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Reel/Frame:046683/0139   Pages: 67
Recorded: 08/01/2018
Attorney Dkt #:2068279-5062
Conveyance: SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1156
Page 7 of 12
Pages: 1 2 3 4 5 6 7 8 9 10 11 12
1
Patent #:
7550849
Issue Dt:
06/23/2009
Application #:
11765648
Filing Dt:
06/20/2007
Publication #:
US20070241460
Pub Dt:
10/18/2007
Title:
CONDUCTIVE STRUCTURES INCLUDING TITANIUM-TUNGSTEN BASE LAYERS
2
Patent #:
7923645
Issue Dt:
04/12/2011
Application #:
11765806
Filing Dt:
06/20/2007
Title:
METAL ETCH STOP FABRICATION METHOD AND STRUCTURE
3
Patent #:
7951697
Issue Dt:
05/31/2011
Application #:
11765828
Filing Dt:
06/20/2007
Title:
EMBEDDED DIE METAL ETCH STOP FABRICATION METHOD AND STRUCTURE
4
Patent #:
7745910
Issue Dt:
06/29/2010
Application #:
11775492
Filing Dt:
07/10/2007
Title:
SEMICONDUCTOR DEVICE HAVING RF SHIELDING AND METHOD THEREFOR
5
Patent #:
7977774
Issue Dt:
07/12/2011
Application #:
11775566
Filing Dt:
07/10/2007
Publication #:
US20090014851
Pub Dt:
01/15/2009
Title:
FUSION QUAD FLAT SEMICONDUCTOR PACKAGE
6
Patent #:
7420272
Issue Dt:
09/02/2008
Application #:
11784979
Filing Dt:
04/09/2007
Title:
TWO-SIDED WAFER ESCAPE PACKAGE
7
Patent #:
7723210
Issue Dt:
05/25/2010
Application #:
11810799
Filing Dt:
06/06/2007
Publication #:
US20070241446
Pub Dt:
10/18/2007
Title:
DIRECT-WRITE WAFER LEVEL CHIP SCALE PACKAGE
8
Patent #:
7847398
Issue Dt:
12/07/2010
Application #:
11832571
Filing Dt:
08/01/2007
Publication #:
US20090032947
Pub Dt:
02/05/2009
Title:
SEMICONDUCTOR DEVICE HAVING A STACKED BUMP TO REDUCE KIRKENDALL VOIDS AND OR CRACKS AND METHOD OF MANUFACTURING
9
Patent #:
7687899
Issue Dt:
03/30/2010
Application #:
11835235
Filing Dt:
08/07/2007
Title:
DUAL LAMINATE PACKAGE STRUCTURE WITH EMBEDDED ELEMENTS
10
Patent #:
8323771
Issue Dt:
12/04/2012
Application #:
11839277
Filing Dt:
08/15/2007
Title:
STRAIGHT CONDUCTOR BLIND VIA CAPTURE PAD STRUCTURE AND FABRICATION METHOD
11
Patent #:
7777351
Issue Dt:
08/17/2010
Application #:
11865617
Filing Dt:
10/01/2007
Title:
THIN STACKED INTERPOSER PACKAGE
12
Patent #:
8089159
Issue Dt:
01/03/2012
Application #:
11866886
Filing Dt:
10/03/2007
Title:
SEMICONDUCTOR PACKAGE WITH INCREASED I/O DENSITY AND METHOD OF MAKING THE SAME
13
Patent #:
7632753
Issue Dt:
12/15/2009
Application #:
11867293
Filing Dt:
10/04/2007
Title:
WAFER LEVEL PACKAGE UTILIZING LASER-ACTIVATED DIELECTRIC MATERIAL
14
Patent #:
7879715
Issue Dt:
02/01/2011
Application #:
11868785
Filing Dt:
10/08/2007
Publication #:
US20080026560
Pub Dt:
01/31/2008
Title:
METHODS OF FORMING ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE SHUNT LAYERS AND RELATED STRUCTURES
15
Patent #:
8198738
Issue Dt:
06/12/2012
Application #:
11873229
Filing Dt:
10/16/2007
Title:
STRUCTURE OF BOND PAD FOR SEMICONDUCTOR DIE AND METHOD THEREFOR
16
Patent #:
7718523
Issue Dt:
05/18/2010
Application #:
11875597
Filing Dt:
10/19/2007
Title:
SOLDER ATTACH FILM AND METHOD OF FORMING SOLDER BALL USING THE SAME
17
Patent #:
7670962
Issue Dt:
03/02/2010
Application #:
11903002
Filing Dt:
09/19/2007
Publication #:
US20080020132
Pub Dt:
01/24/2008
Title:
SUBSTRATE HAVING STIFFENER FABRICATION METHOD
18
Patent #:
7958626
Issue Dt:
06/14/2011
Application #:
11924156
Filing Dt:
10/25/2007
Title:
EMBEDDED PASSIVE COMPONENT NETWORK SUBSTRATE FABRICATION METHOD
19
Patent #:
7919853
Issue Dt:
04/05/2011
Application #:
11933908
Filing Dt:
11/01/2007
Title:
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
20
Patent #:
7847386
Issue Dt:
12/07/2010
Application #:
11935314
Filing Dt:
11/05/2007
Title:
REDUCED SIZE STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
21
Patent #:
8017436
Issue Dt:
09/13/2011
Application #:
11953680
Filing Dt:
12/10/2007
Title:
THIN SUBSTRATE FABRICATION METHOD AND STRUCTURE
22
Patent #:
7560804
Issue Dt:
07/14/2009
Application #:
11970712
Filing Dt:
01/08/2008
Title:
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING THE SAME
23
Patent #:
8299610
Issue Dt:
10/30/2012
Application #:
11971577
Filing Dt:
01/09/2008
Title:
SEMICONDUCTOR DEVICE HAVING RF SHIELDING AND METHOD THEREFOR
24
Patent #:
8322030
Issue Dt:
12/04/2012
Application #:
11982637
Filing Dt:
11/01/2007
Title:
CIRCUIT-ON-FOIL PROCESS FOR MANUFACTURING A LAMINATED SEMICONDUCTOR PACKAGE SUBSTRATE HAVING EMBEDDED CONDUCTIVE PATTERNS
25
Patent #:
7956453
Issue Dt:
06/07/2011
Application #:
12015428
Filing Dt:
01/16/2008
Title:
SEMICONDUCTOR PACKAGE WITH PATTERNING LAYER AND METHOD OF MAKING SAME
26
Patent #:
7723852
Issue Dt:
05/25/2010
Application #:
12017266
Filing Dt:
01/21/2008
Title:
STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME
27
Patent #:
7832097
Issue Dt:
11/16/2010
Application #:
12018435
Filing Dt:
01/23/2008
Title:
SHIELDED TRACE STRUCTURE AND FABRICATION METHOD
28
Patent #:
7982316
Issue Dt:
07/19/2011
Application #:
12025336
Filing Dt:
02/04/2008
Title:
SEMICONDUCTOR PACKAGE HAVING A LAND TO ABSORB THERMAL AND MECHANICAL STRESS AND FABRICATING METHOD THEREOF
29
Patent #:
8193624
Issue Dt:
06/05/2012
Application #:
12036498
Filing Dt:
02/25/2008
Title:
SEMICONDUCTOR DEVICE HAVING IMPROVED CONTACT INTERFACE RELIABILITY AND METHOD THEREFOR
30
Patent #:
8067821
Issue Dt:
11/29/2011
Application #:
12100886
Filing Dt:
04/10/2008
Title:
FLAT SEMICONDUCTOR PACKAGE WITH HALF PACKAGE MOLDING
31
Patent #:
7768135
Issue Dt:
08/03/2010
Application #:
12105196
Filing Dt:
04/17/2008
Title:
SEMICONDUCTOR PACKAGE WITH FAST POWER-UP CYCLE AND METHOD OF MAKING SAME
32
Patent #:
8008753
Issue Dt:
08/30/2011
Application #:
12107478
Filing Dt:
04/22/2008
Title:
SYSTEM AND METHOD TO REDUCE SHORTING OF RADIO FREQUENCY (RF) SHIELDING
33
Patent #:
7906845
Issue Dt:
03/15/2011
Application #:
12108419
Filing Dt:
04/23/2008
Title:
SEMICONDUCTOR DEVICE HAVING REDUCED THERMAL INTERFACE MATERIAL (TIM) DEGRADATION AND METHOD THEREFOR
34
Patent #:
7994043
Issue Dt:
08/09/2011
Application #:
12108909
Filing Dt:
04/24/2008
Title:
LEAD FREE ALLOY BUMP STRUCTURE AND FABRICATION METHOD
35
Patent #:
7808084
Issue Dt:
10/05/2010
Application #:
12116127
Filing Dt:
05/06/2008
Title:
SEMICONDUCTOR PACKAGE WITH HALF-ETCHED LOCKING FEATURES
36
Patent #:
8058726
Issue Dt:
11/15/2011
Application #:
12116695
Filing Dt:
05/07/2008
Title:
SEMICONDUCTOR DEVICE HAVING REDISTRIBUTION LAYER
37
Patent #:
7932170
Issue Dt:
04/26/2011
Application #:
12144145
Filing Dt:
06/23/2008
Title:
FLIP CHIP BUMP STRUCTURE AND FABRICATION METHOD
38
Patent #:
8316536
Issue Dt:
11/27/2012
Application #:
12151857
Filing Dt:
05/09/2008
Title:
MULTI-LEVEL CIRCUIT SUBSTRATE FABRICATION METHOD
39
Patent #:
7944043
Issue Dt:
05/17/2011
Application #:
12169151
Filing Dt:
07/08/2008
Title:
SEMICONDUCTOR DEVICE HAVING IMPROVED CONTACT INTERFACE RELIABILITY AND METHOD THEREFOR
40
Patent #:
8125064
Issue Dt:
02/28/2012
Application #:
12181256
Filing Dt:
07/28/2008
Title:
INCREASED I/O SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME
41
Patent #:
8836115
Issue Dt:
09/16/2014
Application #:
12183778
Filing Dt:
07/31/2008
Title:
STACKED INVERTED FLIP CHIP PACKAGE AND FABRICATION METHOD
42
Patent #:
8184453
Issue Dt:
05/22/2012
Application #:
12183979
Filing Dt:
07/31/2008
Title:
INCREASED CAPACITY SEMICONDUCTOR PACKAGE
43
Patent #:
7691745
Issue Dt:
04/06/2010
Application #:
12187578
Filing Dt:
08/07/2008
Title:
LAND PATTERNS FOR A SEMICONDUCTOR STACKING STRUCTURE AND METHOD THEREFOR
44
Patent #:
7843072
Issue Dt:
11/30/2010
Application #:
12190039
Filing Dt:
08/12/2008
Title:
SEMICONDUCTOR PACKAGE HAVING THROUGH HOLES
45
Patent #:
7834454
Issue Dt:
11/16/2010
Application #:
12194999
Filing Dt:
08/20/2008
Publication #:
US20080308931
Pub Dt:
12/18/2008
Title:
ELECTRONIC STRUCTURES INCLUDING BARRIER LAYERS DEFINING LIPS
46
Patent #:
8334590
Issue Dt:
12/18/2012
Application #:
12204692
Filing Dt:
09/04/2008
Title:
SEMICONDUCTOR DEVICE HAVING INSULATING AND INTERCONNECTION LAYERS
47
Patent #:
7692286
Issue Dt:
04/06/2010
Application #:
12221797
Filing Dt:
08/05/2008
Title:
TWO-SIDED FAN-OUT WAFER ESCAPE PACKAGE
48
Patent #:
7786429
Issue Dt:
08/31/2010
Application #:
12221948
Filing Dt:
08/08/2008
Publication #:
US20080308717
Pub Dt:
12/18/2008
Title:
CAMERA MODULE WITH WINDOW MECHANICAL ATTACHMENT
49
Patent #:
7842541
Issue Dt:
11/30/2010
Application #:
12237173
Filing Dt:
09/24/2008
Title:
ULTRA THIN PACKAGE AND FABRICATION METHOD
50
Patent #:
7847392
Issue Dt:
12/07/2010
Application #:
12242603
Filing Dt:
09/30/2008
Title:
SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH INCREASED I/O
51
Patent #:
7989933
Issue Dt:
08/02/2011
Application #:
12246226
Filing Dt:
10/06/2008
Title:
INCREASED I/O LEADFRAME AND SEMICONDUCTOR DEVICE INCLUDING SAME
52
Patent #:
8008758
Issue Dt:
08/30/2011
Application #:
12259096
Filing Dt:
10/27/2008
Title:
SEMICONDUCTOR DEVICE WITH INCREASED I/O LEADFRAME
53
Patent #:
8022521
Issue Dt:
09/20/2011
Application #:
12269357
Filing Dt:
11/12/2008
Title:
PACKAGE FAILURE PROGNOSTIC STRUCTURE AND METHOD
54
Patent #:
7843052
Issue Dt:
11/30/2010
Application #:
12270690
Filing Dt:
11/13/2008
Title:
SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF
55
Patent #:
8089145
Issue Dt:
01/03/2012
Application #:
12272606
Filing Dt:
11/17/2008
Title:
SEMICONDUCTOR DEVICE INCLUDING INCREASED CAPACITY LEADFRAME
56
Patent #:
8072050
Issue Dt:
12/06/2011
Application #:
12273500
Filing Dt:
11/18/2008
Title:
SEMICONDUCTOR DEVICE WITH INCREASED I/O LEADFRAME INCLUDING PASSIVE DEVICE
57
Patent #:
7875963
Issue Dt:
01/25/2011
Application #:
12276121
Filing Dt:
11/21/2008
Title:
SEMICONDUCTOR DEVICE INCLUDING LEADFRAME HAVING POWER BARS AND INCREASED I/O
58
Patent #:
7737542
Issue Dt:
06/15/2010
Application #:
12291119
Filing Dt:
11/05/2008
Title:
STACKABLE SEMICONDUCTOR PACKAGE
59
Patent #:
7859119
Issue Dt:
12/28/2010
Application #:
12291767
Filing Dt:
11/12/2008
Title:
STACKED FLIP CHIP DIE ASSEMBLY
60
Patent #:
7863723
Issue Dt:
01/04/2011
Application #:
12317649
Filing Dt:
12/23/2008
Publication #:
US20090134507
Pub Dt:
05/28/2009
Title:
ADHESIVE ON WIRE STACKED SEMICONDUCTOR PACKAGE
61
Patent #:
7915715
Issue Dt:
03/29/2011
Application #:
12323124
Filing Dt:
11/25/2008
Publication #:
US20100127376
Pub Dt:
05/27/2010
Title:
SYSTEM AND METHOD TO PROVIDE RF SHIELDING FOR A MEMS MICROPHONE PACKAGE
62
Patent #:
8129824
Issue Dt:
03/06/2012
Application #:
12327716
Filing Dt:
12/03/2008
Title:
SHIELDING FOR A SEMICONDUCTOR PACKAGE
63
Patent #:
7982298
Issue Dt:
07/19/2011
Application #:
12327763
Filing Dt:
12/03/2008
Title:
PACKAGE IN PACKAGE SEMICONDUCTOR DEVICE
64
Patent #:
8487420
Issue Dt:
07/16/2013
Application #:
12330424
Filing Dt:
12/08/2008
Title:
PACKAGE IN PACKAGE SEMICONDUCTOR DEVICE WITH FILM OVER WIRE
65
Patent #:
8102032
Issue Dt:
01/24/2012
Application #:
12330769
Filing Dt:
12/09/2008
Title:
SYSTEM AND METHOD FOR COMPARTMENTAL SHIELDING OF STACKED PACKAGES
66
Patent #:
8012868
Issue Dt:
09/06/2011
Application #:
12335365
Filing Dt:
12/15/2008
Title:
SEMICONDUCTOR DEVICE HAVING EMI SHIELDING AND METHOD THEREFOR
67
Patent #:
8018072
Issue Dt:
09/13/2011
Application #:
12342386
Filing Dt:
12/23/2008
Title:
SEMICONDUCTOR PACKAGE HAVING A HEAT SPREADER WITH AN EXPOSED EXTERIOR SURFACE AND A TOP MOLD GATE
68
Patent #:
7851894
Issue Dt:
12/14/2010
Application #:
12342829
Filing Dt:
12/23/2008
Title:
SYSTEM AND METHOD FOR SHIELDING OF PACKAGE ON PACKAGE (POP) ASSEMBLIES
69
Patent #:
8176628
Issue Dt:
05/15/2012
Application #:
12342839
Filing Dt:
12/23/2008
Title:
PROTRUDING POST SUBSTRATE PACKAGE STRUCTURE AND METHOD
70
Patent #:
7936033
Issue Dt:
05/03/2011
Application #:
12345421
Filing Dt:
12/29/2008
Publication #:
US20100164081
Pub Dt:
07/01/2010
Title:
MICRO-OPTICAL DEVICE PACKAGING SYSTEM
71
Patent #:
8680656
Issue Dt:
03/25/2014
Application #:
12348853
Filing Dt:
01/05/2009
Title:
LEADFRAME STRUCTURE FOR CONCENTRATED PHOTOVOLTAIC RECEIVER PACKAGE
72
Patent #:
8872329
Issue Dt:
10/28/2014
Application #:
12351596
Filing Dt:
01/09/2009
Title:
EXTENDED LANDING PAD SUBSTRATE PACKAGE STRUCTURE AND METHOD
73
Patent #:
8058715
Issue Dt:
11/15/2011
Application #:
12351690
Filing Dt:
01/09/2009
Title:
PACKAGE IN PACKAGE DEVICE FOR RF TRANSCEIVER MODULE
74
Patent #:
7732899
Issue Dt:
06/08/2010
Application #:
12365682
Filing Dt:
02/04/2009
Title:
ETCH SINGULATED SEMICONDUCTOR PACKAGE
75
Patent #:
7825520
Issue Dt:
11/02/2010
Application #:
12387672
Filing Dt:
05/05/2009
Title:
STACKED REDISTRIBUTION LAYER (RDL) DIE ASSEMBLY PACKAGE
76
Patent #:
8341835
Issue Dt:
01/01/2013
Application #:
12387691
Filing Dt:
05/05/2009
Title:
BUILDUP DIELECTRIC LAYER HAVING METALLIZATION PATTERN SEMICONDUCTOR PACKAGE FABRICATION METHOD
77
Patent #:
8026589
Issue Dt:
09/27/2011
Application #:
12390999
Filing Dt:
02/23/2009
Title:
REDUCED PROFILE STACKABLE SEMICONDUCTOR PACKAGE
78
Patent #:
7872341
Issue Dt:
01/18/2011
Application #:
12396772
Filing Dt:
03/03/2009
Title:
SEMICONDUCTOR DEVICE
79
Patent #:
8030722
Issue Dt:
10/04/2011
Application #:
12397470
Filing Dt:
03/04/2009
Title:
REVERSIBLE TOP/BOTTOM MEMS PACKAGE
80
Patent #:
7960818
Issue Dt:
06/14/2011
Application #:
12398089
Filing Dt:
03/04/2009
Title:
CONFORMAL SHIELD ON PUNCH QFN SEMICONDUCTOR PACKAGE
81
Patent #:
7928542
Issue Dt:
04/19/2011
Application #:
12399600
Filing Dt:
03/06/2009
Publication #:
US20090166842
Pub Dt:
07/02/2009
Title:
LEADFRAME FOR SEMICONDUCTOR PACKAGE
82
Patent #:
8004078
Issue Dt:
08/23/2011
Application #:
12405854
Filing Dt:
03/17/2009
Title:
ADHESIVE COMPOSITION FOR SEMICONDUCTOR DEVICE
83
Patent #:
8536458
Issue Dt:
09/17/2013
Application #:
12414220
Filing Dt:
03/30/2009
Title:
FINE PITCH COPPER PILLAR PACKAGE AND METHOD
84
Patent #:
8575742
Issue Dt:
11/05/2013
Application #:
12419180
Filing Dt:
04/06/2009
Title:
SEMICONDUCTOR DEVICE WITH INCREASED I/O LEADFRAME INCLUDING POWER BARS
85
Patent #:
7960827
Issue Dt:
06/14/2011
Application #:
12421118
Filing Dt:
04/09/2009
Title:
THERMAL VIA HEAT SPREADER PACKAGE AND METHOD
86
Patent #:
7938308
Issue Dt:
05/10/2011
Application #:
12429448
Filing Dt:
04/24/2009
Title:
WIRE BONDER FOR IMPROVED BONDABILITY OF A CONDUCTIVE WIRE AND METHOD THEREFOR
87
Patent #:
7839000
Issue Dt:
11/23/2010
Application #:
12437632
Filing Dt:
05/08/2009
Publication #:
US20090212427
Pub Dt:
08/27/2009
Title:
SOLDER STRUCTURES INCLUDING BARRIER LAYERS WITH NICKEL AND/OR COPPER
88
Patent #:
7977163
Issue Dt:
07/12/2011
Application #:
12459532
Filing Dt:
07/02/2009
Title:
EMBEDDED ELECTRONIC COMPONENT PACKAGE FABRICATION METHOD
89
Patent #:
7911017
Issue Dt:
03/22/2011
Application #:
12459536
Filing Dt:
07/02/2009
Title:
DIRECT GLASS ATTACHED ON DIE OPTICAL MODULE
90
Patent #:
7911037
Issue Dt:
03/22/2011
Application #:
12462665
Filing Dt:
08/05/2009
Title:
METHOD AND STRUCTURE FOR CREATING EMBEDDED METAL FEATURES
91
Patent #:
8623753
Issue Dt:
01/07/2014
Application #:
12474009
Filing Dt:
05/28/2009
Title:
STACKABLE PROTRUDING VIA PACKAGE AND METHOD
92
Patent #:
8866004
Issue Dt:
10/21/2014
Application #:
12481512
Filing Dt:
06/09/2009
Title:
FRAME INTERCONNECT FOR CONCENTRATED PHOTOVOLTAIC MODULE
93
Patent #:
7839136
Issue Dt:
11/23/2010
Application #:
12481525
Filing Dt:
06/09/2009
Title:
SYSTEM AND METHOD FOR TESTING RADIO FREQUENCY (RF) SHIELDING DEFECTS
94
Patent #:
8222538
Issue Dt:
07/17/2012
Application #:
12483913
Filing Dt:
06/12/2009
Title:
STACKABLE VIA PACKAGE AND METHOD
95
Patent #:
8093691
Issue Dt:
01/10/2012
Application #:
12502409
Filing Dt:
07/14/2009
Title:
SYSTEM AND METHOD FOR RF SHIELDING OF A SEMICONDUCTOR PACKAGE
96
Patent #:
8115283
Issue Dt:
02/14/2012
Application #:
12502627
Filing Dt:
07/14/2009
Title:
REVERSIBLE TOP/BOTTOM MEMS PACKAGE
97
Patent #:
8183678
Issue Dt:
05/22/2012
Application #:
12535316
Filing Dt:
08/04/2009
Publication #:
US20110031598
Pub Dt:
02/10/2011
Title:
SEMICONDUCTOR DEVICE HAVING AN INTERPOSER
98
Patent #:
8471154
Issue Dt:
06/25/2013
Application #:
12537048
Filing Dt:
08/06/2009
Title:
STACKABLE VARIABLE HEIGHT VIA PACKAGE AND METHOD
99
Patent #:
8089148
Issue Dt:
01/03/2012
Application #:
12539116
Filing Dt:
08/11/2009
Title:
CIRCUIT BOARD AND SEMICONDUCTOR DEVICE HAVING THE SAME
100
Patent #:
8441123
Issue Dt:
05/14/2013
Application #:
12540593
Filing Dt:
08/13/2009
Title:
SEMICONDUCTOR DEVICE WITH METAL DAM AND FABRICATING METHOD
Assignor
1
AMKOR TECHNOLOGY, INC.
Exec Dt:
07/13/2018
Assignee
1
BANK OF AMERICA, N.A., AS AGENT
333 SOUTH HOPE STREET
19TH FLOOR
LOS ANGELES, CALIFORNIA 90071
Correspondence name and address
MCGUIREWOODS LLP
1750 TYSONS BOULEVARD
SUITE 1800
TYSONS, VA 22102

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