Patent Assignment Details
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| Reel/Frame: | 027289/0157 | |
| Pages: | 6 |
| | Recorded: | 11/29/2011 | | |
| Attorney Dkt #: | 1133-291US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/16/2000
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Application #:
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09116815
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Filing Dt:
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06/03/1998
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Title:
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PROCESS FOR BONDING MICROMACHINED WAFERS USING SOLDER
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Assignee
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| MAIL STOP D-32 |
| ERC BUILDING |
| KOKOMO, INDIANA 46904 |
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Correspondence name and address
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SHUMAKER & SIEFFERT, P.A.
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1625 RADIO DRIVE
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SUITE 300
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WOODBURY, MN 55125
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