Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 040581/0250 | |
| Pages: | 5 |
| | Recorded: | 11/09/2016 | | |
| Attorney Dkt #: | 70027 |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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05/23/2017
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Application #:
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15167895
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Filing Dt:
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05/27/2016
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER STRUCTURE AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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Issue Dt:
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06/13/2017
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Application #:
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15199751
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Filing Dt:
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06/30/2016
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PHOTOIMAGABLE DIELECTRIC-DEFINED TRACE AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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Issue Dt:
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10/23/2018
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Application #:
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15226735
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Filing Dt:
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08/02/2016
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #04-08/09 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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WONG & REES LLP
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4340 STEVENS CREEK BLVD.
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SUITE 106
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SAN JOSE, CA 95129
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