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Patent #:
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Issue Dt:
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12/11/2007
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Application #:
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10825810
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Filing Dt:
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04/16/2004
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Publication #:
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Pub Dt:
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10/28/2004
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Title:
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SYSTEM FOR FABRICATING AN INTEGRATED CIRCUIT PACKAGE ON A PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
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02/28/2006
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Application #:
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10846176
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Filing Dt:
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05/13/2004
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Publication #:
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Pub Dt:
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11/17/2005
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Title:
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METHOD OF MANUFACTURING DIFFERENT BOND PADS ON THE SAME SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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06/03/2008
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Application #:
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10907732
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Filing Dt:
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04/13/2005
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Publication #:
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Pub Dt:
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10/19/2006
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Title:
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INTEGRATED CIRCUIT SYSTEM FOR BONDING
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Patent #:
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Issue Dt:
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08/12/2008
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Application #:
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11009436
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Filing Dt:
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12/09/2004
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Publication #:
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Pub Dt:
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06/15/2006
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Title:
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METHOD FOR SOLDER BUMPING, AND SOLDER-BUMPING STRUCTURES PRODUCED THEREBY
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Patent #:
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Issue Dt:
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07/28/2009
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Application #:
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11162822
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Filing Dt:
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09/23/2005
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Publication #:
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Pub Dt:
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03/29/2007
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Title:
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INTEGRATED CIRCUIT SOLDER BUMPING SYSTEM
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Patent #:
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Issue Dt:
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12/04/2007
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Application #:
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11277973
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Filing Dt:
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03/30/2006
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Publication #:
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Pub Dt:
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10/11/2007
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Title:
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CHIP CARRIER AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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10/28/2008
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Application #:
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11306352
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Filing Dt:
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12/23/2005
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Publication #:
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Pub Dt:
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09/07/2006
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Title:
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SYSTEM FOR DIFFERENT BOND PADS IN AN INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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08/19/2008
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Application #:
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11307363
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Filing Dt:
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02/02/2006
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Publication #:
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Pub Dt:
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08/02/2007
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Title:
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WAFERSCALE PACKAGE SYSTEM
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Patent #:
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Issue Dt:
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12/14/2010
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Application #:
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11538806
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Filing Dt:
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10/04/2006
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Publication #:
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Pub Dt:
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05/24/2007
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Title:
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INTEGRATED CIRCUIT STACKING SYSTEM WITH INTEGRATED PASSIVE COMPONENTS
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Patent #:
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Issue Dt:
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03/11/2014
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Application #:
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11553949
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Filing Dt:
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10/27/2006
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Publication #:
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Pub Dt:
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05/24/2007
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Title:
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INTEGRATED PASSIVE DEVICE SYSTEM
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Patent #:
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Issue Dt:
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08/30/2011
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Application #:
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11556035
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Filing Dt:
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11/02/2006
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Publication #:
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Pub Dt:
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05/24/2007
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BUMP PAD
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Patent #:
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Issue Dt:
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05/15/2012
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Application #:
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11618806
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Filing Dt:
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12/30/2006
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Publication #:
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Pub Dt:
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07/03/2008
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Title:
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DUAL MOLDED MULTI-CHIP PACKAGE SYSTEM
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Patent #:
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Issue Dt:
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05/25/2010
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Application #:
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11671900
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Filing Dt:
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02/06/2007
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Publication #:
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Pub Dt:
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08/09/2007
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Title:
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SOLDER BUMP CONFINEMENT SYSTEM FOR AN INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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03/23/2010
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Application #:
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11689282
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Filing Dt:
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03/21/2007
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Publication #:
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Pub Dt:
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09/25/2008
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Title:
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METHOD OF FORMING SOLDER BUMP ON HIGH TOPOGRAPHY PLATED CU
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Patent #:
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Issue Dt:
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06/01/2010
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Application #:
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11689319
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Filing Dt:
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03/21/2007
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Publication #:
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Pub Dt:
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09/25/2008
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Title:
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METHOD OF FORMING TOP ELECTRODE FOR CAPACITOR AND INTERCONNECTION IN INTEGRATED PASSIVE DEVICE (IPD)
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Patent #:
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Issue Dt:
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09/27/2011
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Application #:
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11694907
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Filing Dt:
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03/30/2007
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Publication #:
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Pub Dt:
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10/02/2008
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PROTECTED CONDUCTIVE LAYERS FOR PADS AND METHOD OF MANUFACTURING THEREOF
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Patent #:
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Issue Dt:
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03/30/2010
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Application #:
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11734410
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Filing Dt:
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04/12/2007
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Publication #:
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Pub Dt:
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10/16/2008
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Title:
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COMPACT COILS FOR HIGH PERFORMANCE FILTERS
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Patent #:
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Issue Dt:
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01/31/2012
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Application #:
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11757869
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Filing Dt:
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06/04/2007
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Publication #:
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Pub Dt:
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12/04/2008
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Title:
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SEMICONDUCTOR PACKAGING SYSTEM WITH STACKING AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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Issue Dt:
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12/08/2009
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Application #:
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11760207
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Filing Dt:
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06/08/2007
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Publication #:
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Pub Dt:
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12/11/2008
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Title:
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MINIATURIZED WIDE-BAND BALUNS FOR RF APPLICATIONS
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Patent #:
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Issue Dt:
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06/30/2009
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Application #:
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11765930
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Filing Dt:
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06/20/2007
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Publication #:
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Pub Dt:
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12/25/2008
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Title:
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METHOD OF MAKING A WAFER LEVEL INTEGRATION PACKAGE
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Patent #:
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Issue Dt:
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05/21/2013
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Application #:
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11768825
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Filing Dt:
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06/26/2007
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Publication #:
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Pub Dt:
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11/06/2008
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Title:
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PACKAGE-IN-PACKAGE USING THROUGH-HOLE VIA DIE ON SAW STREETS
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Patent #:
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Issue Dt:
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05/25/2010
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Application #:
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11768844
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Filing Dt:
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06/26/2007
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Publication #:
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Pub Dt:
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11/06/2008
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Title:
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PACKAGE-ON-PACKAGE USING THROUGH-HOLE VIA DIE ON SAW STREETS
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Patent #:
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Issue Dt:
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07/06/2010
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Application #:
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11768869
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Filing Dt:
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06/26/2007
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Publication #:
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Pub Dt:
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11/06/2008
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Title:
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SAME SIZE DIE STACKED PACKAGE HAVING THROUGH-HOLE VIAS FORMED IN ORGANIC MATERIAL
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Patent #:
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Issue Dt:
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01/04/2011
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Application #:
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11770690
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Filing Dt:
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06/28/2007
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Publication #:
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Pub Dt:
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01/01/2009
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Title:
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CIRCUIT SYSTEM WITH CIRCUIT ELEMENT
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Patent #:
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Issue Dt:
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05/29/2012
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Application #:
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11843649
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Filing Dt:
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08/23/2007
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Publication #:
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Pub Dt:
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12/13/2007
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH POST-PASSIVATION INTERCONNECTION AND INTEGRATION
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Patent #:
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Issue Dt:
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02/23/2010
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Application #:
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11858749
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Filing Dt:
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09/20/2007
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Publication #:
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Pub Dt:
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03/26/2009
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Title:
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SEMICONDUCTOR PACKAGE WITH PASSIVATION ISLAND FOR REDUCING STRESS ON SOLDER BUMPS
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|
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Patent #:
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Issue Dt:
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10/18/2011
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Application #:
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11859416
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Filing Dt:
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09/21/2007
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Publication #:
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Pub Dt:
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03/26/2009
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Title:
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SOLDER BUMP WITH INNER CORE PILLAR IN SEMICONDUCTOR PACKAGE
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|
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|
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Patent #:
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Issue Dt:
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04/20/2010
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Application #:
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11860377
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Filing Dt:
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09/24/2007
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Publication #:
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Pub Dt:
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03/26/2009
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF REDUCING ELECTROMAGNETIC INTERFERENCE BETWEEN DEVICES
|
|
|
|
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Patent #:
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Issue Dt:
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09/08/2009
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Application #:
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11861233
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Filing Dt:
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09/25/2007
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Publication #:
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Pub Dt:
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11/06/2008
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Title:
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SEMICONDUCTOR PACKAGE HAVING THROUGH-HOLE VIA ON SAW STREETS FORMED WITH PARTIAL SAW
|
|
|
|
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Patent #:
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|
Issue Dt:
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11/09/2010
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Application #:
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11861244
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Filing Dt:
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09/25/2007
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Publication #:
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Pub Dt:
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11/06/2008
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Title:
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SEMICONDUCTOR WAFER HAVING THROUGH-HOLE VIAS ON SAW STREETS WITH BACKSIDE REDISTRIBUTION LAYER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
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03/08/2011
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Application #:
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11861251
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Filing Dt:
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09/25/2007
|
|
Publication #:
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Pub Dt:
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11/06/2008
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Title:
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SEMICONDUCTOR DIE WITH THROUGH-HOLE VIA ON SAW STREETS AND THROUGH-HOLE VIA IN ACTIVE AREA OF DIE
|
|
|
|
|
Patent #:
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|
Issue Dt:
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04/28/2009
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Application #:
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11877613
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Filing Dt:
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10/23/2007
|
|
Publication #:
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Pub Dt:
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02/21/2008
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Title:
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CHIP CARRIER AND FABRICATION METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
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06/01/2010
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Application #:
|
11934009
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Filing Dt:
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11/01/2007
|
|
Publication #:
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Pub Dt:
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06/26/2008
| | | | |
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF PROTECTING PASSIVATION LAYER IN A SOLDER BUMP PROCESS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
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08/10/2010
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Application #:
|
11936461
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Filing Dt:
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11/07/2007
|
|
Publication #:
|
|
Pub Dt:
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05/07/2009
| | | | |
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Title:
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METHOD OF FORMING AN INDUCTOR ON A SEMICONDUCTOR WAFER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
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09/07/2010
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Application #:
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11947377
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Filing Dt:
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11/29/2007
|
|
Publication #:
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Pub Dt:
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06/04/2009
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING THROUGH HOLE VIAS IN DIE EXTENSION REGION AROUND PERIPHERY OF DIE
|
|
|
|
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Patent #:
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|
Issue Dt:
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04/02/2013
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Application #:
|
11949255
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Filing Dt:
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12/03/2007
|
|
Publication #:
|
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Pub Dt:
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06/04/2009
| | | | |
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF MAKING INTEGRATED PASSIVE DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
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11/23/2010
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Application #:
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11951729
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Filing Dt:
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12/06/2007
|
|
Publication #:
|
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Pub Dt:
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06/11/2009
| | | | |
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Title:
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SEMICONDUCTOR WAFER LEVEL INTERCONNECT PACKAGE UTILIZING CONDUCTIVE RING AND PAD FOR SEPARATE VOLTAGE SUPPLIES AND METHOD OF MAKING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
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10/18/2011
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Application #:
|
11952502
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Filing Dt:
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12/07/2007
|
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Publication #:
|
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Pub Dt:
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06/11/2009
| | | | |
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SIMILAR STRUCTURE FOR TOP AND BOTTOM BONDING PADS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
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12/14/2010
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Application #:
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11965160
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Filing Dt:
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12/27/2007
|
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Publication #:
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Pub Dt:
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07/02/2009
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Title:
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SEMICONDUCTOR DEVICE WITH OPTICAL SENSOR AND METHOD OF FORMING INTERCONNECT STRUCTURE ON FRONT AND BACKSIDE OF THE DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
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05/13/2014
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Application #:
|
11965383
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Filing Dt:
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12/27/2007
|
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Publication #:
|
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Pub Dt:
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07/02/2009
| | | | |
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Title:
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SYSTEM AND APPARATUS FOR WAFER LEVEL INTEGRATION OF COMPONENTS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/11/2016
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Application #:
|
12035843
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Filing Dt:
|
02/22/2008
|
|
Publication #:
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Pub Dt:
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08/27/2009
| | | | |
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Title:
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Semiconductor Interconnect Structure with Stacked Vias Separated by Signal Line and Method Therefor
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/27/2011
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Application #:
|
12044803
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Filing Dt:
|
03/07/2008
|
|
Publication #:
|
|
Pub Dt:
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09/10/2009
| | | | |
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Title:
|
SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR DIE WITH INTERNAL VERTICAL INTERCONNECT STRUCTURE AND METHOD THEREFOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/06/2010
|
Application #:
|
12047640
|
Filing Dt:
|
03/13/2008
|
|
Publication #:
|
|
Pub Dt:
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09/17/2009
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE WITH INTEGRATED PASSIVE CIRCUIT AND METHOD OF MAKING THE SAME USING SACRIFICIAL SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/18/2012
|
Application #:
|
12051253
|
Filing Dt:
|
03/19/2008
|
|
Publication #:
|
|
Pub Dt:
|
09/24/2009
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE WITH CROSS-TALK ISOLATION USING M-CAP AND METHOD THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/01/2011
|
Application #:
|
12055171
|
Filing Dt:
|
03/25/2008
|
|
Publication #:
|
|
Pub Dt:
|
10/01/2009
| | | | |
|
Title:
|
WAFER INTEGRATED WITH PERMANENT CARRIER AND METHOD THEREFOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/06/2011
|
Application #:
|
12057199
|
Filing Dt:
|
03/27/2008
|
|
Publication #:
|
|
Pub Dt:
|
10/01/2009
| | | | |
|
Title:
|
THROUGH HOLE VIAS AT SAW STREETS INCLUDING PROTRUSIONS OR RECESSES FOR INTERCONNECTION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/21/2011
|
Application #:
|
12126548
|
Filing Dt:
|
05/23/2008
|
|
Publication #:
|
|
Pub Dt:
|
11/26/2009
| | | | |
|
Title:
|
WIREBONDLESS WAFER LEVEL PACKAGE WITH PLATED BUMPS AND INTERCONNECTS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/04/2011
|
Application #:
|
12137242
|
Filing Dt:
|
06/11/2008
|
|
Publication #:
|
|
Pub Dt:
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12/17/2009
| | | | |
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Title:
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METHOD AND APPARATUS FOR WAFER LEVEL INTEGRATION USING TAPERED VIAS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/15/2011
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Application #:
|
12167039
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Filing Dt:
|
07/02/2008
|
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Publication #:
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Pub Dt:
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01/07/2010
| | | | |
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF SHUNT TEST MEASUREMENT FOR PASSIVE CIRCUITS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/10/2010
|
Application #:
|
12167146
|
Filing Dt:
|
07/02/2008
|
|
Publication #:
|
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Pub Dt:
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01/07/2010
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF PROVIDING ELECTROSTATIC DISCHARGE PROTECTION FOR INTEGRATED PASSIVE DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/09/2010
|
Application #:
|
12172817
|
Filing Dt:
|
07/14/2008
|
|
Publication #:
|
|
Pub Dt:
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01/14/2010
| | | | |
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Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING STEPPED-DOWN RDL AND RECESSED THV IN PERIPHERAL REGION OF THE DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/13/2012
|
Application #:
|
12182283
|
Filing Dt:
|
07/30/2008
|
|
Publication #:
|
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Pub Dt:
|
02/05/2009
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF PROVIDING COMMON VOLTAGE BUS AND WIRE BONDABLE REDISTRIBUTION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/26/2016
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Application #:
|
12205727
|
Filing Dt:
|
09/05/2008
|
|
Publication #:
|
|
Pub Dt:
|
03/11/2010
| | | | |
|
Title:
|
Semiconductor Device and Method of Forming Shielding Layer over Integrated Passive Device Using Conductive Channels
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/06/2012
|
Application #:
|
12207324
|
Filing Dt:
|
09/09/2008
|
|
Publication #:
|
|
Pub Dt:
|
03/26/2009
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING INTERCONNECT STRUCTURE IN NON-ACTIVE AREA OF WAFER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/23/2010
|
Application #:
|
12325587
|
Filing Dt:
|
12/01/2008
|
|
Publication #:
|
|
Pub Dt:
|
06/03/2010
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING AN INTERPOSER PACKAGE WITH THROUGH SILICON VIAS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/15/2013
|
Application #:
|
12329430
|
Filing Dt:
|
12/05/2008
|
|
Publication #:
|
|
Pub Dt:
|
06/10/2010
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING CONDUCTIVE POSTS EMBEDDED IN PHOTOSENSITIVE ENCAPSULANT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/05/2013
|
Application #:
|
12331492
|
Filing Dt:
|
12/10/2008
|
|
Publication #:
|
|
Pub Dt:
|
07/02/2009
| | | | |
|
Title:
|
Semiconductor Device Having Balanced Band-Pass Filter Implemented with LC Resonator
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/03/2011
|
Application #:
|
12331698
|
Filing Dt:
|
12/10/2008
|
|
Publication #:
|
|
Pub Dt:
|
06/10/2010
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF EMBEDDING INTEGRATED PASSIVE DEVICES INTO THE PACKAGE ELECTRICALLY INTERCONNECTED USING CONDUCTIVE PILLARS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/22/2010
|
Application #:
|
12332118
|
Filing Dt:
|
12/10/2008
|
|
Publication #:
|
|
Pub Dt:
|
06/10/2010
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING AN INTERCONNECT STRUCTURE FOR 3-D DEVICES USING ENCAPSULANT FOR STRUCTURAL SUPPORT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/21/2010
|
Application #:
|
12332277
|
Filing Dt:
|
12/10/2008
|
|
Publication #:
|
|
Pub Dt:
|
06/10/2010
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING A SHIELDING LAYER OVER A SEMICONDUCTOR DIE AFTER FORMING A BUILD-UP INTERCONNECT STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/13/2011
|
Application #:
|
12332325
|
Filing Dt:
|
12/10/2008
|
|
Publication #:
|
|
Pub Dt:
|
06/10/2010
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING COMPLIANT POLYMER LAYER BETWEEN UBM AND CONFORMAL DIELECTRIC LAYER/RDL FOR STRESS RELIEF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/05/2010
|
Application #:
|
12333977
|
Filing Dt:
|
12/12/2008
|
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING A VERTICAL INTERCONNECT STRUCTURE FOR 3-D FO-WLCSP
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/31/2010
|
Application #:
|
12334347
|
Filing Dt:
|
12/12/2008
|
|
Publication #:
|
|
Pub Dt:
|
06/17/2010
| | | | |
|
Title:
|
INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING THROUGH SILICON VIAS WITH PARTIAL DEPTH METAL FILL REGIONS AND METHOD OF MANUFACTURE THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/08/2010
|
Application #:
|
12393034
|
Filing Dt:
|
02/25/2009
|
|
Publication #:
|
|
Pub Dt:
|
06/25/2009
| | | | |
|
Title:
|
CHIP CARRIER AND FABRICATION METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/11/2011
|
Application #:
|
12403234
|
Filing Dt:
|
03/12/2009
|
|
Publication #:
|
|
Pub Dt:
|
09/16/2010
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING BALUN AND RF COUPLER ON A COMMON SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/04/2012
|
Application #:
|
12406038
|
Filing Dt:
|
03/17/2009
|
|
Publication #:
|
|
Pub Dt:
|
09/23/2010
| | | | |
|
Title:
|
MAKING A SEMICONDUCTOR DEVICE HAVING CONDUCTIVE THROUGH ORGANIC VIAS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/02/2011
|
Application #:
|
12410260
|
Filing Dt:
|
03/24/2009
|
|
Publication #:
|
|
Pub Dt:
|
09/30/2010
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING ENHANCED UBM STRUCTURE FOR IMPROVING SOLDER JOINT RELIABILITY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/24/2012
|
Application #:
|
12410312
|
Filing Dt:
|
03/24/2009
|
|
Publication #:
|
|
Pub Dt:
|
09/30/2010
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING NO-FLOW UNDERFILL MATERIAL AROUND VERTICAL INTERCONNECT STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/26/2013
|
Application #:
|
12411154
|
Filing Dt:
|
03/25/2009
|
|
Publication #:
|
|
Pub Dt:
|
09/30/2010
| | | | |
|
Title:
|
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE UNDERFILL AND METHOD OF MANUFACTURE THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/19/2013
|
Application #:
|
12411310
|
Filing Dt:
|
03/25/2009
|
|
Publication #:
|
|
Pub Dt:
|
09/30/2010
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING A SHIELDING LAYER BETWEEN STACKED SEMICONDUCTOR DIE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/10/2013
|
Application #:
|
12412279
|
Filing Dt:
|
03/26/2009
|
|
Publication #:
|
|
Pub Dt:
|
09/30/2010
| | | | |
|
Title:
|
Semiconductor Device and Method of Forming a Thin Wafer Without a Carrier
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/23/2011
|
Application #:
|
12412312
|
Filing Dt:
|
03/26/2009
|
|
Publication #:
|
|
Pub Dt:
|
09/30/2010
| | | | |
|
Title:
|
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH Z-INTERCONNECTS HAVING TRACES AND METHOD OF MANUFACTURE THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/07/2011
|
Application #:
|
12467908
|
Filing Dt:
|
05/18/2009
|
|
Publication #:
|
|
Pub Dt:
|
11/18/2010
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING A 3D INDUCTOR FROM PREFABRICATED PILLAR FRAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/31/2011
|
Application #:
|
12472170
|
Filing Dt:
|
05/26/2009
|
|
Publication #:
|
|
Pub Dt:
|
12/02/2010
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING IPD STRUCTURE USING SMOOTH CONDUCTIVE LAYER AND BOTTOM-SIDE CONDUCTIVE LAYER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/15/2011
|
Application #:
|
12473233
|
Filing Dt:
|
05/27/2009
|
|
Publication #:
|
|
Pub Dt:
|
12/24/2009
| | | | |
|
Title:
|
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED CIRCUITRY AND POST, AND METHOD OF MANUFACTURE THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/16/2013
|
Application #:
|
12484099
|
Filing Dt:
|
06/12/2009
|
|
Publication #:
|
|
Pub Dt:
|
10/08/2009
| | | | |
|
Title:
|
INTEGRATED CIRCUIT SYSTEM HAVING DIFFERENT-SIZE SOLDER BUMPS AND DIFFERENT-SIZE BONDING PADS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/30/2010
|
Application #:
|
12493108
|
Filing Dt:
|
06/26/2009
|
|
Publication #:
|
|
Pub Dt:
|
10/22/2009
| | | | |
|
Title:
|
WAFER LEVEL INTEGRATION PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/07/2012
|
Application #:
|
12507130
|
Filing Dt:
|
07/22/2009
|
|
Publication #:
|
|
Pub Dt:
|
01/27/2011
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF EMBEDDING THERMALLY CONDUCTIVE LAYER IN INTERCONNECT STRUCTURE FOR HEAT DISSIPATION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/13/2011
|
Application #:
|
12533160
|
Filing Dt:
|
07/31/2009
|
|
Publication #:
|
|
Pub Dt:
|
11/26/2009
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING THROUGH-HOLE VIAS ON SAW STREETS FORMED WITH PARTIAL SAW
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/20/2011
|
Application #:
|
12533270
|
Filing Dt:
|
07/31/2009
|
|
Publication #:
|
|
Pub Dt:
|
11/26/2009
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING THROUGH-HOLE VIAS ON SAW STREETS FORMED WITH PARTIAL SAW
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/13/2011
|
Application #:
|
12533344
|
Filing Dt:
|
07/31/2009
|
|
Publication #:
|
|
Pub Dt:
|
11/26/2009
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING THROUGH-HOLE VIAS ON SAW STREETS FORMED WITH PARTIAL SAW
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/19/2013
|
Application #:
|
12534029
|
Filing Dt:
|
07/31/2009
|
|
Publication #:
|
|
Pub Dt:
|
02/03/2011
| | | | |
|
Title:
|
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH THROUGH SILICON VIA BASE AND METHOD OF MANUFACTURE THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/23/2011
|
Application #:
|
12541334
|
Filing Dt:
|
08/14/2009
|
|
Publication #:
|
|
Pub Dt:
|
02/17/2011
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DIE TO HEAT SPREADER ON TEMPORARY CARRIER AND FORMING POLYMER LAYER AND CONDUCTIVE LAYER OVER THE DIE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/26/2016
|
Application #:
|
12545390
|
Filing Dt:
|
08/21/2009
|
|
Publication #:
|
|
Pub Dt:
|
02/24/2011
| | | | |
|
Title:
|
Semiconductor Device and Method of Forming Dual-Active Sided Semiconductor Die in Fan-Out Wafer Level Chip Scale Package
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/19/2016
|
Application #:
|
12551270
|
Filing Dt:
|
08/31/2009
|
|
Publication #:
|
|
Pub Dt:
|
03/03/2011
| | | | |
|
Title:
|
Semiconductor Device and Method of Forming Pre-Molded Semiconductor Die Having Bumps Embedded in Encapsulant
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/22/2013
|
Application #:
|
12557382
|
Filing Dt:
|
09/10/2009
|
|
Publication #:
|
|
Pub Dt:
|
03/10/2011
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING DIRECTIONAL RF COUPLER WITH IPD FOR ADDITIONAL RF SIGNAL PROCESSING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/27/2012
|
Application #:
|
12565380
|
Filing Dt:
|
09/23/2009
|
|
Publication #:
|
|
Pub Dt:
|
03/24/2011
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING OPEN CAVITY IN TSV INTERPOSER TO CONTAIN SEMICONDUCTOR DIE IN WLCSMP
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/11/2014
|
Application #:
|
12567033
|
Filing Dt:
|
09/25/2009
|
|
Publication #:
|
|
Pub Dt:
|
03/31/2011
| | | | |
|
Title:
|
Semiconductor Device and Method of Forming Adhesive Material to Secure Semiconductor Die to Carrier in WLCSP
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/05/2014
|
Application #:
|
12572590
|
Filing Dt:
|
10/02/2009
|
|
Publication #:
|
|
Pub Dt:
|
06/17/2010
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE WITH A VERTICAL INTERCONNECT STRUCTURE FOR 3-D FO-WLCSP
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/22/2013
|
Application #:
|
12579286
|
Filing Dt:
|
10/14/2009
|
|
Publication #:
|
|
Pub Dt:
|
02/18/2010
| | | | |
|
Title:
|
MINIATURIZED WIDE-BAND BALUNS FOR RF APPLICATIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/12/2014
|
Application #:
|
12579299
|
Filing Dt:
|
10/14/2009
|
|
Publication #:
|
|
Pub Dt:
|
02/11/2010
| | | | |
|
Title:
|
MINIATURIZED WIDE-BAND BALUNS FOR RF APPLICATIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2012
|
Application #:
|
12579307
|
Filing Dt:
|
10/14/2009
|
|
Publication #:
|
|
Pub Dt:
|
02/11/2010
| | | | |
|
Title:
|
MINIATURIZED WIDE-BAND BALUNS FOR RF APPLICATIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/26/2013
|
Application #:
|
12580933
|
Filing Dt:
|
10/16/2009
|
|
Publication #:
|
|
Pub Dt:
|
04/21/2011
| | | | |
|
Title:
|
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/02/2014
|
Application #:
|
12606351
|
Filing Dt:
|
10/27/2009
|
|
Publication #:
|
|
Pub Dt:
|
02/25/2010
| | | | |
|
Title:
|
MINIATURIZED WIDE-BAND BALUNS FOR RF APPLICATIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/23/2014
|
Application #:
|
12612938
|
Filing Dt:
|
11/05/2009
|
|
Publication #:
|
|
Pub Dt:
|
05/27/2010
| | | | |
|
Title:
|
Semiconductor Device and Method of Forming WLCSP Using Wafer Sections Containing Multiple Die
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/12/2011
|
Application #:
|
12615428
|
Filing Dt:
|
11/10/2009
|
|
Publication #:
|
|
Pub Dt:
|
03/04/2010
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE DEVICE USING SACRIFICIAL CARRIER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/17/2012
|
Application #:
|
12621738
|
Filing Dt:
|
11/19/2009
|
|
Publication #:
|
|
Pub Dt:
|
05/19/2011
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING IPD ON MOLDED SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/11/2011
|
Application #:
|
12625975
|
Filing Dt:
|
11/25/2009
|
|
Publication #:
|
|
Pub Dt:
|
05/26/2011
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING COMPLIANT STRESS RELIEF BUFFER AROUND LARGE ARRAY WLCSP
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/05/2013
|
Application #:
|
12628631
|
Filing Dt:
|
12/01/2009
|
|
Publication #:
|
|
Pub Dt:
|
11/29/2012
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP STRUCTURE WITH MULTI-LAYER UBM AROUND BUMP FORMATION AREA
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/20/2011
|
Application #:
|
12641958
|
Filing Dt:
|
12/18/2009
|
|
Publication #:
|
|
Pub Dt:
|
04/22/2010
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING STEPPED-DOWN RDL AND RECESSED THV IN PERIPHERAL REGION OF THE DEVICE
|
|
