Patent Assignment Details
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| Reel/Frame: | 053067/0152 | |
| Pages: | 7 |
| | Recorded: | 06/29/2020 | | |
| Attorney Dkt #: | 2515.0512 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/13/2020
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Application #:
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16529486
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Filing Dt:
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08/01/2019
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Publication #:
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Pub Dt:
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02/13/2020
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Title:
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EMI SHIELDING FOR FLIP CHIP PACKAGE WITH EXPOSED DIE BACKSIDE
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Assignee
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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Correspondence name and address
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PATENT LAW GROUP: ATKINS AND ASSOCIATES, P.C.
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123 W. CHANDLER HEIGHTS ROAD, #12535
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CHANDLER, AZ 85248
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05/30/2024 05:41 PM
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