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Total properties:
78
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01/02/2001
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Application #:
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09104031
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Filing Dt:
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06/24/1998
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Title:
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METHOD OF FORMING EXTENDED LEAD PACKAGE
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Patent #:
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08/15/2000
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Application #:
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09161408
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Filing Dt:
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09/28/1998
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Title:
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MOLDED TAPE SUPPORT FOR A MOLDED CIRCUIT PACKAGE PRIOR TO DICING
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Patent #:
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Issue Dt:
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08/07/2001
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Application #:
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09174620
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Filing Dt:
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10/19/1998
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Title:
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UNIVERSAL DOCKING SYSTEM
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Patent #:
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Issue Dt:
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10/09/2001
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Application #:
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09182762
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Filing Dt:
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10/30/1998
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Title:
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RELIABLE METHOD AND APPARATUS FOR INTERFACING BETWEEN A BALL GRID ARRAY HANDLER AND A BALL GRID ARRAY TESTING SYSTEM
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Patent #:
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Issue Dt:
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03/12/2002
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Application #:
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09249251
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Filing Dt:
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02/12/1999
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Title:
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METHOD OF MOLDING FLEXIBLE CIRCUIT WITH MOLDED STIFFENER
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Patent #:
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Issue Dt:
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06/11/2002
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Application #:
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09252629
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Filing Dt:
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02/18/1999
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Title:
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TESTING OF BGA AND OTHER CSP PACKAGES USING PROBING TECHNIQUES
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Patent #:
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Issue Dt:
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01/23/2001
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Application #:
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09307838
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Filing Dt:
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05/10/1999
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Title:
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VELCRO STRAPPING FOR SEMICONDUCTOR CARRYING TRAYS
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Patent #:
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Issue Dt:
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02/06/2001
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Application #:
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09320752
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Filing Dt:
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05/27/1999
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Title:
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CONTACTOR SLEEVE ASSEMBLY FOR A PICK AND PLACE SEMICONDUCTOR DEVICE HANDLER
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Patent #:
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Issue Dt:
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07/03/2001
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Application #:
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09366752
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Filing Dt:
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08/04/1999
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Title:
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FLIP CHIP THERMALLY ENHANCED BALL GRID ARRAY
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Patent #:
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Issue Dt:
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07/16/2002
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Application #:
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09395923
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Filing Dt:
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09/14/1999
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Title:
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LEADFRAME BASED CHIP SCALE PACKAGE AND METHOD OF PRODUCING THE SAME
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Patent #:
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06/05/2001
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Application #:
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09412631
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Filing Dt:
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10/04/1999
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Title:
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DEVICE PROBE SOCKET FORMING PART OF A TEST HEAD, INTERFACING BETWEEN TEST HEAD AND A PROBE HANDLER, USED FOR DEVICE STRIP TESTING
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Patent #:
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Issue Dt:
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11/20/2001
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Application #:
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09467119
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Filing Dt:
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12/20/1999
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Title:
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ZIG-ZAGGED PLATING BUS LINES
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Patent #:
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Issue Dt:
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04/08/2003
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Application #:
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09614011
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Filing Dt:
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07/11/2000
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Title:
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COPLANARITY INSPECTION AT THE SINGULATION PROCESS
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Patent #:
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Issue Dt:
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10/22/2002
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Application #:
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09635582
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Filing Dt:
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08/09/2000
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Title:
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PBGA SINGULATED SUBSTRATE FOR MODEL MELAMINE CLEANING
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Patent #:
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Issue Dt:
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09/04/2001
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Application #:
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09638749
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Filing Dt:
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08/14/2000
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Title:
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Boat and assembly method for ball grid array packages
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Patent #:
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Issue Dt:
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06/11/2002
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Application #:
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09639679
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Filing Dt:
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08/14/2000
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Title:
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HEAT SPREADER HOLE PIN 1 IDENTIFIER
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Patent #:
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Issue Dt:
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08/13/2002
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Application #:
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09640546
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Filing Dt:
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08/17/2000
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Title:
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METHODS OF FORMING DROP-IN HEAT SPREADER PLASTIC BALL GRID ARRAY (PBGA) PACKAGES
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Patent #:
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Issue Dt:
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02/25/2003
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Application #:
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09659729
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Filing Dt:
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09/11/2000
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Title:
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GROUND PIN CONCEPT FOR SINGULATED BALL GRID ARRAY
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Patent #:
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Issue Dt:
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08/21/2001
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Application #:
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09670380
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Filing Dt:
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09/27/2000
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Title:
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Copper pads for heat spreader attach
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Patent #:
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Issue Dt:
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11/19/2002
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Application #:
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09705251
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Filing Dt:
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11/02/2000
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Title:
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LEADED SEMICONDUCTOR PACKAGES AND METHOD OF TRIMMING AND SINGULATING SUCH PACKAGES
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Patent #:
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Issue Dt:
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07/30/2002
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Application #:
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09713800
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Filing Dt:
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11/16/2000
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Title:
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VELCRO STRAPPING FOR SEMICONDUCTOR CARRYING TRAYS
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Patent #:
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Issue Dt:
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03/25/2003
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Application #:
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09849671
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Filing Dt:
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05/07/2001
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Publication #:
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Pub Dt:
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11/07/2002
| | | | |
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Title:
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ENHANCED BGA GROUNDED HEATSINK
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Patent #:
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Issue Dt:
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03/25/2003
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Application #:
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09867095
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Filing Dt:
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05/30/2001
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Publication #:
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Pub Dt:
|
12/05/2002
| | | | |
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Title:
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SUPER THIN/SUPER THERMAL BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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11/12/2002
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Application #:
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09877324
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Filing Dt:
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06/11/2001
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Publication #:
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Pub Dt:
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10/04/2001
| | | | |
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Title:
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FLIP CHIP THERMALLY ENHANCED BALL GRID ARRAY
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Patent #:
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Issue Dt:
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04/30/2002
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Application #:
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09920599
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Filing Dt:
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08/02/2001
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Title:
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DIE PADDLE ENHANCEMENT FOR EXPOSED PAD IN SEMICONDUCTOR PACKAGING
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Patent #:
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Issue Dt:
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03/18/2003
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Application #:
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10116983
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Filing Dt:
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04/05/2002
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Title:
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SEMICONDUCTOR PACKAGE HAVING HEAT SINK ATTACHED TO PRE-MOLDED CAVITIES AND METHOD FOR CREATING THE PACKAGE
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Patent #:
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Issue Dt:
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03/18/2003
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Application #:
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10140572
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Filing Dt:
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05/08/2002
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Publication #:
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Pub Dt:
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09/12/2002
| | | | |
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Title:
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TESTING OF BGA AND OTHER CSP PACKAGES USING PROBING TECHNIQUES
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Patent #:
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09/14/2010
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12474131
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05/28/2009
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Publication #:
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Pub Dt:
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10/22/2009
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Title:
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LEADFRAME PACKAGE FOR MEMS MICROPHONE ASSEMBLY
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Patent #:
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09/02/2014
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12982102
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12/30/2010
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07/07/2011
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Title:
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REMOTE CONTROL WITH INTEGRATED POSITION, VIEWER IDENTIFICATION AND OPTICAL AND AUDIO TEST
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Patent #:
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06/02/2015
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13190339
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07/25/2011
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Publication #:
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Pub Dt:
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11/17/2011
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DIE TO HEAT SPREADER ON TEMPORARY CARRIER AND FORMING POLYMER LAYER AND CONDUCTIVE LAYER OVER THE DIE
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02/11/2014
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13191386
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07/26/2011
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Pub Dt:
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11/17/2011
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF MOUNTING SEMICONDUCTOR DIE TO OPPOSITE SIDES OF TSV SUBSTRATE
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02/05/2013
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13223478
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09/01/2011
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Publication #:
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12/22/2011
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Title:
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Semiconductor Device and Method of Forming Dam Material Around Periphery of Die to Reduce Warpage
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Patent #:
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12/16/2014
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13231789
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09/13/2011
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Pub Dt:
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01/05/2012
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Title:
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Semiconductor Device and Method of Forming Compliant Stress Relief Buffer Around Large Array WLCSP
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Patent #:
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10/22/2013
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13268091
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10/07/2011
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02/02/2012
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING VERTICALLY OFFSET BOND ON TRACE INTERCONNECTS ON DIFFERENT HEIGHT TRACES
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06/09/2015
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10/28/2011
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03/08/2012
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Title:
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Semiconductor Device and Method of Forming WLP With Semiconductor Die Embedded Within Penetrable Encapsulant Between TSV Interposers
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03/31/2015
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10/28/2011
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02/16/2012
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING WAFER-LEVEL MULTI-ROW ETCHED LEADFRAME WITH BASE LEADS AND EMBEDDED SEMICONDUCTOR DIE
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02/03/2015
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13349510
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01/12/2012
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05/03/2012
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING STEPPED INTERCONNECT LAYER FOR STACKED SEMICONDUCTOR DIE
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11/12/2013
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13349829
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01/13/2012
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05/10/2012
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING PREFABRICATED EMI SHIELDING FRAME WITH CAVITIES CONTAINING PENETRABLE MATERIAL OVER SEMICONDUCTOR DIE
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07/23/2013
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13349919
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01/13/2012
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05/10/2012
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING PREFABRICATED EMI SHIELDING FRAME WITH CAVITIES CONTAINING PENETRABLE MATERIAL OVER SEMICONDUCTOR DIE
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10/09/2012
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13350299
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01/13/2012
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Publication #:
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Pub Dt:
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05/10/2012
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING STEPPED INTERCONNECT LAYER FOR STACKED SEMICONDUCTOR DIE
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06/02/2015
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13420400
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03/14/2012
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Pub Dt:
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07/05/2012
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING OPEN CAVITY IN TSV INTERPOSER TO CONTAIN SEMICONDUCTOR DIE IN WLCSMP
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08/20/2013
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13423832
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03/19/2012
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Pub Dt:
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07/12/2012
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING INTEGRATED PASSIVE DEVICE
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12/02/2014
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13438402
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04/03/2012
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Pub Dt:
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07/26/2012
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Title:
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Semiconductor Device and Method of Forming Column Interconnect Structure to Reduce Wafer Stress
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11/25/2014
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13438463
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04/03/2012
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Publication #:
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Pub Dt:
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07/26/2012
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Title:
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Semiconductor Device and Method of Forming Shielding Layer Around Back Surface and Sides of Semiconductor Wafer Containing IPD Structure
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09/03/2013
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13441691
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04/06/2012
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Pub Dt:
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08/02/2012
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING STUD BUMPS OVER EMBEDDED DIE
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12/09/2014
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13446664
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04/13/2012
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Pub Dt:
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08/09/2012
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Title:
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Semiconductor Device and Method of Forming Sacrificial Protective Layer to Protect Semiconductor Die Edge During Singulation
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10/29/2013
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13458289
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04/27/2012
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Pub Dt:
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08/23/2012
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING MOLD UNDERFILL USING DISPENSING NEEDLE HAVING SAME WIDTH AS SEMICONDUCTOR DIE
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04/07/2015
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13492687
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06/08/2012
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Pub Dt:
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10/04/2012
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING THERMALLY CONDUCTIVE LAYER BETWEEN SEMICONDUCTOR DIE AND BUILD-UP INTERCONNECT STRUCTURE
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10/21/2014
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13536177
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06/28/2012
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10/18/2012
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF EMBEDDING BUMPS FORMED ON SEMICONDUCTOR DIE INTO PENETRABLE ADHESIVE LAYER TO REDUCE DIE SHIFTING DURING ENCAPSULATION
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04/29/2014
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13560008
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07/27/2012
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Pub Dt:
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11/22/2012
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Title:
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Semiconductor Device and Method of Forming Discontinuous ESD Protection Layers Between Semiconductor Die
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08/27/2013
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13570979
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08/09/2012
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12/06/2012
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Title:
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Semiconductor Device and Method of Forming WLCSP Structure using Protruded MLP
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08/19/2014
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13571020
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08/09/2012
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11/29/2012
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING SHIELDING LAYER OVER SEMICONDUCTOR DIE MOUNTED TO TSV INTERPOSER
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03/17/2015
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13571068
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08/09/2012
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Pub Dt:
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11/29/2012
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Title:
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Semiconductor Device and Method of Forming RF Balun having Reduced Capacitive Coupling and High CMRR
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08/06/2013
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13606631
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09/07/2012
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Publication #:
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Pub Dt:
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12/27/2012
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING PARTIALLY-ETCHED CONDUCTIVE LAYER RECESSED WITHIN SUBSTRATE FOR BONDING TO SEMICONDUCTOR DIE
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07/22/2014
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13664626
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10/31/2012
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Pub Dt:
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03/07/2013
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING REPASSIVATION LAYER WITH REDUCED OPENING TO CONTACT PAD OF SEMICONDUCTOR DIE
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06/23/2015
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13683946
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11/21/2012
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Pub Dt:
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05/02/2013
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING CONDUCTIVE POSTS AND HEAT SINK OVER SEMICONDUCTOR DIE USING LEADFRAME
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Issue Dt:
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11/25/2014
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Application #:
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13684055
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Filing Dt:
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11/21/2012
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Publication #:
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Pub Dt:
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03/28/2013
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING DIFFERENT HEIGHT CONDUCTIVE PILLARS TO ELECTRICALLY INTERCONNECT STACKED LATERALLY OFFSET SEMICONDUCTOR DIE
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Patent #:
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Issue Dt:
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08/27/2013
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Application #:
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13691427
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Filing Dt:
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11/30/2012
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Publication #:
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Pub Dt:
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04/11/2013
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Title:
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SEMICONDUCTOR DEVICE INCLUDING BUMP FORMED ON SUBSTRATE TO PREVENT EXTRIMELY-LOW DIELECTRIC CONSTANT (ELK) INTERLAYER DIELECTRIC LAYER (ILD) DELAMINATION DURING REFLOW PROCESS
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Patent #:
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Issue Dt:
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04/22/2014
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Application #:
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13691578
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Filing Dt:
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11/30/2012
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Publication #:
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Pub Dt:
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04/11/2013
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Title:
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Semiconductor Device and Method of Forming Conductive TSV With Insulating Annular Ring
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Patent #:
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Issue Dt:
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01/13/2015
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Application #:
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13714061
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Filing Dt:
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12/13/2012
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Publication #:
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Pub Dt:
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04/25/2013
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING INTERPOSER FRAME ELECTRICALLY CONNECTED TO EMBEDDED SEMICONDUCTOR DIE
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Patent #:
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Issue Dt:
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12/30/2014
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Application #:
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13732150
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Filing Dt:
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12/31/2012
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Publication #:
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Pub Dt:
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05/16/2013
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Title:
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Semiconductor Device and Method of Forming EWLB Package Containing Stacked Semiconductor Die Electrically Connected through Conductive Vias Formed in Encapsulant Around Die
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Patent #:
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Issue Dt:
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05/12/2015
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Application #:
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13760187
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Filing Dt:
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02/06/2013
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Publication #:
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Pub Dt:
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06/13/2013
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING ADJACENT CHANNEL AND DAM MATERIAL AROUND DIE ATTACH AREA OF SUBSTRATE TO CONTROL OUTWARD FLOW OF UNDERFILL MATERIAL
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Patent #:
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Issue Dt:
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11/04/2014
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Application #:
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13766493
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Filing Dt:
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02/13/2013
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Publication #:
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Pub Dt:
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06/13/2013
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING INSULATING LAYER AROUND SEMICONDUCTOR DIE
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Patent #:
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Issue Dt:
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10/21/2014
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Application #:
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13766646
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Filing Dt:
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02/13/2013
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Publication #:
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Pub Dt:
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06/20/2013
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Title:
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LEADFRAME INTERPOSER OVER SEMICONDUCTOR DIE AND TSV SUBSTRATE FOR VERTICAL ELECTRICAL INTERCONNECT
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Patent #:
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Issue Dt:
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04/29/2014
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Application #:
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13768862
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Filing Dt:
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02/15/2013
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Publication #:
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Pub Dt:
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06/20/2013
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING INTERCONNECT STRUCTURE WITH CONDUCTIVE PADS HAVING EXPANDED INTERCONNECT SURFACE AREA FOR ENHANCED INTERCONNECTION PROPERTIES
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Patent #:
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Issue Dt:
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09/16/2014
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Application #:
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13769302
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Filing Dt:
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02/16/2013
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Publication #:
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Pub Dt:
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08/08/2013
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING PRE-MOLDED SUBSTRATE TO REDUCE WARPAGE DURING DIE MOLDING
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Patent #:
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Issue Dt:
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06/24/2014
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Application #:
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13782618
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Filing Dt:
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03/01/2013
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Publication #:
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Pub Dt:
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07/11/2013
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING INSULATING LAYER DISPOSED OVER THE SEMICONDUCTOR DIE FOR STRESS RELIEF
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Patent #:
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Issue Dt:
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12/16/2014
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Application #:
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13846742
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Filing Dt:
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03/18/2013
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Publication #:
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Pub Dt:
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09/05/2013
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING PROTECTIVE COATING OVER INTERCONNECT STRUCTURE TO INHIBIT SURFACE OXIDATION
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Patent #:
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Issue Dt:
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11/25/2014
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Application #:
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13870928
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Filing Dt:
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04/25/2013
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Publication #:
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Pub Dt:
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09/12/2013
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Title:
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Semiconductor Device and Method of Forming Vertically Offset Conductive Pillars Over First Substrate Aligned to Vertically Offset BOT Interconnect Sites Formed Over Second Substrate
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Patent #:
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Issue Dt:
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03/31/2015
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Application #:
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13887180
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Filing Dt:
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05/03/2013
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Publication #:
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Pub Dt:
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09/19/2013
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Title:
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Semiconductor Device and Method of Forming Interposer and Opposing Build-Up Interconnect Structure with Connecting Conductive TMV for Electrical Interconnect of FO-WLCSP
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Patent #:
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Issue Dt:
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02/24/2015
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Application #:
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13893616
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Filing Dt:
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05/14/2013
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Publication #:
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Pub Dt:
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09/26/2013
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Title:
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METHOD OF FORMING RDL WIDER THAN CONTACT PAD ALONG FIRST AXIS AND NARROWER THAN CONTACT PAD ALONG SECOND
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Patent #:
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Issue Dt:
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01/13/2015
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Application #:
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13896635
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Filing Dt:
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05/17/2013
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Publication #:
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Pub Dt:
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09/26/2013
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Title:
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Semiconductor Device and Method of Forming Partially-Etched Conductive Layer Recessed Within Substrate for Bonding to Semiconductor Die
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Patent #:
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Issue Dt:
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11/11/2014
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Application #:
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13906844
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Filing Dt:
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05/31/2013
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Publication #:
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Pub Dt:
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10/10/2013
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Title:
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SEMICONDUCTOR DEVICE WITH BUMP FORMED ON SUBSTRATE TO PREVENT ELK ILD DELAMINATION DURING REFLOW PROCESS
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Patent #:
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Issue Dt:
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07/22/2014
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Application #:
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14020996
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Filing Dt:
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09/09/2013
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Publication #:
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Pub Dt:
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01/02/2014
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING MOLD UNDERFILL USING DISPENSING NEEDLE HAVING SAME WIDTH AS SEMICONDUCTOR DIE
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Patent #:
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Issue Dt:
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11/18/2014
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Application #:
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14021056
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Filing Dt:
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09/09/2013
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Publication #:
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Pub Dt:
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01/09/2014
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Title:
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Semiconductor Device and Method of Forming Interconnect Structure Over Seed Layer on Contact Pad of Semiconductor Die Without Undercutting Seed Layer Beneath Interconnect Structure
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Patent #:
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Issue Dt:
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06/23/2015
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Application #:
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14021914
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Filing Dt:
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09/09/2013
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Publication #:
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Pub Dt:
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01/09/2014
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Title:
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Semiconductor Device and Method of Forming Bump-on-Lead Interconnection
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Patent #:
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Issue Dt:
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03/31/2015
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Application #:
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14043751
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Filing Dt:
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10/01/2013
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Publication #:
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Pub Dt:
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01/30/2014
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Title:
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Semiconductor Device and Method of Forming Vertical Interconnect Structure with Conductive Micro Via Array for 3-D FO-WLCSP
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Patent #:
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Issue Dt:
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07/21/2015
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Application #:
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14274599
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Filing Dt:
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05/09/2014
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Publication #:
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Pub Dt:
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09/04/2014
| | | | |
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING INSULATING LAYER DISPOSED OVER THE SEMICONDUCTOR DIE FOR STRESS RELIEF
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