Patent Assignment Details
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| Reel/Frame: | 008501/0250 | |
| Pages: | 4 |
| | Recorded: | 04/09/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/09/1999
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Application #:
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08835287
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Filing Dt:
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04/09/1997
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Title:
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SILICONE DIE ATTACH ADHESIVE, METHOD FOR THE FABRICATION OF SEMICONDUCTOR DEVICES, AND SEMICONDUCTOR DEVICES
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Assignee
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| 4TH FLOOR, AIG BUILDING |
| 1-1-3 MARUNOUCHI, CHIYODA-KU |
| TOKYO 100, JAPAN |
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Correspondence name and address
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DOW CORNING CORPORATION
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PAULA J. LAGATTUTA
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P.O. BOX 0994
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PATENT DEPT. MAIL C01232
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MIDLAND, MI 48686
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