Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 023870/0297 | |
| Pages: | 12 |
| | Recorded: | 01/29/2010 | | |
| Attorney Dkt #: | 21260 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
8
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Patent #:
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Issue Dt:
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04/24/2001
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Application #:
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09298664
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Filing Dt:
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04/23/1999
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Title:
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UNIVERSAL PACKAGE AND METHOD OF FORMING THE SAME
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Patent #:
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Issue Dt:
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06/11/2002
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Application #:
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09598343
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Filing Dt:
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06/21/2000
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Title:
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PANEL STACKING OF BGA DEVICES TO FORM THREE-DIMENSIONAL MODULES
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Patent #:
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Issue Dt:
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07/30/2002
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Application #:
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09706015
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Filing Dt:
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11/03/2000
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Title:
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STACKABLE FLEX CIRCUIT IC PACKAGE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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10/29/2002
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Application #:
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09838773
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Filing Dt:
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04/19/2001
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Publication #:
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Pub Dt:
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08/23/2001
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Title:
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STACKABLE CHIP PACKAGE WITH FLEX CARRIER
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Patent #:
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Issue Dt:
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09/30/2003
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Application #:
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09912010
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Filing Dt:
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07/24/2001
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Publication #:
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Pub Dt:
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01/30/2003
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Title:
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CHIP STACK WITH DIFFERING CHIP PACKAGE TYPES
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Patent #:
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Issue Dt:
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04/08/2003
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Application #:
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09922977
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Filing Dt:
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08/06/2001
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Publication #:
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Pub Dt:
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12/27/2001
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Title:
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PANEL STACKING OF BGA DEVICES TO FORM THREE-DIMENSIONAL MODULES
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Patent #:
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Issue Dt:
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12/09/2003
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Application #:
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10202185
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Filing Dt:
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07/24/2002
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Publication #:
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Pub Dt:
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12/12/2002
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Title:
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METHOD OF ASSEMBLING A STACKABLE INTEGRATED CIRCUIT CHIP
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Patent #:
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Issue Dt:
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05/15/2007
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Application #:
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10900073
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Filing Dt:
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07/27/2004
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Title:
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STACKABLE FLEX CIRCUIT IC PACKAGE AND METHOD OF MAKING SAME
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Assignee
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| 8900 SHOAL CREEK BLVD. |
| SUITE 125 |
| AUSTIN, TEXAS 78757 |
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Correspondence name and address
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STEVEN LAUFF
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816 CONGRESS AVE., SUITE 1205
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CIVINS DENKO COBURN & LAUFF LLP
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AUSTIN, TX 78701
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