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Reel/Frame:046683/0139   Pages: 67
Recorded: 08/01/2018
Attorney Dkt #:2068279-5062
Conveyance: SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1156
Page 8 of 12
Pages: 1 2 3 4 5 6 7 8 9 10 11 12
1
Patent #:
8362598
Issue Dt:
01/29/2013
Application #:
12548354
Filing Dt:
08/26/2009
Publication #:
US20110049685
Pub Dt:
03/03/2011
Title:
SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
2
Patent #:
8183683
Issue Dt:
05/22/2012
Application #:
12549068
Filing Dt:
08/27/2009
Title:
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
3
Patent #:
7977783
Issue Dt:
07/12/2011
Application #:
12549083
Filing Dt:
08/27/2009
Title:
WAFER LEVEL CHIP SIZE PACKAGE HAVING REDISTRIBUTION LAYERS
4
Patent #:
7994045
Issue Dt:
08/09/2011
Application #:
12555449
Filing Dt:
09/08/2009
Title:
BUMPED CHIP PACKAGE FABRICATION METHOD AND STRUCTURE
5
Patent #:
8446017
Issue Dt:
05/21/2013
Application #:
12562387
Filing Dt:
09/18/2009
Publication #:
US20110068427
Pub Dt:
03/24/2011
Title:
STACKABLE WAFER LEVEL PACKAGE AND FABRICATING METHOD THEREOF
6
Patent #:
8551820
Issue Dt:
10/08/2013
Application #:
12568041
Filing Dt:
09/28/2009
Title:
ROUTABLE SINGLE LAYER SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING SAME
7
Patent #:
8432022
Issue Dt:
04/30/2013
Application #:
12569300
Filing Dt:
09/29/2009
Title:
SHIELDED EMBEDDED ELECTRONIC COMPONENT SUBSTRATE FABRICATION METHOD AND STRUCTURE
8
Patent #:
8796561
Issue Dt:
08/05/2014
Application #:
12573466
Filing Dt:
10/05/2009
Title:
FAN OUT BUILD UP SUBSTRATE STACKABLE PACKAGE AND METHOD
9
Patent #:
8841547
Issue Dt:
09/23/2014
Application #:
12577064
Filing Dt:
10/09/2009
Title:
CONCENTRATED PHOTOVOLTAIC RECEIVER PACKAGE WITH BUILT-IN CONNECTOR
10
Patent #:
8362597
Issue Dt:
01/29/2013
Application #:
12589500
Filing Dt:
10/23/2009
Title:
SHIELDED PACKAGE HAVING SHIELD LID
11
Patent #:
8018068
Issue Dt:
09/13/2011
Application #:
12589839
Filing Dt:
10/28/2009
Title:
SEMICONDUCTOR PACKAGE INCLUDING A TOP-SURFACE METAL LAYER FOR IMPLEMENTING CIRCUIT FEATURES
12
Patent #:
8129849
Issue Dt:
03/06/2012
Application #:
12589868
Filing Dt:
10/28/2009
Title:
METHOD OF MAKING SEMICONDUCTOR PACKAGE WITH ADHERING PORTION
13
Patent #:
8866002
Issue Dt:
10/21/2014
Application #:
12626512
Filing Dt:
11/25/2009
Title:
THROUGH WAFER VIA STRUCTURES FOR CONCENTRATED PHOTOVOLTAIC CELLS
14
Patent #:
8365611
Issue Dt:
02/05/2013
Application #:
12627484
Filing Dt:
11/30/2009
Title:
BEND TEST METHOD AND APPARATUS FOR FLIP CHIP DEVICES
15
Patent #:
8937381
Issue Dt:
01/20/2015
Application #:
12630586
Filing Dt:
12/03/2009
Title:
THIN STACKABLE PACKAGE AND METHOD
16
Patent #:
9691734
Issue Dt:
06/27/2017
Application #:
12632170
Filing Dt:
12/07/2009
Title:
METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES
17
Patent #:
8110909
Issue Dt:
02/07/2012
Application #:
12655724
Filing Dt:
01/05/2010
Title:
SEMICONDUCTOR PACKAGE INCLUDING TOP-SURFACE TERMINALS FOR MOUNTING ANOTHER SEMICONDUCTOR PACKAGE
18
Patent #:
8072083
Issue Dt:
12/06/2011
Application #:
12657425
Filing Dt:
01/20/2010
Title:
STACKED ELECTRONIC COMPONENT PACKAGE HAVING FILM-ON-WIRE SPACER
19
Patent #:
8188584
Issue Dt:
05/29/2012
Application #:
12661597
Filing Dt:
03/19/2010
Title:
DIRECT-WRITE WAFER LEVEL CHIP SCALE PACKAGE
20
Patent #:
7932595
Issue Dt:
04/26/2011
Application #:
12661604
Filing Dt:
03/19/2010
Title:
ELECTRONIC COMPONENT PACKAGE COMPRISING FAN-OUT TRACES
21
Patent #:
9230883
Issue Dt:
01/05/2016
Application #:
12690741
Filing Dt:
01/20/2010
Title:
TRACE STACKING STRUCTURE AND METHOD
22
Patent #:
8536462
Issue Dt:
09/17/2013
Application #:
12692397
Filing Dt:
01/22/2010
Title:
FLEX CIRCUIT PACKAGE AND METHOD
23
Patent #:
8217507
Issue Dt:
07/10/2012
Application #:
12692522
Filing Dt:
01/22/2010
Title:
EDGE MOUNT SEMICONDUCTOR PACKAGE
24
Patent #:
8089141
Issue Dt:
01/03/2012
Application #:
12693372
Filing Dt:
01/25/2010
Title:
SEMICONDUCTOR PACKAGE HAVING LEADFRAME WITH EXPOSED ANCHOR PADS
25
Patent #:
7872343
Issue Dt:
01/18/2011
Application #:
12699739
Filing Dt:
02/03/2010
Title:
DUAL LAMINATE PACKAGE STRUCTURE WITH EMBEDDED ELEMENTS
26
Patent #:
7999371
Issue Dt:
08/16/2011
Application #:
12702505
Filing Dt:
02/09/2010
Title:
HEAT SPREADER PACKAGE AND METHOD
27
Patent #:
8199518
Issue Dt:
06/12/2012
Application #:
12708033
Filing Dt:
02/18/2010
Title:
TOP FEATURE PACKAGE AND METHOD
28
Patent #:
8237460
Issue Dt:
08/07/2012
Application #:
12708385
Filing Dt:
02/18/2010
Title:
POGO PIN INSERTING DEVICE FOR TESTING SEMICONDUCTOR DEVICES AND METHOD THEREFOR
29
Patent #:
8604625
Issue Dt:
12/10/2013
Application #:
12708432
Filing Dt:
02/18/2010
Title:
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE PADS TO PREVENT SOLDER REFLOW
30
Patent #:
8618658
Issue Dt:
12/31/2013
Application #:
12727608
Filing Dt:
03/19/2010
Title:
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
31
Patent #:
8362612
Issue Dt:
01/29/2013
Application #:
12728119
Filing Dt:
03/19/2010
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
32
Patent #:
8564114
Issue Dt:
10/22/2013
Application #:
12730062
Filing Dt:
03/23/2010
Title:
SEMICONDUCTOR PACKAGE THERMAL TAPE WINDOW FRAME FOR HEAT SINK ATTACHMENT
33
Patent #:
8294265
Issue Dt:
10/23/2012
Application #:
12751842
Filing Dt:
03/31/2010
Title:
SEMICONDUCTOR DEVICE FOR IMPROVING ELECTRICAL AND MECHANICAL CONNECTIVITY OF CONDUCTIVE PILLERS AND METHOD THEREFOR
34
Patent #:
8324511
Issue Dt:
12/04/2012
Application #:
12754837
Filing Dt:
04/06/2010
Title:
THROUGH VIA NUB REVEAL METHOD AND STRUCTURE
35
Patent #:
7906855
Issue Dt:
03/15/2011
Application #:
12758583
Filing Dt:
04/12/2010
Title:
STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME
36
Patent #:
8946886
Issue Dt:
02/03/2015
Application #:
12779784
Filing Dt:
05/13/2010
Title:
SHIELDED ELECTRONIC COMPONENT PACKAGE AND METHOD
37
Patent #:
8300423
Issue Dt:
10/30/2012
Application #:
12787238
Filing Dt:
05/25/2010
Title:
STACKABLE TREATED VIA PACKAGE AND METHOD
38
Patent #:
8294276
Issue Dt:
10/23/2012
Application #:
12788845
Filing Dt:
05/27/2010
Title:
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
39
Patent #:
8354747
Issue Dt:
01/15/2013
Application #:
12791472
Filing Dt:
06/01/2010
Title:
CONDUCTIVE POLYMER LID FOR A SENSOR PACKAGE AND METHOD THEREFOR
40
Patent #:
7859107
Issue Dt:
12/28/2010
Application #:
12798412
Filing Dt:
04/02/2010
Title:
SOLDER ATTACH FILM AND ASSEMBLY
41
Patent #:
7982306
Issue Dt:
07/19/2011
Application #:
12799751
Filing Dt:
04/30/2010
Title:
STACKABLE SEMICONDUCTOR PACKAGE
42
Patent #:
8671565
Issue Dt:
03/18/2014
Application #:
12800757
Filing Dt:
05/21/2010
Title:
BLIND VIA CAPTURE PAD STRUCTURE FABRICATION METHOD
43
Patent #:
8026587
Issue Dt:
09/27/2011
Application #:
12802661
Filing Dt:
06/10/2010
Title:
SEMICONDUCTOR PACKAGE INCLUDING TOP-SURFACE TERMINALS FOR MOUNTING ANOTHER SEMICONDUCTOR PACKAGE
44
Patent #:
9362437
Issue Dt:
06/07/2016
Application #:
12815260
Filing Dt:
06/14/2010
Title:
CONCENTRATED PHOTOVOLTAIC RECEIVER MODULE WITH IMPROVED OPTICAL LIGHT GUIDE ASSEMBLY
45
Patent #:
8508023
Issue Dt:
08/13/2013
Application #:
12817923
Filing Dt:
06/17/2010
Title:
SYSTEM AND METHOD FOR LOWERING CONTACT RESISTANCE OF THE RADIO FREQUENCY (RF) SHIELD TO GROUND
46
Patent #:
8084868
Issue Dt:
12/27/2011
Application #:
12818446
Filing Dt:
06/18/2010
Title:
SEMICONDUCTOR PACKAGE WITH FAST POWER-UP CYCLE AND METHOD OF MAKING SAME
47
Patent #:
8809677
Issue Dt:
08/19/2014
Application #:
12830138
Filing Dt:
07/02/2010
Title:
MOLDED LIGHT GUIDE FOR CONCENTRATED PHOTOVOLTAIC RECEIVER MODULE
48
Patent #:
8319338
Issue Dt:
11/27/2012
Application #:
12832202
Filing Dt:
07/08/2010
Title:
THIN STACKED INTERPOSER PACKAGE
49
Patent #:
9420378
Issue Dt:
08/16/2016
Application #:
12834682
Filing Dt:
07/12/2010
Title:
TOP PORT MEMS MICROPHONE PACKAGE AND METHOD
50
Patent #:
8338229
Issue Dt:
12/25/2012
Application #:
12846973
Filing Dt:
07/30/2010
Title:
STACKABLE PLASMA CLEANED VIA PACKAGE AND METHOD
51
Patent #:
8440554
Issue Dt:
05/14/2013
Application #:
12848820
Filing Dt:
08/02/2010
Title:
THROUGH VIA CONNECTED BACKSIDE EMBEDDED CIRCUIT FEATURES STRUCTURE AND METHOD
52
Patent #:
8717775
Issue Dt:
05/06/2014
Application #:
12848833
Filing Dt:
08/02/2010
Title:
FINGERPRINT SENSOR PACKAGE AND METHOD
53
Patent #:
8552517
Issue Dt:
10/08/2013
Application #:
12881905
Filing Dt:
09/14/2010
Title:
CONDUCTIVE PASTE AND MOLD FOR ELECTRICAL CONNECTION OF PHOTOVOLTAIC DIE TO SUBSTRATE
54
Patent #:
8487445
Issue Dt:
07/16/2013
Application #:
12898192
Filing Dt:
10/05/2010
Title:
SEMICONDUCTOR DEVICE HAVING THROUGH ELECTRODES PROTRUDING FROM DIELECTRIC LAYER
55
Patent #:
8487432
Issue Dt:
07/16/2013
Application #:
12907430
Filing Dt:
10/19/2010
Publication #:
US20110037171
Pub Dt:
02/17/2011
Title:
ELECTRONIC STRUCTURES INCLUDING BARRIER LAYERS AND/OR OXIDATION BARRIERS DEFINING LIPS AND RELATED METHODS
56
Patent #:
8299602
Issue Dt:
10/30/2012
Application #:
12912490
Filing Dt:
10/26/2010
Title:
SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH INCREASED I/O
57
Patent #:
8337657
Issue Dt:
12/25/2012
Application #:
12913325
Filing Dt:
10/27/2010
Title:
MECHANICAL TAPE SEPARATION PACKAGE AND METHOD
58
Patent #:
8969192
Issue Dt:
03/03/2015
Application #:
12913376
Filing Dt:
10/27/2010
Title:
LOW STRESS SUBSTRATE AND FORMATION METHOD
59
Patent #:
8482134
Issue Dt:
07/09/2013
Application #:
12917185
Filing Dt:
11/01/2010
Title:
STACKABLE PACKAGE AND METHOD
60
Patent #:
8203203
Issue Dt:
06/19/2012
Application #:
12924493
Filing Dt:
09/27/2010
Title:
STACKED REDISTRIBUTION LAYER (RDL) DIE ASSEMBLY PACKAGE
61
Patent #:
9060430
Issue Dt:
06/16/2015
Application #:
12924918
Filing Dt:
10/08/2010
Title:
SHIELDED TRACE STRUCTURE AND FABRICATION METHOD
62
Patent #:
8143727
Issue Dt:
03/27/2012
Application #:
12927533
Filing Dt:
11/16/2010
Publication #:
US20110089564
Pub Dt:
04/21/2011
Title:
ADHESIVE ON WIRE STACKED SEMICONDUCTOR PACKAGE
63
Patent #:
8227905
Issue Dt:
07/24/2012
Application #:
12931325
Filing Dt:
01/27/2011
Title:
STACKABLE SEMICONDUCTOR PACKAGE
64
Patent #:
8207022
Issue Dt:
06/26/2012
Application #:
12931326
Filing Dt:
01/27/2011
Title:
EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE METHOD
65
Patent #:
9748154
Issue Dt:
10/05/2005
Application #:
12939588
Filing Dt:
11/28/2005
Title:
WAFER LEVEL FAN OUT SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
66
Patent #:
8525318
Issue Dt:
09/03/2013
Application #:
12943540
Filing Dt:
11/10/2010
Title:
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
67
Patent #:
8604356
Issue Dt:
12/10/2013
Application #:
12945464
Filing Dt:
11/12/2010
Title:
ELECTRONIC ASSEMBLY HAVING INCREASED STANDOFF HEIGHT
68
Patent #:
8878527
Issue Dt:
11/04/2014
Application #:
12955509
Filing Dt:
11/29/2010
Publication #:
US20120133386
Pub Dt:
05/31/2012
Title:
MAGNETIC FIELD SIMULATOR FOR TESTING SINGULATED OR MULTI-SITE STRIP SEMICONDUCTOR DEVICE AND METHOD THEREFOR
69
Patent #:
8791501
Issue Dt:
07/29/2014
Application #:
12959851
Filing Dt:
12/03/2010
Title:
INTEGRATED PASSIVE DEVICE STRUCTURE AND METHOD
70
Patent #:
8557629
Issue Dt:
10/15/2013
Application #:
12959911
Filing Dt:
12/03/2010
Title:
SEMICONDUCTOR DEVICE HAVING OVERLAPPED VIA APERTURES
71
Patent #:
8294269
Issue Dt:
10/23/2012
Application #:
12963005
Filing Dt:
12/08/2010
Publication #:
US20110084392
Pub Dt:
04/14/2011
Title:
ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE LAYERS COMPRISING COPPER AND HAVING A THICKNESS OF AT LEAST 0.5 MICROMETERS
72
Patent #:
8674485
Issue Dt:
03/18/2014
Application #:
12963431
Filing Dt:
12/08/2010
Title:
SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH DOWNSETS
73
Patent #:
8535961
Issue Dt:
09/17/2013
Application #:
12964397
Filing Dt:
12/09/2010
Title:
LIGHT EMITTING DIODE (LED) PACKAGE AND METHOD
74
Patent #:
8283767
Issue Dt:
10/09/2012
Application #:
12964453
Filing Dt:
12/09/2010
Title:
DUAL LAMINATE PACKAGE STRUCTURE WITH EMBEDDED ELEMENTS
75
Patent #:
8502361
Issue Dt:
08/06/2013
Application #:
12964468
Filing Dt:
12/09/2010
Title:
CONCENTRATED PHOTOVOLTAIC RECEIVER PACKAGE WITH STACKED INTERNAL SUPPORT FEATURES
76
Patent #:
8188579
Issue Dt:
05/29/2012
Application #:
12965582
Filing Dt:
12/10/2010
Title:
SEMICONDUCTOR DEVICE INCLUDING LEADFRAME HAVING POWER BARS AND INCREASED I/O
77
Patent #:
8643177
Issue Dt:
02/04/2014
Application #:
12968794
Filing Dt:
12/15/2010
Publication #:
US20110079901
Pub Dt:
04/07/2011
Title:
WAFERS INCLUDING PATTERNED BACK SIDE LAYERS THEREON
78
Patent #:
8390130
Issue Dt:
03/05/2013
Application #:
12985888
Filing Dt:
01/06/2011
Title:
THROUGH VIA RECESSED REVEAL STRUCTURE AND METHOD
79
Patent #:
8318287
Issue Dt:
11/27/2012
Application #:
13009690
Filing Dt:
01/19/2011
Title:
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING THE SAME
80
Patent #:
8648450
Issue Dt:
02/11/2014
Application #:
13015071
Filing Dt:
01/27/2011
Title:
SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH A COMBINATION OF LEADS AND LANDS
81
Patent #:
9159625
Issue Dt:
10/13/2015
Application #:
13015445
Filing Dt:
01/27/2011
Title:
SEMICONDUCTOR DEVICE
82
Patent #:
8618619
Issue Dt:
12/31/2013
Application #:
13016343
Filing Dt:
01/28/2011
Title:
TOP PORT WITH INTERPOSER MEMS MICROPHONE PACKAGE AND METHOD
83
Patent #:
8921955
Issue Dt:
12/30/2014
Application #:
13034517
Filing Dt:
02/24/2011
Title:
SEMICONDUCTOR DEVICE WITH MICRO ELECTROMECHANICAL SYSTEM DIE
84
Patent #:
8102037
Issue Dt:
01/24/2012
Application #:
13036359
Filing Dt:
02/28/2011
Publication #:
US20110140250
Pub Dt:
06/16/2011
Title:
LEADFRAME FOR SEMICONDUCTOR PACKAGE
85
Patent #:
9013011
Issue Dt:
04/21/2015
Application #:
13046071
Filing Dt:
03/11/2011
Title:
STACKED AND STAGGERED DIE MEMS PACKAGE AND METHOD
86
Patent #:
8492893
Issue Dt:
07/23/2013
Application #:
13049647
Filing Dt:
03/16/2011
Title:
SEMICONDUCTOR DEVICE CAPABLE OF PREVENTING DIELECTRIC LAYER FROM CRACKING
87
Patent #:
8119455
Issue Dt:
02/21/2012
Application #:
13065296
Filing Dt:
03/18/2011
Title:
WAFER LEVEL PACKAGE FABRICATION METHOD
88
Patent #:
8390116
Issue Dt:
03/05/2013
Application #:
13065298
Filing Dt:
03/18/2011
Title:
FLIP CHIP BUMP STRUCTURE AND FABRICATION METHOD
89
Patent #:
8383950
Issue Dt:
02/26/2013
Application #:
13066137
Filing Dt:
04/06/2011
Title:
METAL ETCH STOP FABRICATION METHOD AND STRUCTURE
90
Patent #:
8729710
Issue Dt:
05/20/2014
Application #:
13094728
Filing Dt:
04/26/2011
Title:
Semiconductor Package with Patterning layer and Method of Making Same
91
Patent #:
8536663
Issue Dt:
09/17/2013
Application #:
13096359
Filing Dt:
04/28/2011
Title:
METAL MESH LID MEMS PACKAGE AND METHOD
92
Patent #:
8729682
Issue Dt:
05/20/2014
Application #:
13099680
Filing Dt:
05/03/2011
Title:
CONFORMAL SHIELD ON PUNCH QFN SEMICONDUCTOR PACKAGE
93
Patent #:
8445984
Issue Dt:
05/21/2013
Application #:
13100004
Filing Dt:
05/03/2011
Publication #:
US20110204464
Pub Dt:
08/25/2011
Title:
Micro-Optical Device Packaging System
94
Patent #:
8441110
Issue Dt:
05/14/2013
Application #:
13109845
Filing Dt:
05/17/2011
Title:
SIDE LEADED, BOTTOM EXPOSED PAD AND BOTTOM EXPOSED LEAD FUSION QUAD FLAT SEMICONDUCTOR PACKAGE
95
Patent #:
8263486
Issue Dt:
09/11/2012
Application #:
13135070
Filing Dt:
06/23/2011
Title:
BUMPED CHIP PACKAGE FABRICATION METHOD AND STRUCTURE
96
Patent #:
8441120
Issue Dt:
05/14/2013
Application #:
13135091
Filing Dt:
06/23/2011
Title:
HEAT SPREADER PACKAGE
97
Patent #:
8227338
Issue Dt:
07/24/2012
Application #:
13136457
Filing Dt:
08/01/2011
Title:
SEMICONDUCTOR PACKAGE INCLUDING A TOP-SURFACE METAL LAYER FOR IMPLEMENTING CIRCUIT FEATURES
98
Patent #:
8304866
Issue Dt:
11/06/2012
Application #:
13151571
Filing Dt:
06/02/2011
Title:
FUSION QUAD FLAT SEMICONDUCTOR PACKAGE
99
Patent #:
8432023
Issue Dt:
04/30/2013
Application #:
13161380
Filing Dt:
06/15/2011
Title:
INCREASED I/O LEADFRAME AND SEMICONDUCTOR DEVICE INCLUDING SAME
100
Patent #:
10109591
Issue Dt:
10/23/2018
Application #:
13169385
Filing Dt:
06/27/2011
Title:
INTEGRATED SHIELD PACKAGE AND METHOD
Assignor
1
AMKOR TECHNOLOGY, INC.
Exec Dt:
07/13/2018
Assignee
1
BANK OF AMERICA, N.A., AS AGENT
333 SOUTH HOPE STREET
19TH FLOOR
LOS ANGELES, CALIFORNIA 90071
Correspondence name and address
MCGUIREWOODS LLP
1750 TYSONS BOULEVARD
SUITE 1800
TYSONS, VA 22102

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