Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 053326/0240 | |
| Pages: | 24 |
| | Recorded: | 06/30/2020 | | |
| Attorney Dkt #: | 2515.5050 |
| Conveyance: | RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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11/01/2011
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Application #:
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12036000
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Filing Dt:
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02/22/2008
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Publication #:
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Pub Dt:
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08/27/2009
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF SUPPORTING A WAFER DURING BACKGRINDING AND REFLOW OF SOLDER BUMPS
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Patent #:
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Issue Dt:
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10/25/2011
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Application #:
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12198491
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Filing Dt:
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08/26/2008
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Publication #:
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Pub Dt:
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03/04/2010
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION LAYER
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Patent #:
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Issue Dt:
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09/27/2011
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Application #:
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12471180
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Filing Dt:
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05/22/2009
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Publication #:
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Pub Dt:
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10/08/2009
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF SELF-CONFINEMENT OF CONDUCTIVE BUMP MATERIAL DURING REFLOW WITHOUT SOLDER MASK
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Patent #:
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Issue Dt:
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12/01/2015
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Application #:
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13298267
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Filing Dt:
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11/16/2011
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Publication #:
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Pub Dt:
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05/17/2012
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONNECTION STRUCTURE AND METHOD OF MANUFACTURE THEREOF
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Assignees
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| 46429 LANDING PARKWAY |
| FREMONT, CALIFORNIA 94538 |
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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Correspondence name and address
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PATENT LAW GROUP: ATKINS AND ASSOCIATES
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123 W. CHANDLER HEIGHTS ROAD, #12535
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CHANDLER, AZ 85248
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