Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 047270/0307 | |
| Pages: | 5 |
| | Recorded: | 10/18/2018 | | |
Attorney Dkt #: | FIS920040270US1 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY PREVIOUSLY RECORDED AT REEL: 015431 FRAME: 0262. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/25/2007
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Application #:
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10905013
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Filing Dt:
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12/09/2004
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Publication #:
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Pub Dt:
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06/15/2006
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Title:
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FORMING OF HIGH ASPECT RATIO CONDUCTIVE STRUCTURE
USING INJECTION MOLDED SOLDER
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Assignee
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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Correspondence name and address
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IBM CORPORATION
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2455 SOUTH ROAD, P386
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ATTN: HILDA HEINLEIN
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POUGHKEEPSIE, NY 12601-5400
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