Patent Assignment Details
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| Reel/Frame: | 022152/0208 | |
| Pages: | 2 |
| | Recorded: | 01/22/2009 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11499403
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Filing Dt:
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08/04/2006
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Publication #:
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Pub Dt:
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03/08/2007
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Title:
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High density interconnect assembly comprising stacked electronic module
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Assignee
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| 3001 REDHILL AVENUE, BUILDING 4, SUITE 108 |
| COSTA MESA, CALIFORNIA 92626 |
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Correspondence name and address
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W. ERIC BOYD
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IRVINE SENSORS CORP.
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3001 REDHILL AVENUE, BUILDING, 4
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SUITE 108
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COSTA MESA, CALIFORNIA 92626
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