Patent Assignment Details
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| Reel/Frame: | 022440/0215 | |
| Pages: | 4 |
| | Recorded: | 03/24/2009 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT TO ADDITIONAL CONVEYING PARTY, PREVIOUSLY RECORDED AT REEL 012181, FRAME 0138. |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/04/2003
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Application #:
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09953525
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Filing Dt:
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09/17/2001
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Title:
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METHOD MAKING A LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE
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Assignee
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| 21 R&D FIRST ROAD |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
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Correspondence name and address
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SAILE ACKERMAN LLC
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28 DAVIS AVENUE
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POUGHKEEPSIE, NY 12603
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05/29/2024 04:54 AM
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