Patent Assignment Details
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| Reel/Frame: | 005606/0235 | |
| Pages: | 3 |
| | Recorded: | 02/06/1991 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/24/1992
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Application #:
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07651073
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Filing Dt:
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02/06/1991
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Title:
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ELECTROLYTIC METHOD FOR THE ETCH BACK OF ENCAPSULATED COPPER-INVAR- COPPER CORE STRUCTURES
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Correspondence name and address
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RICHARD M. GOLDMAN
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IBM CORP., INTELLECTUAL PROPERTY LAW
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DEPT. N50/251-2
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1701 NORTH ST.
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ENDICOTT, NY 13760
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