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Reel/Frame:038977/0219   Pages: 4
Recorded: 06/21/2016
Attorney Dkt #:282650
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/16/2019
Application #:
15188681
Filing Dt:
06/21/2016
Publication #:
Pub Dt:
12/21/2017
Title:
METHOD OF MANUFACTURING A PCB INCLUDING A THICK-WALL VIA
Assignor
1
Exec Dt:
06/20/2016
Assignee
1
1 RIVER ROAD
SCHENECTADY, NEW YORK 12345
Correspondence name and address
ARMSTRONG TEASDALE LLP (32773) PATRICK W
7700 FORSYTH BOULEVARD
SUITE 1800
ST. LOUIS, MO 63105

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