Patent Assignment Details
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| Reel/Frame: | 008573/0317 | |
| Pages: | 3 |
| | Recorded: | 05/19/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/04/1999
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Application #:
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08858845
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Filing Dt:
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05/19/1997
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Title:
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INTEGRATED CIRCUIT CHIP STRUCTURE FOR IMPROVED PACKAGING
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Assignee
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| MAIL STOP 53-209 |
| 2401 PALM BAY ROAD, N.E. |
| MELBOURNE, FLORIDA 32901 |
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Correspondence name and address
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HARRIS CORPORATION
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DANIEL J. STAUDT
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2401 PALM BAY ROAD, N.E.
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MAILSTOP 53-209
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MELBOURNE, FL 32901
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