
11109329
Filing Dt:
04/19/2005
Title:
DIE DOWN MULTI-MEDIA CARD AND METHOD OF MAKING SAME
20
Patent #:
7755176
Issue Dt:
07/13/2010
Application #:
11111316
Filing Dt:
04/21/2005
Title:
DIE-MOUNTING SUBSTRATE AND METHOD INCORPORATING DUMMY TRACES FOR IMPROVING MOUNTING FILM PLANARITY
21
Patent #:
7227236
Issue Dt:
06/05/2007
Application #:
11115574
Filing Dt:
04/26/2005
Title:
IMAGE SENSOR PACKAGE AND ITS MANUFACTURING METHOD
22
Patent #:
7446422
Issue Dt:
11/04/2008
Application #:
11115579
Filing Dt:
04/26/2005
Title:
WAFER LEVEL CHIP SCALE PACKAGE AND MANUFACTURING METHOD FOR THE SAME
23
Patent #:
7132753
Issue Dt:
11/07/2006
Application #:
11115706
Filing Dt:
04/26/2005
Title:
STACKED DIE ASSEMBLY HAVING SEMICONDUCTOR DIE OVERHANGING SUPPORT
24
Patent #:
7126111
Issue Dt:
10/24/2006
Application #:
11119234
Filing Dt:
04/28/2005
Publication #:
US20050242274
Pub Dt:
11/03/2005
Title:
CAMERA MODULE HAVING A THREADED LENS BARREL AND A BALL GRID ARRAY CONNECTING DEVICE
25
Patent #:
7293716
Issue Dt:
11/13/2007
Application #:
11120087
Filing Dt:
05/02/2005
Title:
SECURE DIGITAL MEMORY CARD USING LAND GRID ARRAY STRUCTURE
26
Patent #:
7192807
Issue Dt:
03/20/2007
Application #:
11123605
Filing Dt:
05/05/2005
Title:
WAFER LEVEL PACKAGE AND FABRICATION METHOD
27
Patent #:
7170183
Issue Dt:
01/30/2007
Application #:
11128633
Filing Dt:
05/13/2005
Title:
WAFER LEVEL STACKED PACKAGE
28
Patent #:
7211900
Issue Dt:
05/01/2007
Application #:
11129596
Filing Dt:
05/13/2005
Publication #:
US20050205979
Pub Dt:
09/22/2005
Title:
THIN SEMICONDUCTOR PACKAGE INCLUDING STACKED DIES
29
Patent #:
7297562
Issue Dt:
11/20/2007
Application #:
11166005
Filing Dt:
06/24/2005
Title:
CIRCUIT-ON-FOIL PROCESS FOR MANUFACTURING A LAMINATED SEMICONDUCTOR PACKAGE SUBSTRATE HAVING EMBEDDED CONDUCTIVE PATTERNS
30
Patent #:
7745918
Issue Dt:
06/29/2010
Application #:
11168168
Filing Dt:
06/27/2005
Title:
PACKAGE IN PACKAGE (PIP)
31
Patent #:
7547623
Issue Dt:
06/16/2009
Application #:
11170220
Filing Dt:
06/29/2005
Publication #:
US20060030139
Pub Dt:
02/09/2006
Title:
METHODS OF FORMING LEAD FREE SOLDER BUMPS
32
Patent #:
7576401
Issue Dt:
08/18/2009
Application #:
11177904
Filing Dt:
07/07/2005
Title:
DIRECT GLASS ATTACHED ON DIE OPTICAL MODULE
33
Patent #:
7385408
Issue Dt:
06/10/2008
Application #:
11180463
Filing Dt:
07/12/2005
Title:
APPARATUS AND METHOD FOR TESTING INTEGRATED CIRCUIT DEVICES HAVING CONTACTS ON MULTIPLE SURFACES
34
Patent #:
7429799
Issue Dt:
09/30/2008
Application #:
11190596
Filing Dt:
07/27/2005
Title:
LAND PATTERNS FOR A SEMICONDUCTOR STACKING STRUCTURE AND METHOD THEREFOR
35
Patent #:
7322507
Issue Dt:
01/29/2008
Application #:
11192193
Filing Dt:
07/27/2005
Publication #:
US20060169739
Pub Dt:
08/03/2006
Title:
TRANSDUCER ASSEMBLY, CAPILLARY AND WIRE BONDING METHOD USING THE SAME
36
Patent #:
7045883
Issue Dt:
05/16/2006
Application #:
11198074
Filing Dt:
08/05/2005
Title:
THERMALLY ENHANCED CHIP SCALE LEAD ON CHIP SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME
37
Patent #:
7425750
Issue Dt:
09/16/2008
Application #:
11206513
Filing Dt:
08/17/2005
Publication #:
US20060027740
Pub Dt:
02/09/2006
Title:
SNAP LID CAMERA MODULE
38
Patent #:
7408254
Issue Dt:
08/05/2008
Application #:
11212979
Filing Dt:
08/26/2005
Title:
STACK LAND GRID ARRAY PACKAGE AND METHOD FOR MANUFACTURING THE SAME
39
Patent #:
7213740
Issue Dt:
05/08/2007
Application #:
11213414
Filing Dt:
08/26/2005
Publication #:
US20050279809
Pub Dt:
12/22/2005
Title:
OPTICAL STRUCTURES INCLUDING LIQUID BUMPS AND RELATED METHODS
40
Patent #:
7297631
Issue Dt:
11/20/2007
Application #:
11226569
Filing Dt:
09/14/2005
Publication #:
US20060009023
Pub Dt:
01/12/2006
Title:
METHODS OF FORMING ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE SHUNT LAYERS AND RELATED STRUCTURES
41
Patent #:
7335986
Issue Dt:
02/26/2008
Application #:
11227410
Filing Dt:
09/14/2005
Title:
WAFER LEVEL CHIP SCALE PACKAGE
42
Patent #:
7810695
Issue Dt:
10/12/2010
Application #:
11228791
Filing Dt:
09/16/2005
Publication #:
US20060289605
Pub Dt:
12/28/2006
Title:
WIRE BONDING MACHINE CAPABLE OF REMOVING PARTICLES FROM CAPILLARY AND CLEANING METHOD OF CAPILLARY BOTTOM TIP
43
Patent #:
7459349
Issue Dt:
12/02/2008
Application #:
11254339
Filing Dt:
10/19/2005
Title:
METHOD OF FORMING A STACK OF SEMICONDUCTOR PACKAGES
44
Patent #:
7375975
Issue Dt:
05/20/2008
Application #:
11263428
Filing Dt:
10/31/2005
Title:
ENHANCED DURABILITY MEMORY CARD
45
Patent #:
7531898
Issue Dt:
05/12/2009
Application #:
11270366
Filing Dt:
11/09/2005
Publication #:
US20060076679
Pub Dt:
04/13/2006
Title:
NON-CIRCULAR VIA HOLES FOR BUMPING PADS AND RELATED STRUCTURES
46
Patent #:
7317245
Issue Dt:
01/08/2008
Application #:
11279002
Filing Dt:
04/07/2006
Title:
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE SUBSTRATE
47
Patent #:
7485490
Issue Dt:
02/03/2009
Application #:
11286970
Filing Dt:
11/22/2005
Publication #:
US20060071315
Pub Dt:
04/06/2006
Title:
METHOD OF FORMING A STACKED SEMICONDUCTOR PACKAGE
48
Patent #:
7837120
Issue Dt:
11/23/2010
Application #:
11288906
Filing Dt:
11/29/2005
Title:
MODULAR MEMORY CARD AND METHOD OF MAKING SAME
49
Patent #:
7507603
Issue Dt:
03/24/2009
Application #:
11292778
Filing Dt:
12/02/2005
Title:
ETCH SINGULATED SEMICONDUCTOR PACKAGE
50
Patent #:
7633765
Issue Dt:
12/15/2009
Application #:
11293999
Filing Dt:
12/05/2005
Title:
SEMICONDUCTOR PACKAGE INCLUDING A TOP-SURFACE METAL LAYER FOR IMPLEMENTING CIRCUIT FEATURES
51
Patent #:
7361533
Issue Dt:
04/22/2008
Application #:
11297050
Filing Dt:
12/07/2005
Title:
STACKED EMBEDDED LEADFRAME
52
Patent #:
7572681
Issue Dt:
08/11/2009
Application #:
11298016
Filing Dt:
12/08/2005
Title:
EMBEDDED ELECTRONIC COMPONENT PACKAGE
53
Patent #:
7112474
Issue Dt:
09/26/2006
Application #:
11299859
Filing Dt:
12/12/2005
Title:
METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE
54
Patent #:
7609461
Issue Dt:
10/27/2009
Application #:
11315994
Filing Dt:
12/21/2005
Title:
OPTICAL MODULE HAVING CAVITY SUBSTRATE
55
Patent #:
7359204
Issue Dt:
04/15/2008
Application #:
11355092
Filing Dt:
02/15/2006
Title:
MULTIPLE COVER MEMORY CARD
56
Patent #:
7675180
Issue Dt:
03/09/2010
Application #:
11356921
Filing Dt:
02/17/2006
Title:
STACKED ELECTRONIC COMPONENT PACKAGE HAVING FILM-ON-WIRE SPACER
57
Patent #:
7659621
Issue Dt:
02/09/2010
Application #:
11362964
Filing Dt:
02/27/2006
Publication #:
US20060138675
Pub Dt:
06/29/2006
Title:
SOLDER STRUCTURES FOR OUT OF PLANE CONNECTIONS
58
Patent #:
7342303
Issue Dt:
03/11/2008
Application #:
11364427
Filing Dt:
02/28/2006
Title:
SEMICONDUCTOR DEVICE HAVING RF SHIELDING AND METHOD THEREFOR
59
Patent #:
7564122
Issue Dt:
07/21/2009
Application #:
11365246
Filing Dt:
03/01/2006
Publication #:
US20080036055
Pub Dt:
02/14/2008
Title:
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING USING LEADFRAME HAVING LEAD LOCKS TO SECURE LEADS TO ENCAPSULANT
60
Patent #:
7652361
Issue Dt:
01/26/2010
Application #:
11367171
Filing Dt:
03/03/2006
Title:
LAND PATTERNS FOR A SEMICONDUCTOR STACKING STRUCTURE AND METHOD THEREFOR
61
Patent #:
8410585
Issue Dt:
04/02/2013
Application #:
11372597
Filing Dt:
03/10/2006
Publication #:
US20060151858
Pub Dt:
07/13/2006
Title:
LEADFRAME AND SEMICONDUCTOR PACKAGE MADE USING THE LEADFRAME
62
Patent #:
7719845
Issue Dt:
05/18/2010
Application #:
11379550
Filing Dt:
04/20/2006
Title:
CHAMFERED MEMORY CARD MODULE AND METHOD OF MAKING SAME
63
Patent #:
7535085
Issue Dt:
05/19/2009
Application #:
11408521
Filing Dt:
04/21/2006
Publication #:
US20060186517
Pub Dt:
08/24/2006
Title:
SEMICONDUCTOR PACKAGE HAVING IMPROVED ADHESIVENESS AND GROUND BONDING
64
Patent #:
7556986
Issue Dt:
07/07/2009
Application #:
11425502
Filing Dt:
06/21/2006
Title:
TAPE SUPPORTED MEMORY CARD LEADFRAME STRUCTURE
65
Patent #:
7968998
Issue Dt:
06/28/2011
Application #:
11425505
Filing Dt:
06/21/2006
Title:
SIDE LEADED, BOTTOM EXPOSED PAD AND BOTTOM EXPOSED LEAD FUSION QUAD FLAT SEMICONDUCTOR PACKAGE
66
Patent #:
7485491
Issue Dt:
02/03/2009
Application #:
11427454
Filing Dt:
06/29/2006
Title:
SECURE DIGITAL MEMORY CARD USING LAND GRID ARRAY STRUCTURE
67
Patent #:
7902660
Issue Dt:
03/08/2011
Application #:
11440548
Filing Dt:
05/24/2006
Title:
SUBSTRATE FOR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
68
Patent #:
7633144
Issue Dt:
12/15/2009
Application #:
11440662
Filing Dt:
05/24/2006
Title:
SEMICONDUCTOR PACKAGE
69
Patent #:
7579694
Issue Dt:
08/25/2009
Application #:
11446341
Filing Dt:
06/02/2006
Publication #:
US20060231951
Pub Dt:
10/19/2006
Title:
ELECTRONIC DEVICES INCLUDING OFFSET CONDUCTIVE BUMPS
70
Patent #:
7755164
Issue Dt:
07/13/2010
Application #:
11472874
Filing Dt:
06/21/2006
Title:
CAPACITOR AND RESISTOR HAVING ANODIC METAL AND ANODIC METAL OXIDE STRUCTURE
71
Patent #:
7321162
Issue Dt:
01/22/2008
Application #:
11492481
Filing Dt:
07/25/2006
Title:
SEMICONDUCTOR PACKAGE HAVING REDUCED THICKNESS
72
Patent #:
7548430
Issue Dt:
06/16/2009
Application #:
11497617
Filing Dt:
08/01/2006
Title:
BUILDUP DIELECTRIC AND METALLIZATION PROCESS AND SEMICONDUCTOR PACKAGE
73
Patent #:
7332375
Issue Dt:
02/19/2008
Application #:
11503752
Filing Dt:
08/14/2006
Title:
METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE
74
Patent #:
7521294
Issue Dt:
04/21/2009
Application #:
11510544
Filing Dt:
08/25/2006
Publication #:
US20060289973
Pub Dt:
12/28/2006
Title:
LEAD FRAME FOR SEMICONDUCTOR PACKAGE
75
Patent #:
7199359
Issue Dt:
04/03/2007
Application #:
11526168
Filing Dt:
09/21/2006
Publication #:
US20070012864
Pub Dt:
01/18/2007
Title:
CAMERA MODULE FABRICATION METHOD INCLUDING SINGULATING A SUBSTRATE
76
Patent #:
7501338
Issue Dt:
03/10/2009
Application #:
11527104
Filing Dt:
09/25/2006
Title:
SEMICONDUCTOR PACKAGE SUBSTRATE FABRICATION METHOD
77
Patent #:
7365006
Issue Dt:
04/29/2008
Application #:
11527827
Filing Dt:
09/26/2006
Title:
SEMICONDUCTOR PACKAGE AND SUBSTRATE HAVING MULTI-LEVEL VIAS FABRICATION METHOD
78
Patent #:
7459776
Issue Dt:
12/02/2008
Application #:
11529467
Filing Dt:
09/27/2006
Title:
STACKED DIE ASSEMBLY HAVING SEMICONDUCTOR DIE PROJECTING BEYOND SUPPORT
79
Patent #:
7589398
Issue Dt:
09/15/2009
Application #:
11543540
Filing Dt:
10/04/2006
Title:
EMBEDDED METAL FEATURES STRUCTURE
80
Patent #:
7554194
Issue Dt:
06/30/2009
Application #:
11557884
Filing Dt:
11/08/2006
Publication #:
US20080122068
Pub Dt:
05/29/2008
Title:
THERMALLY ENHANCED SEMICONDUCTOR PACKAGE
81
Patent #:
7550857
Issue Dt:
06/23/2009
Application #:
11560496
Filing Dt:
11/16/2006
Title:
STACKED REDISTRIBUTION LAYER (RDL) DIE ASSEMBLY PACKAGE
82
Patent #:
7781852
Issue Dt:
08/24/2010
Application #:
11566731
Filing Dt:
12/05/2006
Title:
MEMBRANE DIE ATTACH CIRCUIT ELEMENT PACKAGE AND METHOD THEREFOR
83
Patent #:
7898093
Issue Dt:
03/01/2011
Application #:
11592889
Filing Dt:
11/02/2006
Title:
EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE AND FABRICATION METHOD
84
Patent #:
7671457
Issue Dt:
03/02/2010
Application #:
11595411
Filing Dt:
11/09/2006
Title:
SEMICONDUCTOR PACKAGE INCLUDING TOP-SURFACE TERMINALS FOR MOUNTING ANOTHER SEMICONDUCTOR PACKAGE
85
Patent #:
7714431
Issue Dt:
05/11/2010
Application #:
11605740
Filing Dt:
11/28/2006
Title:
ELECTRONIC COMPONENT PACKAGE COMPRISING FAN-OUT AND FAN-IN TRACES
86
Patent #:
7750250
Issue Dt:
07/06/2010
Application #:
11615467
Filing Dt:
12/22/2006
Title:
BLIND VIA CAPTURE PAD STRUCTURE
87
Patent #:
7859116
Issue Dt:
12/28/2010
Application #:
11616069
Filing Dt:
12/26/2006
Title:
EXPOSED METAL BEZEL FOR USE IN SENSOR DEVICES AND METHOD THEREFOR
88
Patent #:
7687893
Issue Dt:
03/30/2010
Application #:
11616747
Filing Dt:
12/27/2006
Publication #:
US20080157311
Pub Dt:
07/03/2008
Title:
SEMICONDUCTOR PACKAGE HAVING LEADFRAME WITH EXPOSED ANCHOR PADS
89
Patent #:
7752752
Issue Dt:
07/13/2010
Application #:
11621402
Filing Dt:
01/09/2007
Title:
METHOD OF FABRICATING AN EMBEDDED CIRCUIT PATTERN
90
Patent #:
7871899
Issue Dt:
01/18/2011
Application #:
11621630
Filing Dt:
01/10/2007
Publication #:
US20070161234
Pub Dt:
07/12/2007
Title:
METHODS OF FORMING BACK SIDE LAYERS FOR THINNED WAFERS
91
Patent #:
7829990
Issue Dt:
11/09/2010
Application #:
11624648
Filing Dt:
01/18/2007
Title:
STACKABLE SEMICONDUCTOR PACKAGE INCLUDING LAMINATE INTERPOSER
92
Patent #:
7674701
Issue Dt:
03/09/2010
Application #:
11671018
Filing Dt:
02/05/2007
Publication #:
US20070184643
Pub Dt:
08/09/2007
Title:
METHODS OF FORMING METAL LAYERS USING MULTI-LAYER LIFT-OFF PATTERNS
93
Patent #:
7932615
Issue Dt:
04/26/2011
Application #:
11671026
Filing Dt:
02/05/2007
Publication #:
US20070182004
Pub Dt:
08/09/2007
Title:
ELECTRONIC DEVICES INCLUDING SOLDER BUMPS ON COMPLIANT DIELECTRIC LAYERS
94
Patent #:
9466545
Issue Dt:
10/11/2016
Application #:
11677506
Filing Dt:
02/21/2007
Title:
Semiconductor Package in Package
95
Patent #:
9367712
Issue Dt:
06/14/2016
Application #:
11681121
Filing Dt:
03/01/2007
Title:
HIGH DENSITY MEMORY CARD USING FOLDED FLEX
96
Patent #:
7982297
Issue Dt:
07/19/2011
Application #:
11682666
Filing Dt:
03/06/2007
Title:
STACKABLE SEMICONDUCTOR PACKAGE HAVING PARTIALLY EXPOSED SEMICONDUCTOR DIE AND METHOD OF FABRICATING THE SAME
97
Patent #:
7473584
Issue Dt:
01/06/2009
Application #:
11685072
Filing Dt:
03/12/2007
Title:
METHOD FOR FABRICATING A FAN-IN LEADFRAME SEMICONDUCTOR PACKAGE
98
Patent #:
7332712
Issue Dt:
02/19/2008
Application #:
11706726
Filing Dt:
02/14/2007
Publication #:
US20070152147
Pub Dt:
07/05/2007
Title:
CAMERA MODULE FABRICATION METHOD INCLUDING THE STEP OF REMOVING A LENS MOUNT AND WINDOW FROM THE MOLD
99
Patent #:
7808105
Issue Dt:
10/05/2010
Application #:
11734999
Filing Dt:
04/13/2007
Title:
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
100
Patent #:
7898066
Issue Dt:
03/01/2011
Application #:
11754209
Filing Dt:
05/25/2007
Title:
A SEMICONDUCTOR DEVICE HAVING EMI SHIELDING AND METHOD THEREFOR
Assignor
1
AMKOR TECHNOLOGY, INC.
Exec Dt:
07/13/2018
Assignee
1
BANK OF AMERICA, N.A., AS AGENT
333 SOUTH HOPE STREET
19TH FLOOR
LOS ANGELES, CALIFORNIA 90071
Correspondence name and address
MCGUIREWOODS LLP
1750 TYSONS BOULEVARD
SUITE 1800
TYSONS, VA 22102

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