Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 028170/0196 | |
| Pages: | 2 |
| | Recorded: | 05/04/2012 | | |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
5
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Patent #:
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Issue Dt:
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11/26/2013
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Application #:
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11588490
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Filing Dt:
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10/26/2006
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Publication #:
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Pub Dt:
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02/22/2007
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Title:
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Integrated circuit device
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Patent #:
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Issue Dt:
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12/10/2013
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Application #:
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11650356
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Filing Dt:
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01/05/2007
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Publication #:
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Pub Dt:
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07/10/2008
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Title:
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MICROELECTRONIC ASSEMBLY WITH MULTI-LAYER SUPPORT STRUCTURE
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Patent #:
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Issue Dt:
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03/26/2013
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Application #:
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12072508
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Filing Dt:
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02/26/2008
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Publication #:
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Pub Dt:
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10/09/2008
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Title:
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CHIPS HAVING REAR CONTACTS CONNECTED BY THROUGH VIAS TO FRONT CONTACTS
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Patent #:
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Issue Dt:
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06/05/2012
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Application #:
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12221204
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Filing Dt:
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07/31/2008
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Publication #:
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Pub Dt:
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03/12/2009
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Title:
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SEMICONDUCTOR PACKAGING PROCESS USING THROUGH SILICON VIAS
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Patent #:
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Issue Dt:
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11/13/2012
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Application #:
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12784841
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Filing Dt:
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05/21/2010
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Publication #:
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Pub Dt:
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09/09/2010
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Title:
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CHIPS HAVING REAR CONTACTS CONNECTED BY THROUGH VIAS TO FRONT CONTACTS
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Assignee
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| CLIONA, BUILDING ONE |
| PARKMORE EAST BUSINESS PARK |
| BALLYBRIT, GALWAY, IRELAND |
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Correspondence name and address
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DARYL K. NEFF
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LERNER, DAVID, LITTENBERG, KRUMHOLZ ET AL.
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600 SOUTH AVENUE WEST
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WESTFIELD, NJ 07090
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