Patent Assignment Details
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| Reel/Frame: | 009962/0247 | |
| Pages: | 5 |
| | Recorded: | 05/14/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/14/1999
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Application #:
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08915077
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Filing Dt:
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08/20/1997
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Title:
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BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH SOLDER BALLS FUSED ON PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
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Assignee
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| 1900 SOUTH PRICE ROAD |
| CHANDLER, ARIZONA 85248 |
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Correspondence name and address
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SKJERVEN, MORRILL, MACPHERSON, ET AL.
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ALAN H. MACPHERSON
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25 METRO DRIVE
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SUITE 700
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SAN JOSE, CA 95110
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