Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 059323/0358 | |
| Pages: | 43 |
| | Recorded: | 03/05/2022 | | |
| Attorney Dkt #: | JK-020 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/08/2019
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Application #:
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15133081
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Filing Dt:
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04/19/2016
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Publication #:
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Pub Dt:
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11/24/2016
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Title:
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METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE HAVING A MULTI-LAYER MOLDED CONDUCTIVE SUBSTRATE AND STRUCTURE
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Assignee
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| 491B RIVER VALLEY ROAD |
| VALLEY POINT #12-03, SINGAPORE 248373 |
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Correspondence name and address
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LAW OFFICE OF KEVIN B JACKSON
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6315 E CACTUS WREN RD
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PARADISE VALLEY, AZ 85253-8006
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