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Reel/Frame:013518/0230   Pages: 13
Recorded: 11/19/2002
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/14/2006
Application #:
10299567
Filing Dt:
11/19/2002
Publication #:
Pub Dt:
05/20/2004
Title:
THIN FILM TRANSFER JOIN PROCESS AND MULTILEVEL THIN FILM MODULE
Assignors
1
Exec Dt:
10/08/2002
2
Exec Dt:
11/01/2002
3
Exec Dt:
10/02/2002
4
Exec Dt:
10/03/2002
5
Exec Dt:
10/01/2002
6
Exec Dt:
10/25/2002
7
Exec Dt:
10/05/2002
Assignee
1
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
IBM CORPORATION
IRA D. BLECKER
2070 ROUTE 52, INTELL PROP. LAW DEPT.
DEPT. 18G/BLDG. 300-482
HOPEWELL JUNCTION, NY 12533-6531

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