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Reel/Frame:	058945/0169			Pages:	15
		Recorded:	11/23/2021
Conveyance:	SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 56

1

Patent #:	6544696	Issue Dt:	04/08/2003	Application #:	09996748	Filing Dt:	11/30/2001
Publication #:	US20020068229	Pub Dt:	06/06/2002
Title:	EMBEDDED ATTENUATED PHASE SHIFT MASK AND METHOD OF MAKING EMBEDDED ATTENUATED PHASE SHIFT MASK

2

Patent #:	6771482	Issue Dt:	08/03/2004	Application #:	10163567	Filing Dt:	06/06/2002
Publication #:	US20030021077	Pub Dt:	01/30/2003
Title:	PERIMETER SEAL FOR BACKSIDE COOLING OF SUBSTRATES

3

Patent #:	6846747	Issue Dt:	01/25/2005	Application #:	10407831	Filing Dt:	04/04/2003
Publication #:	US20030216034	Pub Dt:	11/20/2003
Title:	METHOD FOR ETCHING VIAS

4

Patent #:	6905626	Issue Dt:	06/14/2005	Application #:	10601076	Filing Dt:	06/19/2003
Publication #:	US20040055995	Pub Dt:	03/25/2004
Title:	NOTCH-FREE ETCHING OF HIGH ASPECT SOI STRUCTURES USING ALTERNATING DEPOSITION AND ETCHING AND PULSED PLASMA

5

Patent #:	6924235	Issue Dt:	08/02/2005	Application #:	10640469	Filing Dt:	08/12/2003
Publication #:	US20040092118	Pub Dt:	05/13/2004
Title:	SIDEWALL SMOOTHING IN HIGH ASPECT RATIO/DEEP ETCHING USING A DISCRETE GAS SWITCHING METHOD

6

Patent #:	6982175	Issue Dt:	01/03/2006	Application #:	10770839	Filing Dt:	02/02/2004
Publication #:	US20040175913	Pub Dt:	09/09/2004
Title:	END POINT DETECTION IN TIME DIVISION MULTIPLEXED ETCH PROCESSES

7

Patent #:	7115520	Issue Dt:	10/03/2006	Application #:	10815965	Filing Dt:	03/31/2004
Publication #:	US20040235307	Pub Dt:	11/25/2004
Title:	METHOD AND APPARATUS FOR PROCESS CONTROL IN TIME DIVISION MULTIPLEXED (TDM) ETCH PROCESS

8

Patent #:	7008877	Issue Dt:	03/07/2006	Application #:	10839809	Filing Dt:	05/03/2004
Publication #:	US20040259367	Pub Dt:	12/23/2004
Title:	ETCHING OF CHROMIUM LAYERS ON PHOTOMASKS UTILIZING HIGH DENSITY PLASMA AND LOW FREQUENCY RF BIAS

9

Patent #:	7101805	Issue Dt:	09/05/2006	Application #:	10841818	Filing Dt:	05/06/2004
Publication #:	US20040238489	Pub Dt:	12/02/2004
Title:	ENVELOPE FOLLOWER END POINT DETECTION IN TIME DIVISION MULTIPLEXED PROCESSES

10

Patent #:	7381650	Issue Dt:	06/03/2008	Application #:	11155904	Filing Dt:	06/20/2005
Publication #:	US20050263485	Pub Dt:	12/01/2005
Title:	METHOD AND APPARATUS FOR PROCESS CONTROL IN TIME DIVISION MULTIPLEXED (TDM) ETCH PROCESSES

11

Patent #:	7959819	Issue Dt:	06/14/2011	Application #:	11159415	Filing Dt:	06/23/2005
Publication #:	US20050287815	Pub Dt:	12/29/2005
Title:	METHOD AND APPARATUS FOR REDUCING ASPECT RATIO DEPENDENT ETCHING IN TIME DIVISION MULTIPLEXED ETCH PROCESSES

12

Patent #:	7713432	Issue Dt:	05/11/2010	Application #:	11229319	Filing Dt:	09/16/2005
Publication #:	US20060070703	Pub Dt:	04/06/2006
Title:	METHOD & APPARATUS TO IMPROVE PLASMA ETCH UNIFORMITY

13

Patent #:	7625824	Issue Dt:	12/01/2009	Application #:	11441811	Filing Dt:	05/26/2006
Publication #:	US20060287753	Pub Dt:	12/21/2006
Title:	PROCESS CHANGE DETECTION THROUGH THE USE OF EVOLUTIONARY ALGORITHMS

14

Patent #:	7833381	Issue Dt:	11/16/2010	Application #:	11502585	Filing Dt:	08/10/2006
Publication #:	US20070039548	Pub Dt:	02/22/2007
Title:	OPTICAL EMISSION INTERFEROMETRY FOR PECVD USING A GAS INJECTION HOLE

15

Patent #:	7749400	Issue Dt:	07/06/2010	Application #:	11634377	Filing Dt:	12/04/2006
Publication #:	US20070138136	Pub Dt:	06/21/2007
Title:	METHOD FOR ETCHING PHOTOLITHOGRAPHIC SUBSTRATES

16

Patent #:	7867403	Issue Dt:	01/11/2011	Application #:	11756074	Filing Dt:	05/31/2007
Publication #:	US20080149597	Pub Dt:	06/26/2008
Title:	TEMPERATURE CONTROL METHOD FOR PHOTOLITHOGRAPHIC SUBSTRATE

17

Patent #:	7829465	Issue Dt:	11/09/2010	Application #:	11834127	Filing Dt:	08/06/2007
Publication #:	US20080061029	Pub Dt:	03/13/2008
Title:	METHOD FOR PLASMA ETCHING OF POSITIVELY SLOPED STRUCTURES

18

Patent #:	8187483	Issue Dt:	05/29/2012	Application #:	11834299	Filing Dt:	08/06/2007
Publication #:	US20080035606	Pub Dt:	02/14/2008
Title:	METHOD TO MINIMIZE CD ETCH BIAS

19

Patent #:	8703001	Issue Dt:	04/22/2014	Application #:	12244681	Filing Dt:	10/02/2008
Title:	GRID ASSEMBLIES FOR USE IN ION BEAM ETCHING SYSTEMS AND METHODS OF UTILIZING THE GRID ASSEMBLIES

20

Patent #:	8139340	Issue Dt:	03/20/2012	Application #:	12689784	Filing Dt:	01/19/2010
Publication #:	US20110026187	Pub Dt:	02/03/2011
Title:	CONDUCTIVE SEAL RING ELECTROSTATIC CHUCK

21

Patent #:	8967081	Issue Dt:	03/03/2015	Application #:	12990143	Filing Dt:	01/24/2011
Publication #:	US20110143551	Pub Dt:	06/16/2011
Title:	DEVICE AND PROCESS FOR CHEMICAL VAPOR PHASE TREATMENT

22

Patent #:	8802545	Issue Dt:	08/12/2014	Application #:	13412119	Filing Dt:	03/05/2012
Publication #:	US20130065378	Pub Dt:	03/14/2013
Title:	METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

23

Patent #:	8778806	Issue Dt:	07/15/2014	Application #:	13448769	Filing Dt:	04/17/2012
Publication #:	US20120238073	Pub Dt:	09/20/2012
Title:	METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

24

Patent #:	8796154	Issue Dt:	08/05/2014	Application #:	13764110	Filing Dt:	02/11/2013
Publication #:	US20130230972	Pub Dt:	09/05/2013
Title:	METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

25

Patent #:	8785332	Issue Dt:	07/22/2014	Application #:	13764142	Filing Dt:	02/11/2013
Publication #:	US20130230968	Pub Dt:	09/05/2013
Title:	METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

26

Patent #:	8980764	Issue Dt:	03/17/2015	Application #:	13764160	Filing Dt:	02/11/2013
Publication #:	US20130230969	Pub Dt:	09/05/2013
Title:	METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

27

Patent #:	9202720	Issue Dt:	12/01/2015	Application #:	13764177	Filing Dt:	02/11/2013
Publication #:	US20130230970	Pub Dt:	09/05/2013
Title:	Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

28

Patent #:	8946058	Issue Dt:	02/03/2015	Application #:	13767459	Filing Dt:	02/14/2013
Publication #:	US20130230973	Pub Dt:	09/05/2013
Title:	Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

29

Patent #:	9070760	Issue Dt:	06/30/2015	Application #:	13787032	Filing Dt:	03/06/2013
Publication #:	US20130230974	Pub Dt:	09/05/2013
Title:	Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

30

Patent #:	9105705	Issue Dt:	08/11/2015	Application #:	13787153	Filing Dt:	03/06/2013
Publication #:	US20140235034	Pub Dt:	08/21/2014
Title:	Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

31

Patent #:	8691702	Issue Dt:	04/08/2014	Application #:	13829324	Filing Dt:	03/14/2013
Publication #:	US20130230971	Pub Dt:	09/05/2013
Title:	Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

32

Patent #:	9343365	Issue Dt:	05/17/2016	Application #:	14014040	Filing Dt:	08/29/2013
Publication #:	US20130344683	Pub Dt:	12/26/2013
Title:	Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

33

Patent #:	9368404	Issue Dt:	06/14/2016	Application #:	14034164	Filing Dt:	09/23/2013
Publication #:	US20140094018	Pub Dt:	04/03/2014
Title:	Method for Dicing a Substrate with Back Metal

34

Patent #:	9202721	Issue Dt:	12/01/2015	Application #:	14176747	Filing Dt:	02/10/2014
Publication #:	US20140154869	Pub Dt:	06/05/2014
Title:	Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

35

Patent #:	9082839	Issue Dt:	07/14/2015	Application #:	14201409	Filing Dt:	03/07/2014
Publication #:	US20140242780	Pub Dt:	08/28/2014
Title:	METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

36

Patent #:	9863036	Issue Dt:	01/09/2018	Application #:	14697441	Filing Dt:	04/27/2015
Publication #:	US20150307986	Pub Dt:	10/29/2015
Title:	WAFER STAGE FOR SYMMETRIC WAFER PROCESSING

37

Patent #:	9496177	Issue Dt:	11/15/2016	Application #:	14721443	Filing Dt:	05/26/2015
Publication #:	US20150255347	Pub Dt:	09/10/2015
Title:	Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

38

Patent #:	9202737	Issue Dt:	12/01/2015	Application #:	14728517	Filing Dt:	06/02/2015
Publication #:	US20150270154	Pub Dt:	09/24/2015
Title:	Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

39

Patent #:	10573557	Issue Dt:	02/25/2020	Application #:	14729610	Filing Dt:	06/03/2015
Publication #:	US20150270121	Pub Dt:	09/24/2015
Title:	Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

40

Patent #:	9777374	Issue Dt:	10/03/2017	Application #:	14769414	Filing Dt:	08/20/2015
Publication #:	US20160002788	Pub Dt:	01/07/2016
Title:	CHEMICAL VAPOR DEPOSITION DEVICE

41

Patent #:	10297427	Issue Dt:	05/21/2019	Application #:	14842365	Filing Dt:	09/01/2015
Publication #:	US20150371878	Pub Dt:	12/24/2015
Title:	Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

42

Patent #:	RE46339	Issue Dt:	03/14/2017	Application #:	14854127	Filing Dt:	09/15/2015
Title:	Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

43

Patent #:	9564366	Issue Dt:	02/07/2017	Application #:	14974840	Filing Dt:	12/18/2015
Publication #:	US20160111332	Pub Dt:	04/21/2016
Title:	METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

44

Patent #:	10497621	Issue Dt:	12/03/2019	Application #:	15148707	Filing Dt:	05/06/2016
Publication #:	US20180254215	Pub Dt:	09/06/2018
Title:	Method for Dicing a Substrate with Back Metal

45

Patent #:	9865436	Issue Dt:	01/09/2018	Application #:	15206300	Filing Dt:	07/10/2016
Title:	POWERED ANODE FOR ION SOURCE FOR DLC AND REACTIVE PROCESSES

46

Patent #:	9911654	Issue Dt:	03/06/2018	Application #:	15287412	Filing Dt:	10/06/2016
Publication #:	US20170025311	Pub Dt:	01/26/2017
Title:	Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

47

Patent #:	9711406	Issue Dt:	07/18/2017	Application #:	15287501	Filing Dt:	10/06/2016
Publication #:	US20170033008	Pub Dt:	02/02/2017
Title:	Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

48

Patent #:	10246781	Issue Dt:	04/02/2019	Application #:	15328413	Filing Dt:	01/23/2017
Publication #:	US20170204522	Pub Dt:	07/20/2017
Title:	METHOD FOR REMOVING A METAL DEPOSIT PLACED ON A SURFACE IN A CHAMBER

49

Patent #:	10269641	Issue Dt:	04/23/2019	Application #:	15824166	Filing Dt:	11/28/2017
Publication #:	US20180151435	Pub Dt:	05/31/2018
Title:	METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

50

Patent #:	11075057	Issue Dt:	07/27/2021	Application #:	15870890	Filing Dt:	01/13/2018
Publication #:	US20180158651	Pub Dt:	06/07/2018
Title:	Device for Treating an Object with Plasma

51

Patent #:	10741447	Issue Dt:	08/11/2020	Application #:	15910561	Filing Dt:	03/02/2018
Publication #:	US20180190542	Pub Dt:	07/05/2018
Title:	Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

52

Patent #:	10767257	Issue Dt:	09/08/2020	Application #:	16070491	Filing Dt:	07/16/2018
Publication #:	US20190032199	Pub Dt:	01/31/2019
Title:	METHOD FOR REMOVING A METAL DEPOSIT ARRANGED ON A SURFACE IN A CHAMBER

53

Patent #:	11114340	Issue Dt:	09/07/2021	Application #:	16070506	Filing Dt:	07/16/2018
Publication #:	US20210202314	Pub Dt:	07/01/2021
Title:	METHOD FOR PRODUCING AN INTERCONNECTION COMPRISING A VIA EXTENDING THROUGH A SUBSTRATE

54

Patent #:	10707060	Issue Dt:	07/07/2020	Application #:	16132040	Filing Dt:	09/14/2018
Publication #:	US20190013243	Pub Dt:	01/10/2019
Title:	METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

55

Patent #:	10818552	Issue Dt:	10/27/2020	Application #:	16279560	Filing Dt:	02/19/2019
Publication #:	US20190189513	Pub Dt:	06/20/2019
Title:	METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

56

Patent #:	10943825	Issue Dt:	03/09/2021	Application #:	16358017	Filing Dt:	03/19/2019
Publication #:	US20200083084	Pub Dt:	03/12/2020
Title:	Method for Dicing Die Attach Film

Assignors

1

RAJE TECHNOLOGY GROUP, LLC

Exec Dt:

11/08/2021

2

PLASMA-THERM, LLC

Exec Dt:

11/08/2021

3

REV-TECH MANUFACTURING SOLUTIONS, LLC

Exec Dt:

11/08/2021

4

PLASMA-THERM NES, LLC

Exec Dt:

11/08/2021

Assignee

1

HSBC BANK USA, N.A.

2929 WALDEN AVENUE

LOCATION C-112

DEPEW, NEW YORK 14043

Correspondence name and address
	THOMAS W. BROOKE
	C/O HOLLAND & KNIGHT LLP, 800 17TH ST NW
	SUITE 1100
	WASHINGTON, DC 20006

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