Patent Assignment Details
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| Reel/Frame: | 023318/0342 | |
| Pages: | 4 |
| | Recorded: | 09/21/2009 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12586339
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Filing Dt:
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09/21/2009
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Publication #:
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Pub Dt:
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03/24/2011
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Title:
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Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
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Assignee
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| 495 MERCURY DRIVE |
| SUNNYVALE, CALIFORNIA 94085 |
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Correspondence name and address
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BO-IN LIN
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13445 MANDOLI DRIVE
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LOS ALTOS HILLS, CA 94022
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05/23/2024 01:45 PM
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