Patent Assignment Details
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Reel/Frame: | 008483/0302 | |
| Pages: | 3 |
| | Recorded: | 01/31/1997 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/10/1998
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Application #:
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08791954
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Filing Dt:
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01/31/1997
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Title:
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METHOD AND APPARATUS FOR PREPARING AND METALLIZING HIGH ASPECT RATIO SILICON SEMICONDUCTOR DEVICE CONTACTS TO REDUCE THE RESISTIVITY THEREOF
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Assignees
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7-35 KITASHINAGAWA, 6-CHOME, SHINAGAWA-KU |
TOKYO 141, JAPAN |
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2120 W. GUADALUPE ROAD |
GILBERT, ARIZONA 85233 |
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Correspondence name and address
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WOOD, HERRON & EVANS, L.L.P.
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JOSEPH R. JORDAN
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2700 CAREW TOWER
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CINCINNATI, OH 45202
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