Patent Assignment Details
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Reel/Frame: | 033516/0186 | |
| Pages: | 5 |
| | Recorded: | 08/12/2014 | | |
Attorney Dkt #: | QCOM-2545US (141707) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/31/2016
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Application #:
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14447399
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Filing Dt:
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07/30/2014
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Publication #:
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Pub Dt:
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02/04/2016
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Title:
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PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A PLURALITY OF SOLDER RESIST LAYERS
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Assignee
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5775 MOREHOUSE DRIVE |
SAN DIEGO, CALIFORNIA 92121-1714 |
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Correspondence name and address
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LOZA & LOZA, LLP/QUALCOMM
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305 N. SECOND AVE., #127
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UPLAND, CA 91786
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