|
Total properties:
11
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/29/2002
|
Application #:
|
07849791
|
Filing Dt:
|
03/11/1992
|
|
Title:
|
PHOSPHATE COATINGS FOR METAL SURFACES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/30/1997
|
Application #:
|
08757187
|
Filing Dt:
|
11/27/1996
|
|
Title:
|
POLYGLYDICYLPHENYL ETHERS OF ALKYLENE CHAINS FOR USE IN MICROELECTRONI CS ADHESIVES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/21/1998
|
Application #:
|
08758603
|
Filing Dt:
|
11/27/1996
|
|
Title:
|
POLYGLYCIDYLPHENYL ETHERS OF ALKYLENE OR ALKYLENEOXY CHAINS FOR USE IN MICROELECTRONICS ADHESIVES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/06/2001
|
Application #:
|
09185965
|
Filing Dt:
|
11/05/1998
|
|
Title:
|
HOT MELT CONSTRUCTION ADHESIVES FOR DISPOSABLE ARTICLES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/11/2003
|
Application #:
|
10111595
|
Filing Dt:
|
04/26/2002
|
|
Title:
|
FLUID RESISTANT SILICONE COMPOSITIONS FOR SEALING MAGNESIUM ALLOY COMPONENTS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/09/2008
|
Application #:
|
10565499
|
Filing Dt:
|
01/23/2006
|
|
Publication #:
|
|
Pub Dt:
|
11/02/2006
| | | | |
|
Title:
|
LOW VOC-SOLVENT BASED MOLD RELEASE AGENT AND CURABLE MOLD RELEASE COMPOSITIONS BASED THEREON
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/05/2006
|
Application #:
|
11067754
|
Filing Dt:
|
03/01/2005
|
|
Publication #:
|
|
Pub Dt:
|
07/14/2005
| | | | |
|
Title:
|
POLYMERIZABLE COMPOSITIONS IN NON-FLOWABLE FORMS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/19/2008
|
Application #:
|
11566974
|
Filing Dt:
|
12/05/2006
|
|
Publication #:
|
|
Pub Dt:
|
05/31/2007
| | | | |
|
Title:
|
POLYMERIZABLE COMPOSITIONS IN NON-FLOWABLE FORMS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12765290
|
Filing Dt:
|
04/22/2010
|
|
Publication #:
|
|
Pub Dt:
|
08/12/2010
| | | | |
|
Title:
|
Laminating Adhesives Based on Primary Hydroxyl-Containing Curatives
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/01/2015
|
Application #:
|
13833322
|
Filing Dt:
|
03/15/2013
|
|
Publication #:
|
|
Pub Dt:
|
11/21/2013
| | | | |
|
Title:
|
Chain Extended Epoxy to Improve Adhesion of Conductive Die Attach Film
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/30/2016
|
Application #:
|
13838164
|
Filing Dt:
|
03/15/2013
|
|
Publication #:
|
|
Pub Dt:
|
09/18/2014
| | | | |
|
Title:
|
PREPREG CURING PROCESS FOR PREPARING COMPOSITES HAVING SUPERIOR SURFACE FINISH AND HIGH FIBER CONSOLIDATION
|
|
