Patent Assignment Details
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Reel/Frame: | 008242/0357 | |
| Pages: | 3 |
| | Recorded: | 08/09/1996 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/17/1998
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Application #:
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08695006
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Filing Dt:
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08/09/1996
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Title:
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WAFER SURFACE MODIFICATION FOR IMPROVED ELECTROSTATIC CHUCKING EFFICIENCY
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Assignee
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SCIENCE BASED INDUSTRIAL PARK |
NO. 121 PARK AVENUE 3 |
HSIN-CHU, TAIWAN, CHINA |
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Correspondence name and address
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BARNES, KISSELLE, RAISCH, CHOATE,
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WHITTEMORE & HULBERT, P.C.
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RANDY W. TUNG
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645 GRISWOLD, 3500 PENEBSCOT BUILDING
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DETROIT, MI 48226-4217
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